Sony STR-DH550 / STR-DH750 Service Manual ▷ View online
STR-DH550/DH750
2
1)
Supports YUV 4:2:0 / 8 bit format only.
2)
Supports 8 bit format only.
3)
These formats are also supported by an MHL connection.
MHL section
Supported MHL version
Supported MHL version
Incorporates MHL 2
Maximum current
900
900
mA
iPhone/iPod section
DC 5V 1.0 A MAX
DC 5V 1.0 A MAX
USB works with iPhone 5s, iPhone 5c, iPhone 5, iPhone 4s,
iPhone 4, iPhone 3GS, iPhone 3G, iPod touch (2nd through
5th generation), iPod classic, and iPod nano (3rd through 7th
generation).
iPhone 4, iPhone 3GS, iPhone 3G, iPod touch (2nd through
5th generation), iPod classic, and iPod nano (3rd through 7th
generation).
Bluetooth technology works with iPhone 5s, iPhone 5c, iPhone
5, iPhone 4s, iPhone 4, iPhone 3GS, and iPod touch (4th and 5th
generation).
5, iPhone 4s, iPhone 4, iPhone 3GS, and iPod touch (4th and 5th
generation).
You can use “SongPal” app with this receiver via Bluetooth.
USB section
Supported format*
Supported format*
MP3 (MPEG 1 Audio Layer-3):
32 kbps – 320 kbps, VBR
WMA:
48 kbps – 192 kbps
AAC:
48 kbps – 320 kbps
WAV:
8 kHz – 48 kHz, 16 bit PCM
* Compatibility with all encoding/writing software, recording
devices and recording media cannot be guaranteed.
devices and recording media cannot be guaranteed.
Transfer speed
Full-speed
Supported USB device
Full-speed
Supported USB device
Mass Storage Class
Maximum current
500
500
mA
Bluetooth section
Communication system
Communication system
Bluetooth Specification version 3.0
Output
Bluetooth Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m (33 feet)
1)
Frequency band
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
A2DP (Advanced Audio Distribution Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)
Supported Codecs
3)
SBC
4)
, AAC, aptX
Transmission range (A2DP)
20 Hz – 20,000 Hz (Sampling frequency 44.1 kHz)
1)
The actual range will vary depending on factors such as
obstacles between devices, magnetic fields around a microwave
oven, static electricity, cordless phone, reception sensitivity,
antenna’s performance, operating system, software application,
etc.
obstacles between devices, magnetic fields around a microwave
oven, static electricity, cordless phone, reception sensitivity,
antenna’s performance, operating system, software application,
etc.
2)
Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.
communication between devices.
3)
Codec: Audio signal compression and conversion format
4)
Subband Codec
General
Power requirements
Power requirements
Area
Power requirements
US, CND, TW
120 V AC, 60 Hz
MX
127 V AC, 60 Hz
AUS
230 V AC, 50 Hz
AEP, UK, E12
230 V AC, 50/60 Hz
BR
127/220 V AC, 60 Hz
E12
220 V – 240 V AC, 50/60 Hz
Power consumption
240 W (Except DH550 : AEP, UK, US, CND, AUS, E12)
200 W (DH550 : AEP, UK, US, CND, AUS, E12)
Power consumption (during standby mode)
0.3 W (When “Control for HDMI”, “Pass Through” and
“Bluetooth Standby” are set to “Off”.)
0.5 W (When “Control for HDMI” is set to “On”, “Pass
Through” and “Bluetooth Standby” are set to “Off”.)
Dimensions (width/height/depth) (Approx.)
430 mm × 156 mm × 329.4 mm
(17 in × 6 1/4 in × 13 in) including projecting parts and
controls
Mass (Approx.)
E12 model:
Mass (Approx.)
E12 model:
8.0kg (17 lb 11 oz)
Other models:
7.6kg (16 lb 13 oz)
Design and specifications are subject to change without notice.
HDMI Video
Input/Output (HDMI Repeater block)
Format
2D
3D
Frame packing
Side-by-Side
(Half)
Over-Under
(Top-and-Bottom)
4096 × 2160p @ 59.94/60 Hz
a
1)
–
–
–
4096 × 2160p @ 50 Hz
a
1)
–
–
–
3840 × 2160p @ 59.94/60 Hz
a
1)
–
–
–
3840 × 2160p @ 50 Hz
a
1)
–
–
–
4096 × 2160p @ 23.98/24 Hz
a
2)
–
–
–
3840 × 2160p @ 29.97/30 Hz
a
2)
–
–
–
3840 × 2160p @ 25 Hz
a
2)
–
–
–
3840 × 2160p @ 23.98/24 Hz
a
2)
–
–
–
1920 × 1080p @ 59.94/60 Hz
a
–
a
a
1920 × 1080p @ 50 Hz
a
–
a
a
1920 × 1080p @ 29.97/30 Hz
a
3)
a
a
3)
a
3)
1920 × 1080p @ 25 Hz
a
3)
a
a
3)
a
3)
1920 × 1080p @ 23.98/24 Hz
a
3)
a
a
3)
a
3)
1920 × 1080i @ 59.94/60 Hz
a
3)
a
a
3)
a
3)
1920 × 1080i @ 50 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 59.94/60 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 50 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 29.97/30 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 23.98/24 Hz
a
3)
a
a
3)
a
3)
720 × 480p @ 59.94/60 Hz
a
3)
–
–
–
720 × 576p @ 50 Hz
a
3)
–
–
–
640 × 480p @ 59.94/60 Hz
a
3)
–
–
–
Supplied accessories
• Quick Setup Guide (1)
• Reference Guide (1)
• Remote control (RM-AAU190) (1)
• R6 (size AAA) batteries (2)
• FM wire antenna (aerial) (1)
• AM loop antenna (aerial) (1)
• Optimizer microphone (ECM-AC2) (1)
Design and specifications are subject to change
without notice.
without notice.
•
Halogenated flame retardants are not used
in the certain printed wiring boards.
in the certain printed wiring boards.
Abbreviation
AUS : Australian model
BR :
AUS : Australian model
BR :
Brazilian
model
CND : Canadian model
E12 : 220 – 240V AC area in E model
MX :
E12 : 220 – 240V AC area in E model
MX :
Mexican
model
TW :
Taiwan
model
Ver. 1.1
STR-DH550/DH750
3
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
1.
SERVICING NOTES
.............................................
4
2. DISASSEMBLY
2-1. Case
(Entry)
.................................................................... 5
2-2. Front Panel Section ......................................................... 6
2-3. Back Panel Section ......................................................... 7
2-4. MAIN Board Section ...................................................... 8
2-5. MAIN
2-3. Back Panel Section ......................................................... 7
2-4. MAIN Board Section ...................................................... 8
2-5. MAIN
Board
................................................................... 9
3.
TEST MODE
............................................................ 10
4.
FM TUNER CHECK
............................................. 13
5. DIAGRAMS
5-1. Block Diagram - ANALOG AUDIO Section - ............... 15
5-2. Block Diagram - DIGITAL Section - ............................. 16
5-3. Block Diagram - AMP Section - ..................................... 17
5-4. Block Diagram - ANALOG VIDEO/USB Section - ...... 18
5-5. Block Diagram - DIGITAL VIDEO Section - ................ 19
5-6. Block Diagram - DISPLAY/POWER Section - .............. 20
5-7. Printed
5-2. Block Diagram - DIGITAL Section - ............................. 16
5-3. Block Diagram - AMP Section - ..................................... 17
5-4. Block Diagram - ANALOG VIDEO/USB Section - ...... 18
5-5. Block Diagram - DIGITAL VIDEO Section - ................ 19
5-6. Block Diagram - DISPLAY/POWER Section - .............. 20
5-7. Printed
Wiring
Board
- MAIN Board (Component Side) - ................................ 22
5-8. Printed
Wiring
Board
- MAIN Board (Conductor Side) - .................................. 23
5-9. Schematic Diagram - MAIN Board (1/7) - ..................... 24
5-10. Schematic Diagram - MAIN Board (2/7) - ..................... 25
5-11. Schematic Diagram - MAIN Board (3/7) - ..................... 26
5-12. Schematic Diagram - MAIN Board (4/7) - ..................... 27
5-13. Schematic Diagram - MAIN Board (5/7) - ..................... 28
5-14. Schematic Diagram - MAIN Board (6/7) - ..................... 29
5-15. Schematic Diagram - MAIN Board (7/7) - ..................... 30
5-16. Printed Wiring Board
5-10. Schematic Diagram - MAIN Board (2/7) - ..................... 25
5-11. Schematic Diagram - MAIN Board (3/7) - ..................... 26
5-12. Schematic Diagram - MAIN Board (4/7) - ..................... 27
5-13. Schematic Diagram - MAIN Board (5/7) - ..................... 28
5-14. Schematic Diagram - MAIN Board (6/7) - ..................... 29
5-15. Schematic Diagram - MAIN Board (7/7) - ..................... 30
5-16. Printed Wiring Board
- HDMI Board (Component Side) - ................................ 31
5-17. Printed Wiring Board
- HDMI Board (Conductor Side) - .................................. 32
5-18. Schematic Diagram - HDMI Board - .............................. 33
5-19. Printed Wiring Board
5-19. Printed Wiring Board
- STANDBY DCDC Board (Component Side) - ............ 34
5-20. Printed Wiring Board
- STANDBY DCDC Board (Conductor Side) - .............. 35
5-21. Schematic Diagram - STANDBY DCDC Board - .......... 36
5-22. Printed Wiring Board - PANEL Section - ....................... 37
5-23. Schematic Diagram - PANEL Section - .......................... 38
5-24. Printed Wiring Board - FRONT JACK Board - .............. 39
5-25. Schematic Diagram - FRONT JACK Board - ................ 39
5-26. Printed Wiring Board - TUNER1 Board - ...................... 39
5-27. Schematic Diagram - TUNER1 Board - ......................... 40
5-28. Printed Wiring Board - POWER KEY Board -............... 41
5-29. Schematic Diagram - POWER KEY Board - ................. 41
5-30. Printed Wiring Board - HEADPHONE Board - ............. 42
5-31. Schematic Diagram - HEADPHONE Board - ................ 42
5-22. Printed Wiring Board - PANEL Section - ....................... 37
5-23. Schematic Diagram - PANEL Section - .......................... 38
5-24. Printed Wiring Board - FRONT JACK Board - .............. 39
5-25. Schematic Diagram - FRONT JACK Board - ................ 39
5-26. Printed Wiring Board - TUNER1 Board - ...................... 39
5-27. Schematic Diagram - TUNER1 Board - ......................... 40
5-28. Printed Wiring Board - POWER KEY Board -............... 41
5-29. Schematic Diagram - POWER KEY Board - ................. 41
5-30. Printed Wiring Board - HEADPHONE Board - ............. 42
5-31. Schematic Diagram - HEADPHONE Board - ................ 42
6.
EXPLODED VIEWS
6-1. Case (Entry) Section ....................................................... 57
6-2. Front Panel Section ......................................................... 58
6-3. Back Panel Section ......................................................... 59
6-4. Chassis
6-2. Front Panel Section ......................................................... 58
6-3. Back Panel Section ......................................................... 59
6-4. Chassis
Section
............................................................... 60
7.
ELECTRICAL PARTS LIST
.............................. 61
TABLE OF CONTENTS
STR-DH550/DH750
4
MODEL IDENTIFICATION
–BACK PANEL–
–BACK PANEL–
Part No.
Model
Part No.
DH550: US, Canadian
4-487-917-0[]
DH550: AEP, UK
4-487-917-1[]
DH550: Australian
4-487-917-2[]
DH550: 220 – 240 V AC area in E model
4-487-917-3[]
DH750: US, Canadian
4-448-923-0[]
DH750: AEP, UK
4-448-923-1[]
DH750: Australian
4-448-923-2[]
DH750: Taiwan
4-448-923-3[]
DH750: Mexican
4-448-923-4[]
DH750: Brazillian
4-448-923-6[]
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
•
Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SPECIAL COMPONENT NOTICE
The components identified by mark
The components identified by mark
9 contain confidential
information.
Strictly follow the instructions whenever the components are
repaired and/or replaced.
Strictly follow the instructions whenever the components are
repaired and/or replaced.
NOTICE POUR COMPOSANTS SPÉCIAUX
Les composants identifiés par la marque
Les composants identifiés par la marque
9 contiennent des
informations confidentielles.
Suivre scrupuleusement les instructions chaque fois qu’un compo-
sant est remplacé et / ou réparé.
Suivre scrupuleusement les instructions chaque fois qu’un compo-
sant est remplacé et / ou réparé.
SECTION 1
SERVICING NOTES
NOTE OF REPLACING THE IC2402 AND IC2900 ON
THE MAIN BOARD
IC2402 and IC2900 on the MAIN board cannot exchange with
single. When these parts on the MAIN board are damaged,
exchange the entire mounted board.
THE MAIN BOARD
IC2402 and IC2900 on the MAIN board cannot exchange with
single. When these parts on the MAIN board are damaged,
exchange the entire mounted board.
NOTE OF REPLACING THE IC3514 ON THE HDMI
BOARD
IC3514 on the HDMI board cannot exchange with single. When
this part on the HDMI board is damaged, exchange the entire
mounted board.
BOARD
IC3514 on the HDMI board cannot exchange with single. When
this part on the HDMI board is damaged, exchange the entire
mounted board.
NOTE OF REPLACING THE IC902 (DH750) ON THE
STANDBY DCDC BOARD
IC902 (DH750) on the STANDBY DCDC board cannot exchange
with single. When this part on the STANDBY DCDC board is
damaged, exchange the entire mounted board.
STANDBY DCDC BOARD
IC902 (DH750) on the STANDBY DCDC board cannot exchange
with single. When this part on the STANDBY DCDC board is
damaged, exchange the entire mounted board.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• Main
Board
C930,
C931
– MAIN BOARD (Conductor side) –
(To both ends of each capacitor)
800
:/2 W
C930
C931
Ver. 1.1
STR-DH550/DH750
5
SECTION 2
DISASSEMBLY
Note: This set can be disassemble according to the following sequence.
Note: Follow the disassembly procedure in the numerical order given.
2-1. CASE (ENTRY)
3 three screws
(+BVTP
(+BVTP
3
u 8)
4
4
2 three screws
(B-TYPE
(B-TYPE
4
u 8)
5 case (entry)
1 three screws
(B-TYPE
(B-TYPE
4
u 8)
2-1. CASE
(ENTRY)
(Page
5)
2-2. FRONT PANEL SECTION
(Page
(Page
6)
2-4. MAIN BOARD SECTION
(Page
(Page
8)
2-3. BACK PANEL SECTION
(Page
(Page
7)
SET
2-5. MAIN
BOARD
(Page
9)
Ver. 1.1