Sony XDR-S55DAB Service Manual ▷ View online
SERVICE MANUAL
Published by Sony Techno Create Corporation
Sony Corporation
Personal Audio Division
XDR-S55DAB
SPECIFICATIONS
DAB/FM DIGITAL RADIO
9-887-842-02
2007J04-1
©
2007.10
UK Model
Singapore Model
Ver. 1.1 2007.10
Time display
m
e
t
s
y
s
r
u
o
h
-
2
1
K
U
Other countries/regions
24-hour system
Frequency range
Band
Band
Frequency
Channel step
DAB (Band-III)
174.928 - 239.200 MHz
FM
87.5 - 108 MHz
0.05 MHz
DAB (Band-III) frequency table
(MHz)
No.
Channel
Frequency
No.
Channel
Frequency
1
5A
174.928
20
9D
208.064
2
5B
176.640
21
10A
209.936
3
5C
178.352
22
10B
211.648
4
5D
180.064
23
10C
213.360
5
6A
181.936
24
10D
215.072
6
6B
183.648
25
11A
216.928
7
6C
185.360
26
11B
218.640
8
6D
187.072
27
11C
220.352
9
7A
188.928
28
11D
222.064
10
7B
190.640
29
12A
223.936
11
7C
192.352
30
12B
225.648
12
7D
194.064
31
12C
227.360
13
8A
195.936
32
12D
229.072
14
8B
197.648
33
13A
230.784
15
8C
199.360
34
13B
232.496
16
8D
201.072
35
13C
234.208
17
9A
202.928
36
13D
235.776
18
9B
204.640
37
13E
237.488
19
9C
206.352
38
13F
239.200
Speaker:
Approx. 7.7 cm (3.0 inches) dia. 8
Ω
Power output:
0.3 W (at 10 % harmonic distortion)
Output:
J (headphone) jack (ø 3.5 mm, stereo mini jack)
Power requirements:
6 V DC, four LR6 (size AA) alkaline batteries
External power source:
DC IN 6 V
Dimensions:
Approx. 189
× 102.8 × 37.9 mm (w/h/d)
(Approx. 7
1
⁄
2
× 4
1
⁄
8
× 1
1
⁄
2
inches) incl. projecting parts and controls
Mass:
Approx. 486 g (1 lb 1.1 oz ) incl. batteries
Supplied accessories:
AC power adaptor (1)
Design and specifications are subject to change without notice.
XDR-S55DAB
2
1. GENERAL
Location of Controls ....................................................... 3
2. DISASSEMBLY
2-1. Cabinet (Rear) Assy ........................................................ 4
2-2. Chassis Section ............................................................... 5
2-3. Main Board, TU1 ............................................................ 5
2-4. Key Board, Micro Computer Board Sub Assy ............... 6
2-2. Chassis Section ............................................................... 5
2-3. Main Board, TU1 ............................................................ 5
2-4. Key Board, Micro Computer Board Sub Assy ............... 6
3. DIAGRAMS
3-1. Block
Diagram
................................................................ 7
3-2. Circuit Boards Location .................................................. 8
3-3. Printed Wiring Boards -Main Section- ........................... 9
3-4. Printed Wiring Boards -Micon Section- ......................... 10
3-5. Schematic
3-3. Printed Wiring Boards -Main Section- ........................... 9
3-4. Printed Wiring Boards -Micon Section- ......................... 10
3-5. Schematic
Diagram
......................................................... 11
4.
EXPLODED VIEWS
4-1. Rear Cabinet Section ...................................................... 14
4-2. Cabinet (Front) Section ................................................... 15
4-3. Boards
4-2. Cabinet (Front) Section ................................................... 15
4-3. Boards
Section
................................................................ 16
5.
ELECTRICAL PARTS LIST
.............................. 17
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
XDR-S55DAB
3
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
SLEEP
POWER
HOLD
TUNE MOD
AUTO TUNE
PRESET / ENTER
DAB/FM
SC
1
2
3
#&5"
&6301&"/&26*5*&
DSPL
CLOCK
LIGHT
DC IN 6V
POWER
Headphone
jack
jack
VOLUME
PRESET 1, 2, 3
AUTO TUNE
SLEEP
•DAB/FM
SC
TUNE MODE
PRESET/ENTER
6/Vdial
DC IN 6V
HOLD
LIGHT
DISPLAY
CLOCK
• LOCATION OF CONTROLS
XDR-S55DAB
4
SECTION 2
DISASSEMBLY
•
This set can be disassembled in the order shown below.
Note: Follow the disassembly procedure in the numerical order shown below.
2-1. CABINET (REAR) ASSY
2-1. CABINET
(REAR)
ASSY
(Page
4)
2-2. CHASSIS
SECTION
(Page
5)
SET
2-3. MAIN BOARD, TU1
(Page
(Page
5)
2-4. KEY
BOARD,
MICRO COMPUTER BOARD SUB ASSY
(Page
6)
three (+) BV tapping screws
(B 2.6 )
(B 2.6 )
two (+) BV tapping screws
(B 2.6 )
(B 2.6 )
screw
(M 3
(M 3
× 6 lock ace)
ANT1
(telescopic antenna)
(telescopic antenna)
contact plate (ANT)
cabinet (rear) assy
battery lid
cabinet (front) section
claw
claw
claw