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2011D80-1

© 

2011.04

POWER OUTPUT AND TOTAL HARMONIC DISTORTION: 
(Models of area code US only)
With 8 ohm loads, both channels driven, from 20 – 20,000 Hz; rated 
95 watts per channel minimum RMS power, with no more than 0.09% 
total harmonic distortion from 250 milliwatts to rated output.

Amplifi er section
Models of area code US

1)

Minimum RMS Output Power (8 ohms, 20 Hz – 20 kHz, THD 0.09%) 

95 W + 95 W

Stereo Mode Output Power (8 ohms, 1 kHz, THD 1%) 

105 W + 105 W

Surround Mode Output Power

2)

 (8 ohms, 1 kHz, THD 10%)

140 W per channel

Models of area code CND

1)

Minimum RMS Output Power (8 ohms, 20 Hz – 20 kHz, THD 0.09%) 

85 W + 85 W

Stereo Mode Output Power (8 ohms, 1 kHz, THD 1%) 

105 W + 105 W

Surround Mode Output Power

2)

 (8 ohms, 1 kHz, THD 10%)

140 W per channel

Models of area code AUS, SAF, TW

1)

Minimum RMS Output Power
(8 ohms, 20 Hz – 20 kHz, THD 0.09%)
 

85 W + 85 W

Stereo Mode Output Power
(8 ohms, 1 kHz, THD 1%)
 

100 W + 100 W

Surround Mode Output Power

2)

(8 ohms, 1 kHz, THD 10%)
 

140 W per channel

1)

  Measured under the following conditions:

US, CND

120 V AC, 60 Hz

AUS, SAF

230 V AC, 50 Hz

TW

110 V AC, 60 Hz

2)

  Reference power output for front, center, surround, surround back and 

front high speakers. Depending on the sound fi eld settings and the 
source, there may be no sound output.

Frequency response
 Analog 

10 Hz – 70 kHz, +0.5/–2 dB (with sound fi eld and 
equalizer bypassed)

Input
 Analog 

Sensitivity: 500 mV/ 50 kohms S/N

3)

: 96 dB

(A, 500 mV

4)

)

  Digital (Coaxial) 

Impedance: 75 ohms S/N: 100 dB (A, 20 kHz LPF)

  Digital (Optical) 

S/N: 100 dB (A, 20 kHz LPF)

Output (Analog)
  AUDIO OUT 

Voltage: 500 mV/ 10 kohms

  SUBWOOFER 

Voltage: 2 V/1 kohm

Equalizer
  Gain levels 

±6 dB, 1 dB step

3)

  INPUT SHORT (with sound fi eld and equalizer bypassed).

4)

  Weighted network, input level.

– Continued on next page –

This receiver incorporates Dolby* Digital and Pro Logic Surround and the 
DTS** Digital Surround System.

*  Manufactured under license from Dolby Laboratories. Dolby, Pro Logic, 

and the double-D symbol are trademarks of Dolby Laboratories.

**  Manufactured under license under U.S. Patent #’s: 5,451,942; 

5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,212,872; 
7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide patents 
issued & pending. DTS is a registered trademark and the DTS logos, 
Symbol, DTS-HD and DTS-HD Master Audio are trademarks of DTS, 
Inc. © 1996-2008 DTS, Inc. All Rights Reserved.

This receiver incorporates High-Defi nition Multimedia Interface 
(HDMI™) technology. HDMI, the HDMI Logo, and High-Defi nition 
Multimedia Interface are trademarks or registered trademarks of HDMI 
Licensing LLC in the United States and other countries.

“x.v.Color (x.v.Colour)” and “x.v.Color (x.v.Colour)” logo are trademarks 
of Sony Corporation.

“BRAVIA” is a trademark of Sony Corporation.

“S-AIR” and its logo are trademarks of Sony Corporation.

“PLAYSTATION” is a trademark of Sony Computer Entertainment Inc.

FM tuner section
Tuning range 

87.5 MHz – 108.0 MHz

Antenna (aerial) 

FM wire antenna (aerial)

Antenna (aerial) terminals  75 ohms, unbalanced
Intermediate frequency 

10.7 MHz

AM tuner section
Tuning range

10 kHz step  9 kHz step

US, CND

530 kHz – 

531 kHz –

1,710 kHz 

1,710 kHz

AUS, SAF, TW

– 

531 kHz –

 

1,602 kHz

Antenna (aerial) 

Loop antenna (aerial)

Intermediate frequency 

450 kHz

Video section
Inputs/Outputs
  Video: 

1 Vp-p/75 ohms

  COMPONENT VIDEO:

Y: 1 Vp-p, 75 ohms
P

B

/C

B

: 0.7 Vp-p, 75 ohms

P

R

/C

R

: 0.7 Vp-p, 75 ohms

80 MHz HD Pass Through

General
Power requirements

US, CND

120 V AC, 60 Hz

AUS

230 V AC, 50 Hz

SAF

230 V AC, 50/60 Hz

TW

110 V AC, 60 Hz

Power output (DIGITAL MEDIA PORT)
  DC OUT: 

5 V, 0.7 A MAX

Power consumption

US, CND, AUS, 
SAF, TW

240 W

Dimensions (width/height/depth) (Approx.)

17 in × 6 1/4 in × 12 3/4 in (430 mm × 157.5 mm × 
322 mm) including projecting parts and controls

Mass (Approx.) 

17 lb 11 oz (8.0 kg)

Supplied accessories
• 

Operating Instructions

• 

Quick Setup Guide

• 

FM wire antenna (aerial) (1)

• 

AM loop antenna (aerial) (1)

• 

Remote commander (1)

–  RM-AAU073 (Models of area code US, CND only)
–  RM-AAU075 (Models of area code AUS, SAF, TW only)

• 

R6 (size-AA) batteries (2)

• 

Optimizer microphone (ECM-AC2) (1)

Design and specifi cations are subject to change without notice.

•  Standby power consumption: 0.3 W
•  Halogenated flame retardants are not used in the certain printed 

wiring boards.

• Abbreviation

AUS  : Australian model
CND : Canadian model
SAF : South African model
TW  : Taiwan model

US

4-164-232-0[]

Canadian

4-164-232-1[]

Australian

4-164-232-2[]

Taiwan

4-164-232-4[]

South African

4-164-232-6[]

Notes on chip component replacement
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with  
 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.

 

Caution: The printed pattern (copper foil) may peel away if  
 

the heated tip is applied for too long, so be careful!

• 

Strong viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Special Component Notice
The components identifi ed by mark 

9 contain confi dential infor-

mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.

Notice pour composants spéciaux
Les composants identifi és par la marque 

9 contiennent des infor-

mations confi dentielles.
Suivre scrupuleusement les instructions chaque fois qu’un com-
posant est remplacé et / ou réparé.

NOTE OF REPLACING THE IC2022 ON THE DIGITAL 
BOARD
IC2022 on the DIGITAL board cannot exchange with single. When 
this part on the DIGITAL board is damaged, exchange the entire 
mounted board.

NOTE OF REPLACING THE IC3500 AND IC3501 ON 
THE HDMI PC BOARD
IC3500 and IC3501 on the HDMI PC board cannot exchange with 
single. When these parts on the HDMI PC board are damaged,
exchange the entire mounted board.

SAFETY CHECK-OUT (US MODEL)
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

Ω

μF

0 OR DOTTED LINE  

0 ON THE SCHEMATIC DIAGRAMS AND IN 

0 SUR 

1-1.  Case ..................................................................................... 5
1-2.  Back Panel Section ............................................................  6
1-3.  Front Panel Section ............................................................. 6
1-4.  DIGITAL Board .................................................................  7
1-5.  MAIN Board Section .......................................................... 8

 ..................................................................... 9

 .................................................... 12

4-1.  Block Diagram – DIGITAL CONN, SAIR Section – ....... 13
4-2.  Block Diagram – DIGITAL (1/2) Section – ..................... 14
4-3.  Block Diagram – DIGITAL (2/2) Section – ..................... 15
4-4.  Block Diagram – MAIN, HEADPHONE Section – ......... 16
4-5.  Block Diagram – DISPLAY Section – ............................. 17
4-6.  Block Diagram – POWER KEY Section – ....................... 18
4-7.  Block Diagram – HDMI PC Section – ............................. 19
4-8.  Block Diagram – DSP Section – ....................................... 20
4-9.  Block Diagram – VIDEO STANDBY Section – .............. 21
4-10.  Printed Wiring Board – MAIN Board – ............................ 23
4-11.  Schematic Diagram – MAIN Board (1/4) – ...................... 24
4-12.  Schematic Diagram – MAIN Board (2/4) – ...................... 25
4-13.  Schematic Diagram – MAIN Board (3/4) – ...................... 26
4-14.  Schematic Diagram – MAIN Board (4/4) – ...................... 27
4-15.  Printed Wiring Board – VIDEO STANDBY Board – ....... 28
4-16.  Schematic Diagram – VIDEO STANDBY Board – ......... 29
4-17.  Printed Wiring Board – HDMI PC Board (1/2) – ............. 30
4-18.  Printed Wiring Board – HDMI PC Board (2/2) – ............. 31
4-19.  Schematic Diagram – HDMI PC Board (1/2) – ................ 32
4-20.  Schematic Diagram – HDMI PC Board (2/2) – ................ 33
4-21.  Printed Wiring Board – DSP Board – ............................... 34
4-22.  Schematic Diagram – DSP Board – .................................. 35
4-23.  Printed Wiring Board – DISPLAY Board – ...................... 36
4-24.  Schematic Diagram – DISPLAY Board – ......................... 37
4-25.  Printed Wiring Board – DIGITAL Board (1/2) – .............. 38
4-26.  Printed Wiring Board – DIGITAL Board (2/2) – .............. 39
4-27.  Schematic Diagram – DIGITAL Board (1/4) – ................ 40
4-28.  Schematic Diagram – DIGITAL Board (2/4) – ................ 41
4-29.  Schematic Diagram – DIGITAL Board (3/4) – ................ 42
4-30.  Schematic Diagram – DIGITAL Board (4/4) – ................ 43
4-31.  Printed Wiring Boards 

– TEMP-SENSOR, CONNECTION Section – ................ 44

4-32.  Schematic Diagram 

– TEMP-SENSOR, CONNECTION Section – ................ 44

4-33.  Printed Wiring Boards 

– HEADPHONE, POWER KEY Section –  ...................... 45

4-34.  Schematic Diagram 

– HEADPHONE, POWER KEY Section –  ...................... 45

4-35.  Printed Wiring Boards – DIGITAL CONN,

DIGITAL SUPPLY CONN PC Section –  ......................... 46

4-36.  Schematic Diagram – DIGITAL CONN,

DIGITAL SUPPLY CONN PC Section – ......................... 46

4-37.  Printed Wiring Board – SAIR Board – ............................. 47
4-38.  Schematic Diagram – SAIR Board – ................................ 47

5-1.  Case  Section ...................................................................... 60
5-2.  Front Panel Section ........................................................... 61
5-3.  Back Panel Section ........................................................... 62
5-4.  Chassis Section ................................................................. 63

 ..................................... 64