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2009J08-1

© 

2009.10

POWER OUTPUT AND TOTAL HARMONIC DISTORTION: 
(Models of area code US only)
With 8 ohm loads, both channels driven, from 20 – 20,000 Hz; rated 95 
watts per channel minimum RMS power, with no more than 0.09% total 
harmonic distortion from 250 milliwatts to rated output.

Amplifi er section
Models of area code US, CND

1)

Minimum RMS Output Power (8 ohms, 20 Hz – 20 kHz, THD 0.09%) 

95 W + 95 W

Stereo Mode Output Power (8 ohms, 1 kHz,  THD 1%) 

105 W + 105 W

Surround Mode Output Power

2)

 (8 ohms, 1 kHz, THD 10%)

140 W/ch

Models of area code AEP, UK, AUS

3)

Minimum RMS Output Power (8 ohms, 20 Hz – 20 kHz, THD 0.09%) 

85 W + 85 W

Stereo Mode Output Power (8 ohms, 1 kHz, THD 1%) 

100 W + 100 W

Surround Mode Output Power

2)

 (8 ohms, 1 kHz, THD 10%)

140 W/ch

1)

 Measured under the following conditions:

US, CND

120 V AC, 60 Hz

2)

  Reference power output for front, center, surround and surround back 

speakers. Depending on the sound fi eld settings and the source, there 
may be no sound output.

3)

  Measured under the following conditions:

AEP, UK, AUS

230 V AC, 50 Hz

Frequency response
  Analog 

10 Hz – 70 kHz +0.5/–2 dB (with sound fi eld and 
equalizer bypassed)

Inputs
  Analog 

Sensitivity: 500 mV/ 50 kohms S/N

4)

): 96 dB 

(A, 500 mV

5)

)

  Digital (Coaxial) 

Impedance: 75 ohms S/N: 100 dB  (A, 20 kHz 
LPF)

  Digital (Optical) 

S/N: 100 dB (A, 20 kHz LPF)

Outputs (Analog) 
  AUDIO OUT 

Voltage: 500 mV/ 10 kohms

  SUBWOOFER 

Voltage: 2 V/1 kohm

Equalizer
  Gain levels 

±6 dB, 1 dB step

4)

 INPUT SHORT (with sound fi eld and equalizer bypassed).

5)

 Weighted network, input level.

This receiver incorporates Dolby* Digital and Pro Logic Surround and the 
DTS** Digital Surround System.

*  Manufactured under license from Dolby Laboratories. Dolby, Pro Logic, 

and the double-D symbol are trademarks of Dolby Laboratories.

**  Manufactured under license under U.S. Patent #’s: 5,451,942; 

5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,003,467; 
7,212,872 & other U.S. and worldwide patents issued & pending. 
DTS, DTS Digital Surround, ES, and Neo:6 are registered trademarks 
and the DTS logos, Symbol and DTS 96/24 are trademarks of DTS, 
Inc. © 1996-2008 DTS, Inc. All Rights Reserved.

This receiver incorporates High-Defi nition Multimedia Interface 
(HDMITM) technology. HDMI, the HDMI logo and High-Defi nition 
Multimedia Interface are trademarks or registered trademarks of HDMI 
Licensing LLC.

SIRIUS, XM and all related marks and logos are trademarks of Sirius XM 
Radio Inc. and its subsidiaries. All rights reserved.
(Models of area code US only)

“x.v.Color (x.v.Colour)” and “x.v.Color (x.v.Colour)” logo are trademarks 
of Sony Corporation.

“BRAVIA” is a trademark of Sony Corporation.

“S-AIR” and its logo are trademarks of Sony Corporation.

FM tuner section
Tuning range 

87.5 – 108.0 MHz

Antenna 

FM wire antenna

Antenna terminals 

75 ohms, unbalanced

Intermediate frequency 

10.7 MHz

AM tuner section
Tuning range

10 kHz step  9 kHz step

US, CND

530 – 

531 –

1,710 kHz  1,710 kHz

AEP, UK, AUS

– 

531 –

 1,602 

kHz

Antenna Loop 

antenna

Intermediate frequency 

450 kHz

Video section
Inputs/Outputs
 Video: 

1 Vp-p/75 ohms

 COMPONENT VIDEO:

Y: 1 Vp-p/75 ohms
P

B

/C

B

: 0.7 Vp-p/75 ohms

P

R

/C

R

: 0.7 Vp-p/75 ohms

80 MHz HD Pass Through

General
Power requirements

US, CND

120 V AC, 60 Hz

AEP, UK, AUS

230 V AC, 50/60 Hz

Power output (DIGITAL MEDIA PORT)
  DC OUT: 

5 V, 0.7 A MAX

Power requirements

US, CND

240 W

AEP, UK, AUS

240 W

Power consumption (during standby mode)

0.3 W (when “CONTROL FOR HDMI” in HDMI-
menu is set to “CTRL OFF” and “STANDBY” in 
S-AIR menu is set to “STBY OFF”)

Dimensions (w/h/d) (Approx.)

17 × 6 1/4 × 12 3/4 inches (430 × 157.5 × 322 mm) 
including projecting parts and controls

Mass (Approx.) 

17 lb 11 oz (8.0 kg) (US, CND)
8.0 kg (AEP, UK, AUS)

Supplied accessories
Operating instructions (this manual)
Quick Setup Guide (1)
FM wire antenna (aerial) (1)
AM loop antenna (aerial) (1)
RM-AAU021 Remote Commander (1)
R6 (size-AA) batteries (2)
Optimizer microphone (ECM-AC2 or  ECM-AC2a) (1)

Design and specifi cations are subject to change without notice.
• Abbreviation
  CND  : Canadian model
 AUS  : 

Australian 

model

US

4-125-746-0[]

Canadian

4-125-746-1[]

AEP, UK

4-125-746-2[]

Australian

4-125-742-7[]

SAFETY  CHECK-OUT (US MODEL)
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or 

RCA WT-540A. Follow the manufacturers’ instructions to use 
these instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are 
examples of a passive VOM that is suitable. Nearly all battery 
operated digital multimeters that have a 2 V AC range are 
suitable.  (See Fig. A)

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  0 
SUR  LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  
DES  PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  
FONCTIONNEMENT.  NE  REMPLACER  CES  COM-  POSANTS  
QUE  PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  
DONNÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉ-
MENTS  PUBLIÉS  PAR  SONY.

Ω

μF

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Notes on chip component replacement
• 

Never reuse a disconnected chip component.

•  Notice that the minus side of a tantalum capacitor may be 

damaged by heat.

Special Component Notice
The components identifi ed by mark 

9 contain confi dential infor-

mation.
Strictly follow the instructions whenever the components are re-
paired and/or replaced.

Notice pour composants spéciaux
Les composants identifi és par la marque 

9 contiennent des infor-

mations confi dentielles.
Suivre scrupuleusement les instructions chaque fois qu’un com-
posant est remplacé et / ou réparé.

 

Description and location of parts (US, Canadian model) ... 5

 

Description and location of parts (AEP, UK model) .......... 7

2-1. Case 

................................................................................... 10

2-2.  Back Panel Section ..........................................................  11
2-3. STANDBY 

Board 

............................................................. 11

2-4.  Front Panel Section ..........................................................  12
2-5. DIGITAL 

Board 

................................................................ 12

2-6. MAIN 

Board 

Section 

........................................................ 13

 .................................................................... 14

 ...................................................... 16

5-1.  Block Diagram – Themal Sensor/S-Air Section – ............ 17
5-2.  Block Diagram – Digital (1/2) Section – .......................... 18
5-3.  Block Diagram – Digital (2/2) Section – .......................... 19
5-4.  Block Diagram – Main Section – ..................................... 20
5-5.  Block Diagram – Display Section – ................................. 21
5-6.  Block Diagram – HDMI RE Section – ............................. 22
5-7.  Block Diagram – Standby Section – ................................. 23
5-8.  Block Diagram – Connection Section – ........................... 24
5-9.  Block Diagram – Video Section – ..................................... 25
5-10.  Printed Wiring Boards — Main Board — ........................ 27
5-11.  Schematic Diagram – Main Board (1/4) – ........................ 28
5-12.  Schematic Diagram – Main Section (2/4) – ...................... 29
5-13.  Schematic Diagram – Main Section (3/4) – ...................... 30
5-14.  Schematic Diagram – Main Section (4/4) – ...................... 31
5-15.  Printed Wiring Board – Video Board – ............................. 32
5-16.  Schematic Diagram – Video Board – ................................ 33
5-17.  Printed Wiring Boards – HDMI RE Board (1/2) – ........... 34
5-18.  Printed Wiring Boards – HDMI RE Board (2/2) – ........... 35
5-19.  Schematic Diagram – HDMI RE Board (1/2) – ............... 36
5-20.  Schematic Diagram – HDMI RE Board (2/2) – ............... 37
5-21.  Printed Wiring Board – Standby DCDC Board – ............. 38
5-22.  Schematic Diagram – Standby DCDC Board – ................ 39
5-23.  Printed Wiring Board – Display Board – .......................... 40
5-24.  Schematic Diagram – Display Board – ............................. 41
5-25.  Printed Wiring Boards – Digital Board (1/2) – ................. 42
5-26.  Printed Wiring Boards – Digital Board (2/2) – ................. 43
5-27.  Schematic Diagram – Digital Board (1/4) – ..................... 44
5-28.  Schematic Diagram – Digital Board (2/4) – ..................... 45
5-29.  Schematic Diagram – Digital Board (3/4) – ..................... 46
5-30.  Schematic Diagram – Digital Board (4/4) – ..................... 47
5-31.  Printed Wiring Board – Connection Board – .................... 48
5-32.  Schematic Diagram – Connection Board – ....................... 49
5-33.  Printed Wiring Boards – Headphone Board –................... 50
5-34.  Schematic Diagram – Headphone Board – ....................... 50
5-35.  Printed Wiring Boards – Power Key Board – ................... 51
5-36.  Schematic Diagram – Power Key Board – ....................... 51
5-37.  Printed Wiring Boards – S-AIR Board – .......................... 52
5-38.  Schematic Diagram – S-AIR Board – ............................... 52
5-39.  Printed Wiring Boards – Thermal Sensor Board – ........... 53
5-40.  Schematic Diagram – Thermal Sensor Board – ................ 53

6-1. Case 

Section 

...................................................................... 75

6-2. Front 

Panel 

Section 

........................................................... 76

6-3. Back 

Panel 

Section 

........................................................... 77

6-4. Chassis 

Section 

................................................................. 78

 ....................................... 79