Sony SS-AR1 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
SS-AR1
SPECIFICATIONS
SPEAKER SYSTEM
9-889-672-01
2009J04-1
©
2009.10
AEP Model
Ver. 1.0 2009.10
Speaker system
3-way 4-speaker system, bass refl ex
Speaker unit
Woofer: 200 mm, corn type (2)
Midrange: 130 mm, corn type (1)
Tweeter: 25 mm, dome type (1)
Rated impedance 4
ohms
Maximum input power 200
watts
Sensitivity
88 dB (2.83 V/m)
Frequency response
28 Hz - 60,000 Hz
Cross over frequency
400 Hz, 4,000 Hz (multi-slope network)
Dimensions (w/h/d) 320
× 1080 × 490 mm
Mass
Approx. 57 kg
Supplied accessories
Operating Instructions (1)
Warranty card (1)
Cleaning cloth (1)
Design and specifi cations are subject to change without notice.
SS-AR1
2
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SS-AR1
3
SECTION 1
DISASSEMBLY
• This set can be disassembled in the order shown below.
Note: Follow the disassembly procedure in the numerical order given.
1-1. GRILLE FRAME ASSY
1-1. GRILLE
FRAME
ASSY
(Page 3)
SET
1-2. SP1 (20cm), SP2 (20cm),
MOUNTED PC BOARD (WO)
(Page
4)
1-3. SP3
(13cm),
MOUNTED PC BOARD (MID)
(Page
4)
1-4. SP4
(2.5cm),
MOUNTED PC BOARD (TW)
(Page
5)
1-5. TERMINAL BOARD (SP)
(Page
(Page
5)
1
grille frame assy
SS-AR1
4
1-2. SP1 (20cm), SP2 (20cm), MOUNTED PC BOARD (WO)
1-3. SP3 (13cm), MOUNTED PC BOARD (MID)
1
seven screws
(4
u25)
5
seven screws
(4
u25)
qf
screw
(tapping (1) 3.5
u16)
2
SP1 (20cm)
6
SP2 (20cm)
3
lead wire (–) (w1) (green/black)
7
lead wire (–) (w2) (green/black)
qh
lead wire (–) (gray)
qj
lead wire (+) (orange)
4
lead wire (+) (w1) (green)
8
lead wire (+) (w2) (green)
9
lead wire (+) (red)
0
lead wire (–) (black)
qa
acoustic absorbent
qs
acoustic absorbent
qd
acoustic absorbent
qg
mounted PC board (WO)
Note for Assembly:
When installing the sound absorbent material, attach it
tightly to prevent formation of any air layer between
the absorbent and the wall of the speaker cabinet.
When installing the sound absorbent material, attach it
tightly to prevent formation of any air layer between
the absorbent and the wall of the speaker cabinet.
1
seven screws
(4
u25)
2
SP3 (13cm)
3
lead wire (–) (white/black)
4
lead wire (+) (white)
5
acoustic absorbent
6
acoustic absorbent
7
acoustic absorbent
8
acoustic absorbent
9
screw
(tapping (1) 3.5
u16)
qa
lead wire (–) (brown)
qs
lead wire (+) (blue)
0
mounted PC board (MID)
Note for Assembly:
When installing the sound absorbent material, attach it
tightly to prevent formation of any air layer between
the absorbent and the wall of the speaker cabinet.
When installing the sound absorbent material, attach it
tightly to prevent formation of any air layer between
the absorbent and the wall of the speaker cabinet.