Sony SRF-M10 Service Manual ▷ View online
9-877-142-01
2003C0200-1
© 2003.03
Sony Corporation
Personal Audio Company
Pubulished by Sony Engineering Corporation
SRF-M10
SERVICE MANUAL
FM STEREO PLL SYNTHESIZED RADIO
SPECIFICATIONS
AEP Model
E Model
Chinese Model
Ver 1.0 2003.03
Time display:
24-hour system
Frequency range:
87.5 MHz - 108 MHz
Channel step:
0.05 MHz
Output: i (Stereo earphones) jack (ø 3.5 mm, stereo minijack) load
impedance 16
Ω
Power output:
4 mW + 4 mW (at 10 % harmonic distortion)
Power requirements:
1.5 V DC, one R03 (size AAA) battery
Auto Power off function:
Approx. 30 minutes, 60 minutes, 90 minutes, 120 minutes,
and off
and off
Dimensions:
Approx. 30.2 x 71.1 x 14.9 mm (w/h/d)
(Approx. 1
(Approx. 1
1
⁄
4
x 2
7
⁄
8
x
19
⁄
32
inches) incl.
projecting parts and controls
Approx. 29.4 x 70.7 x 12.6 mm (w/h/d)
(Approx. 1
Approx. 29.4 x 70.7 x 12.6 mm (w/h/d)
(Approx. 1
3
⁄
16
x 2
7
⁄
8
x
1
⁄
2
inches) not incl.
projecting parts and controls
Mass:
Approx. 43.6 g (1.54 oz.) incl. battery and the stereo
earphones
earphones
Accessories supplied:
Stereo earphones (1)
Design and specifications are subject to change without notice.
2
SRF-M10
This section is extracted from
instruction manual.
instruction manual.
Specifications ........................................................................... 1
1. GENERAL
Location and Function of Controls .................................... 2
2. DISASSEMBLY
2-1. Cabinet Rear ASSY .................................................... 3
2-2. Sub Board, Main Board .............................................. 4
2-2. Sub Board, Main Board .............................................. 4
3. ADJUSTMENTS
.......................................................... 5
4. DIAGRAMS
4-1. Explanation of IC Terminals ....................................... 5
4-2. Block Diagrams .......................................................... 6
4-3. Printed Wiring Boards –Main Section – ..................... 7
4-4. Schematic Diagram –Main Section – ......................... 8
4-5. Printed Wiring Boards –Sub Section – ....................... 9
4-6. Schematic Diagram –Sub Section – ......................... 10
4-2. Block Diagrams .......................................................... 6
4-3. Printed Wiring Boards –Main Section – ..................... 7
4-4. Schematic Diagram –Main Section – ......................... 8
4-5. Printed Wiring Boards –Sub Section – ....................... 9
4-6. Schematic Diagram –Sub Section – ......................... 10
5. EXPLODED VIEW
..................................................... 13
6. ELECTRICAL PARTS LIST
.................................... 14
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
• Keep the temperature of the soldering iron around 270
°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
SECTION 1
GENERAL
LOCATION AND FUNCTION OF CONTROLS
POWER
Jog Lever
(selection/decision)
(selection/decision)
HOLD (rear)
MEGABASS
Display Window
i
VOLUME* +/–
LOCAL/DX (rear)
3
SRF-M10
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. CABINET REAR ASSY
r
The equipment can be removed using the following procedure.
Cabinet rear ASSY
Set
Sub board, Main board
2
Screw (1.4)
1
Open the lid (BATT)
3
Claws
3
Claw
3
Claw
4
Cabinet rear ASSY
Cabinet front ASSY
3
Claws
4
SRF-M10
2-2. SUB BOARD, MAIN BOARD
1
3
2
Cabinet front ASSY
4
Flexible board
Main board
Sub board
Chassis
