Sony TC-WE435 (serv.man2) Service Manual ▷ View online
– 13 –
Bias Consumption Current Adjustment DECK B
This adjustment should be performed when replacing the head assy
or the bias oscillator transformer (T141, T241).
or the bias oscillator transformer (T141, T241).
Setting:
REC LEVEL knob : standard recording position (See page 11.)
REC LEVEL knob : standard recording position (See page 11.)
Procedure:
1. Connect the digital voltmeter to test point TP441.
2. Set RV141 (L-CH), RV241 (R-CH) to mechanical center.
3. Press the
2. Set RV141 (L-CH), RV241 (R-CH) to mechanical center.
3. Press the
· button to playback.
4. Adjust T141 (L-CH), T241 (R-CH) so that the digital voltmeter
reading becomes minimum.
Adjustment Value: Maximum 220 mV
Adjustment Location: MAIN board (See page 14.)
Record Bias Adjustment DECK B
Setting:
REC LEVEL knob : standard record position (See page 11.)
REC LEVEL knob : standard record position (See page 11.)
Procedure:
1. Set to test mode (See page 11.)
2. Insert a tape into deck B, press the REC
1. Set to test mode (See page 11.)
2. Insert a tape into deck B, press the REC
r button and then
press the
· button to start recording.
3. Record Mode
Record Level Adjustment DECK B
Setting:
REC LEVEL knob : standard record position (See page 11.)
REC LEVEL knob : standard record position (See page 11.)
Procedure:
1. Set to test mode (See page 11.)
2. Insert a tspe into deck B, press the REC
1. Set to test mode (See page 11.)
2. Insert a tspe into deck B, press the REC
r button and then
press the
· button to start recording.
3. Record Mode
4. Playback Mode
set
3
2
1
blank tape
CS-413
CS-413
TP441
L-CH
R-CH
digital
voltmeter
voltmeter
LINE IN
no signal
no signal
set
AF OSC
attenuator
10 k
Ω
600
Ω
LINE IN
1) 315 Hz
2) 10 kHz
1) 315 Hz
2) 10 kHz
50 mV (–23.8 dB)
blank tape
CS-123
CS-123
4. Playback Mode
set
recorded
portion
portion
level meter
LINE OUT
47 k
Ω
5. Confirm playback the signal recorded in step 2 become adjust-
ment level as follows.
If the selevels do not adjustment level, adjust the RV141 (L-CH)
and RV241 (R-CH) to repeat steps 3 and 4.
If the selevels do not adjustment level, adjust the RV141 (L-CH)
and RV241 (R-CH) to repeat steps 3 and 4.
Adjustment level:
The palyback output of 10 kHz level difference against 315 Hz ref-
erence should be ± 0.5 dB.
The palyback output of 10 kHz level difference against 315 Hz ref-
erence should be ± 0.5 dB.
Adjustment Location: MAIN board (See page 14.)
set
AF OSC
attenuator
10 k
Ω
600
Ω
LINE IN
blank tape
CS-123
CS-123
315 Hz, 50 mV (–23.8 dB)
set
recorded
portion
portion
level meter
LINE OUT
47 k
Ω
5. Confirm playback the signal recorded in step 2 become adjust-
ment level as follows.
If the selevels do not adjustment level, adjust the RV101 (L-CH)
and RV201 (R-CH) to repeat steps 3 and 4.
If the selevels do not adjustment level, adjust the RV101 (L-CH)
and RV201 (R-CH) to repeat steps 3 and 4.
Adjustment Value:
LINE OUT level : –23.8 ± 0.5 dB (47.2 to 53.0 mV)
Adjustment Location: MAIN board (See page 14.)
– 14 –
Adjustment Location: main board
RV111
PB LEVEL
DECK A (L)
RV211
PB LEVEL
DECK A (R)
RV318
PITCH
CONTROL
(DECK A)
RV317
NORMAL SPEED
(DECK A)
RV316
HIGH SPEED
(DECK A)
100
81
80
80
51
31
1
IC801
50
30
RV417
NORMAL
SPEED
(DECK B)
RV416
HIGH
SPEED
(DECK B)
RV241
REC BIAS
DECK B (R)
RV141
REC BIAS
DECK B (L)
RV201
REC
LEVEL (R)
REC
BIAS
T241
BIAS
CURRENT
DECK B (R)
BIAS CURRENT
DECK B (L)
T141
52
33
32
20
64
1
IC551
19
51
RV101
REC
LEVEL (L)
RV121
PB LEVEL
DECK B (L)
RV221
PB LEVEL
DECK B (R)
TP441
[MAIN board] (Component side)
TC-WE435
– 15 –
– 16 –
WAVEFORMS
– MAIN SECTION (3/4) –
– MAIN SECTION (3/4) –
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
¢
: internal component.
•
1
: fusible resistor.
•
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• b
: Pattern from the side which enables seeing.
• Transistor of “B” and “C” indication is omitted.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltage is dc with respect to ground under no-signal
(detuned) condition.
no mark : STOP
(
no mark : STOP
(
) : REC
<
> : PB
∗
: Can not be measured.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
d
: PB
G
: REC (DECK B)
• Abbreviation
CND : Canadian model.
AUS
AUS
: Australian model.
SP
: Singapore model.
MY
: Malaysia model.
CH
: Chinese model.
• Indication of transistor
C
These are omitted
E
B
1
IC801
#ª
EXTAL
Note:
The components identi-
fied by mark
The components identi-
fied by mark
!
or dotted
line with mark
!
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
!
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
SECTION 6
DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION
TRANS (A) board (
4
E)
(Except SP,MY)
MAIN board
RECVOL board (
4
G)
H.P board (
4
D)
HEAD RELAY (REC/PB) board
(Deck B)
(Deck B)
HEAD RELAY (PB) board
(Deck A)
(Deck A)
LEAF SW (REC/PB) board
(Deck B)
(Deck B)
PANEL board (
4
A)
DIRECTION board (
4
C)
POWER board (
4
F)
LEAF SW (PB) board
(Deck A)
(Deck A)
TRANS (B) board (
4
B)
4.4Vp-p
10MHz
•
4A to 4G are including into the mounted PANEL board.
TC-WE435
6-2. PRINTED WIRING BOARD – MAIN SECTION –
• See page 15 for Circuit Boards Location.
– 17 –
– 18 –
D306
G-10
D307
G-10
D318
G-10
D451
C-2
D601
A-6
D701
B-10
D702
B-10
D703
A-10
D704
A-10
D705
A-10
D706
A-10
D707
B-10
D708
A-7
D709
A-8
D710
B-8
D711
A-8
D712
A-10
D713
B-11
D714
C-10
D715
C-10
D716
B-11
D801
F-6
IC321
D-12
IC421
A-2
IC431
F-2
IC501
D-3
IC502
A-6
IC561
D-9
IC701
A-8
IC801
D-7
IC802
E-6
IC806
G-3
Q101
B-3
Q102
A-5
Q104
C-5
Q201
C-2
Q202
A-4
Q204
E-1
Q301
H-7
Q302
H-7
Q303
H-7
Q306
G-10
Q307
G-10
Q308
G-10
Q311
H-8
Q312
H-8
Q314
H-8
Q316
G-10
Q317
G-10
Q318
G-10
Q371
C-10
Q373
C-10
Q401
H-6
Q402
G-6
Q403
G-6
Q411
G-5
Q412
G-6
Q414
G-5
Q417
F-5
Q441
G-2
Q442
H-2
Q443
H-2
Q451
C-1
Q471
C-8
Q473
C-8
Q501
A-5
Q506
F-3
Q601
A-5
Q701
A-8
Q702
A-8
Q703
A-9
Q704
A-10
Q707
C-10
Q708
C-11
Q801
F-6
• Semiconductor
Location
Ref. No.
Location
(Page
35)
(Page 36)
(Page 39)
(Page 32)
(Page 35)
(Page 36)
(Page 35)
(Page 27)
(Page 28)
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