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Model
XDR-S50
Pages
20
Size
915.78 KB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
xdr-s50.pdf
Date

Sony XDR-S50 Service Manual ▷ View online

5
XDR-S50
2-3. MAIN BOARD, TU1
2-2. CHASSIS SECTION
2
 arm (jog)
4
 knob (TUNE)
6
 knob (VOL)
5
 spring (jog)
3
 three claws
1
Remove the two solders.
7
 two (+) BV tapping screws
     (B 2.6
 )
8
 chassis section
S610
knob (hold)
cabinet (front) section
1
 two screws
7
Remove the five solders.
2
3
Remove the solder.
5
Remove the ten solders.
6
Remove the three solders.
4
TU1
8
MAIN board
CN1
6
XDR-S50
2-4. KEY BOARD, MICRO COMPUTER BOARD SUB ASSY
2
KEY board
3
 two screws
4
 MICRO COMPUTER board sub assy
1
 three screws
claw
chassis
7
7
XDR-S50
XDR-S50
3-1. BLOCK DIAGRAM
SECTION 3
DIAGRAMS
DAB+3.3V
6
7
3
1
2
49
39
53
54
25
4
75
3
37
40
38
46
76
78
4
2
3
8
5
7
1
9
2
3
5
16
15
17
I
19
21
I
24
33
I
30
10
12
11
XT1
XT2
RESET
INTP4
TXD0
RXD0
MUTE
BEEP
STB
DATA
SCK
INR
INL
ANT
DAB+3.3V
LOUT
ROUT
SI DOUT
SI DIN
3.3V
KS0
I
KS3
KR4
I
KR7
AC CHK
AMP SW
RADIO SW
CPU+3.3V
S601
HOLD
INT1
LIGHT
LCD CONT
LCD CLK
LCD SO
LCD CS
OUTL
OUTR
VCC+6V
VCC
VSS
VDD
VREF
GND
GND
CPU+3.3V
1
2
LCD+3.3V
SWITCH
Q504
D501
LCD
BACK
LIGHT
BACK LIGHT
LED DRIVE
Q502
MUTE
Q101
MUTE
Q201
BACK LIGHT
LED CONTROL
Q503
AMP+B
SWITCH
Q953
AMP CHECK
Q501
AMP CONTROL
SWITCH
Q952
KEY
NETWORK
S501–505,
S601–609
LCD
CONTROL
SWITCH
Q505
VOUT
1
2
VIN
OUT
IN
VOUT
2
1
VIN
OFF
ON
S515
RESET
RV301
VOL
RESET
IC503
TU1
MODULE
(DAB TUNER)
AUDIO AMP
IC301
AUDIO AMP
CONTROL SWITCH
IC302
SYSTEM CONTROL
IC501
LCD501
LIQUID CRYSTAL
DISPLAY PANEL
ANT1
DAB
TELESCOPIC
ANTENNA
VOUT
COM+6V
COM+6V
VCC+6V
CPU+3.3V
CPU+3.3V
CPU+3.3V
VCC+6V
COM+6V
D502
D503
VOLTAGE DETECT
IC502
DAB+3.3V REG
IC952
CPU+3.3V REG
IC951
D951
J901
DC IN 6V
!
DRY BATTERY
SIZE " AA "
(IEC DESIGNATION LR6)
4PCS,6V
VIN
CONT
1
8
2
3
5
RV301-1
RV301-2
J301
SP301
SPEAKER
i
X501
32.768kHz
• Signal Path
: AUDIO
8
8
XDR-S50
XDR-S50
• WAVEFORM
— MICRO COMPUTER BOARD —
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in 
µ
F unless otherwise noted.  (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
A
: B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
   no mark : AUDIO (DAB)
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO (DAB)
• Abbreviation
SP: Singapore model
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
Q
C
These are omitted
E
B
E
These are omitted
C
B
C
These are omitted
B
E
Note: The components identified by mark 
0
 or dotted line
with mark 
0
 are critical for safety.
Replace only with part number specified.
1.4 Vp-p
32.768 kHz
1
  IC501 
qs
 (XT1)
0.5 V/DIV, 20 
µ
sec/DIV
3-2. CIRCUIT BOARDS LOCATION
JACK board
MICRO COMPUTER board
MAIN board
TU1
KEY board
Ver. 1.1
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