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Model
STR-DN850
Pages
106
Size
8.35 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
str-dn850.pdf
Date

Sony STR-DN850 Service Manual ▷ View online

STR-DN850
5
1)
 Supports YUV 4:2:0 / 8 bit format only.
2)
 Supports 8 bit format only.
3)
 These formats are also supported by an MHL connection.
MHL section
Supported MHL version
 
Incorporates MHL 2
Maximum current
 900 
mA
iPhone/iPad/iPod section
DC 5V 1.0 A MAX
USB works with iPhone 5s, iPhone 5c, iPhone 5, iPhone 4s, 
iPhone 4, iPhone 3GS, iPhone 3G, iPod touch (2nd through 
5th generation), iPod classic, and iPod nano (3rd through 7th 
generation).
Bluetooth technology works with iPhone 5s, iPhone 5c, iPhone 
5, iPhone 4s, iPhone 4, iPhone 3GS, and iPod touch (4th and 5th 
generation).
AirPlay works with iPhone, iPad, and iPod touch with iOS 4.3.3 
or later, Mac with OS X Mountain Lion, and Mac and PC with 
iTunes 10.2.2 or later.
You can use “SongPal” app with this receiver via Bluetooth or 
network connection.
You can only charge the iPhone/iPod when they are connected to 
the USB port while the receiver is turned on.
DLNA section
Supported format*
 
MP3 (MPEG 1 Audio Layer-3):
 
32 kbps – 320 kbps, VBR
AAC:
 
16 kbps – 320 kbps, CBR, VBR
WMA9 Standard:
 
40 kbps – 320 kbps, CBR, VBR
WAV:
 
32 kHz – 192 kHz, 16 bit PCM
 
32 kHz – 192 kHz, 24 bit PCM
FLAC:
 
44.1 kHz – 192 kHz, 16 bit FLAC
 
44.1 kHz – 192 kHz, 24 bit FLAC
AIFF:
 
32 kHz – 192 kHz, 16 bit PCM
 
32 kHz – 192 kHz, 24 bit PCM
ALAC:
 
32 kHz – 96 kHz, 16 bit ALAC
 
32 kHz – 96 kHz, 24 bit ALAC
*  Compatibility with all encoding/writing software, recording 
devices and recording media cannot be guaranteed.
USB section
Supported format*
 
MP3 (MPEG 1 Audio Layer-3):
 
32 kbps – 320 kbps, VBR
 AAC:
 
16 kbps – 320 kbps, CBR, VBR
WMA9 Standard:
 
40 kbps – 320 kbps, CBR, VBR
WAV:
 
32 kHz – 192 kHz, 16 bit PCM
 
32 kHz – 192 kHz, 24 bit PCM
FLAC:
 
44.1 kHz – 192 kHz, 16 bit FLAC
 
44.1 kHz – 192 kHz, 24 bit FLAC
AIFF:
 
32 kHz – 192 kHz, 16 bit PCM
 
32 kHz – 192 kHz, 24 bit PCM
ALAC:
 
32 kHz – 96 kHz, 16 bit ALAC
 
32 kHz – 96 kHz, 24 bit ALAC
*  Compatibility with all encoding/writing software, recording 
devices and recording media cannot be guaranteed.
Supported USB device
 
Mass Storage Class, High-speed type
Maximum current
 500 
mA
NETWORK section
Ethernet LAN
 10BASE-T/100BASE-TX
Wireless LAN
 Compatible 
standards:
 
IEEE 802.11 b/g
Security:
 
WEP 64 bit, WEP 128 bit, WPA/
 
WPA2-PSK (AES), WPA/WPA2-PSK (TKIP)
Radio frequency:
 2.4 
GHz 
HDMI Video
Input/Output (HDMI Repeater block)
Format
2D
3D
Frame packing
Side-by-Side 
(Half)
Over-Under 
(Top-and-Bottom)
4096 × 2160p @ 59.94/60 Hz
a
1)
4096 × 2160p @ 50 Hz
a
1)
3840 × 2160p @ 59.94/60 Hz
a
1)
3840 × 2160p @ 50 Hz
a
1)
4096 × 2160p @ 23.98/24 Hz
a
2)
3840 × 2160p @ 29.97/30 Hz
a
2)
3840 × 2160p @ 25 Hz
a
2)
3840 × 2160p @ 23.98/24 Hz
a
2)
1920 × 1080p @ 59.94/60 Hz
a
a
a
1920 × 1080p @ 50 Hz
a
a
a
1920 × 1080p @ 29.97/30 Hz
a
3)
a
a
3)
a
3)
1920 × 1080p @ 25 Hz
a
3)
a
a
3)
a
3)
1920 × 1080p @ 23.98/24 Hz
a
3)
a
a
3)
a
3)
1920 × 1080i @ 59.94/60 Hz
a
3)
a
a
3)
a
3)
1920 × 1080i @ 50 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 59.94/60 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 50 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 29.97/30 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 23.98/24 Hz
a
3)
a
a
3)
a
3)
720 × 480p @ 59.94/60 Hz
a
3)
720 × 576p @ 50 Hz
a
3)
640 × 480p @ 59.94/60 Hz
a
3)
Bluetooth section
Communication system
 
Bluetooth Specifi cation version 3.0
Output
 
Bluetooth Specifi cation Power Class 2
Maximum communication range
 
Line of sight approx. 10 m (33 feet)
1)
Frequency band
 
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
 
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profi les
2)
 
A2DP (Advanced Audio Distribution Profi le)
 
AVRCP 1.3 (Audio Video Remote Control Profi le)
Supported Codecs
3)
 SBC
4)
, AAC, aptX
Transmission range (A2DP)
 
20 Hz – 20,000 Hz (Sampling frequency 44.1 kHz)
1) 
The actual range will vary depending on factors such as 
obstacles between devices, magnetic fi elds around a microwave 
oven, static electricity, cordless phone, reception sensitivity, 
antenna’s performance, operating system, software application, 
etc.
2) 
Bluetooth standard profi les indicate the purpose of Bluetooth 
communication between devices.
3) 
Codec: Audio signal compression and conversion format
4) 
Subband Codec
General
Power requirements
Area
Power requirements
US, CND, TW
120 V AC, 60 Hz
AUS
230 V AC, 50 Hz
AEP, UK
230 V AC, 50/60 Hz
Power consumption
 240 
W
Power consumption (during standby mode)
STR-DN850:
 
 0.3 W (When [Control for HDMI], [Pass Through], [Net-
work Standby], and [Bluetooth Standby] are set to [Off].) 
0.5 W (When [Control for HDMI] is set to [On], [Pass 
Through], [Network Standby], and [Bluetooth Standby] are 
set to [Off].)
1.0 W (When [Control for HDMI] and [Bluetooth Standby] 
are set to [On], [Pass Through] and [Network Standby] are 
set to [Off].)
Dimensions (width/height/depth) (Approx.)
STR-DN850:
 
430 mm × 156 mm × 329.4 mm
 
(17 in × 6 1/4 in × 13 in) (US, CND, AUS, TW)
 
 430 mm × 156 mm × 329.4 mm (AEP, UK) including 
projecting parts and controls
Mass (Approx.)
STR-DN850:
 
8.0 kg (17 lb 11 oz)
Supplied accessories
•  Startup Guide (1)
•  Reference Guide (1)
•  Remote control (1) 
•  R03 (size AAA) batteries (2)
•  FM wire antenna (aerial) (1)
•  AM loop antenna (aerial) (1)
•  Optimizer microphone (1)
Design and specifi cations are subject to change without notice.
 
Abbreviation
 AUS  : 
Australian 
model
 
CND 
: Canadian model
 TW 
Taiwan 
model
Ver. 1.2
STR-DN850
6
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be damaged
by heat.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT  
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.
STR-DN850
7
1. 
SERVICING  NOTES
  .............................................   8
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................  17
2-2.   Case (Entry) ....................................................................   17
2-3.  Front Panel Section .........................................................   18
2-4.  DIGITAL Board, NETWORK Board .............................   19
2-5.  Back Panel Section .........................................................   19
2-6.  STANDBY Board, MAIN Board Section .......................   20
2-7. MAIN 
Board 
...................................................................  20
3. 
TEST  MODE 
 ............................................................   21
4. 
FM  TUNER  CHECK 
 .............................................   24
5. DIAGRAMS
5-1.  Block Diagram - ANALOG AUDIO Section - ...............   25
5-2.  Block Diagram - DIGITAL Section -..............................   26
5-3.  Block Diagram - AMP Section - .....................................   27
5-4.  Block Diagram - ANALOG VIDEO/USB Section - ......   28
5-5.  Block Diagram - DIGITAL VIDEO Section - ................   29
5-6.  Block Diagram - DISPLAY/POWER Section - ..............   30
5-7. Printed 
Wiring 
Board 
- DIGITAL Board (Component side) -............................   32
5-8. Printed 
Wiring 
Board 
- DIGITAL Board (Conductor side) - .............................   33
5-9.  Schematic Diagram - DIGITAL Board (1/9) - ................   34
5-10.  Schematic Diagram - DIGITAL Board (2/9) - ................   35
5-11.  Schematic Diagram - DIGITAL Board (3/9) - ................   36
5-12.  Schematic Diagram - DIGITAL Board (4/9) - ................   37
5-13.  Schematic Diagram - DIGITAL Board (5/9) - ................   38
5-14.  Schematic Diagram - DIGITAL Board (6/9) - ................   39
5-15.  Schematic Diagram - DIGITAL Board (7/9) - ................   40
5-16.  Schematic Diagram - DIGITAL Board (8/9) - ................   41
5-17.  Schematic Diagram - DIGITAL Board (9/9) - ................   42
5-18. Printed Wiring Board 
- MAIN Board (Component side) - .................................   43
5-19. Printed Wiring Board 
- MAIN Board (Conductor side) - ..................................   44
5-20.  Schematic Diagram - MAIN Board (1/4) - .....................   45
5-21.  Schematic Diagram - MAIN Board (2/4) - .....................   46
5-22.  Schematic Diagram - MAIN Board (3/4) - .....................   47
5-23.  Schematic Diagram - MAIN Board (4/4) - .....................   48
5-24.  Printed Wiring Boards - PANEL Section - .....................   49
5-25.  Schematic Diagram - PANEL Section - ..........................   50
5-26.  Printed Wiring Board - DCDC Board - ..........................   51
5-27.  Schematic Diagram - DCDC Board - .............................   52
TABLE  OF  CONTENTS
5-28.  Printed Wiring Board - STANDBY Board - ...................   53
5-29.  Schematic Diagram - STANDBY Board - ......................   54
5-30.  Printed Wiring Board - FRONT JACK Board - ..............   55
5-31.  Schematic Diagram - FRONT JACK Board - ................   55
5-32.  Printed Wiring Board - TUNER1 Board - ......................   55
5-33.  Schematic Diagram - TUNER1 Board - .........................   56
5-34.  Printed Wiring Board - POWER KEY Board -...............   57
5-35.  Schematic Diagram - POWER KEY Board - .................   57
5-36.  Printed Wiring Board - HEADPHONE Board - .............   58
5-37.  Schematic Diagram - HEADPHONE Board - ................   58
6. 
EXPLODED  VIEWS
6-1.  Case (Entry) Section .......................................................   77
6-2.  Front Panel Section .........................................................   78
6-3. DIGITAL 
Board 
..............................................................  79
6-4.  Back Panel Section .........................................................   80
6-5. Chassis 
Section 
...............................................................  81
7. 
ELECTRICAL  PARTS  LIST
  ..............................   82
STR-DN850
8
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the 
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed 
with the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTE  OF  REPLACING  THE  IC2104,  IC2115,  IC2500, 
IC2502,  IC3004,  IC3200,  IC3202,  IC3203,  IC3209,  
IC3210,  IC3506,  IC7000  OR  IC7001  ON  THE  DIGITAL  
BOARD
IC2104, IC2115, IC2500, IC2502, IC3004, IC3200, IC3202, 
IC3203, IC3209, IC3210, IC3506, IC7000 or IC7001 on the 
DIGITAL board cannot exchange with single. When these 
parts on the DIGITAL board are damaged, exchange the entire 
mounted board.
NOTE  OF  REPLACING  THE  IC902  ON  THE  STANDBY 
BOARD
IC902 on the STANDBY board cannot exchange with single. 
When this part on the STANDBY board is damaged, exchange 
the entire mounted board.
MODEL IDENTIFICATION
–BACK PANEL–
Model
Part No.
US, Canadian
4-487-927-0[]
AEP, UK
4-487-927-1[]
Australian
4-487-927-2[]
Taiwan
4-487-927-3[]
NOTE  OF  REPLACING  THE  Q550,  Q551,  Q600,  Q601,  
Q650,  Q651,  Q700,  Q701,  Q750,  Q751,  Q800,  Q801, 
Q850  AND  Q851  ON  THE  MAIN  BOARD
Replacement of Q550, Q551, Q600, Q601, Q650, Q651, Q700, 
Q701, Q750, Q751, Q800, Q801, Q850 and Q851 on the MAIN 
board used in this unit requires L type screw driver.
L type screw driver
(e.g Compact 90 degree right
angled ratchet screwdriver (dr-05))
Part No.
Ver. 1.2
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