Sony SCD-XE800 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
SCD-XE800
SPECIFICATIONS
SUPER AUDIO CD PLAYER
9-889-883-01
2010F05-1
©
2010.06
AEP Model
UK Model
Ver. 1.0 2010.06
Model Name Using Similar Mechanism
SCD-XA5400ES
Mechanism Type
CDM66F1-DVBU101
Optical Pick-up Block Name
KHM-313CAB
When a Super Audio CD is played
Playing frequency range
2 Hz to 100 kHz
Frequency response
2 Hz to 40 kHz (–3 dB)
Dynamic range
100 dB or more
Total harmonic distortion rate
0.0035 % or less
Wow and flutter
Value of measurable limit
(±0.001 % W. PEAK) or
less
(±0.001 % W. PEAK) or
less
When a CD is played
Frequency response
2 Hz to 20 kHz (±0.5 dB)
Dynamic range
96 dB or more
Total harmonic distortion rate
0.0039 % or less
Wow and flutter
Value of measurable limit
(±0.001 % W. PEAK) or
less
(±0.001 % W. PEAK) or
less
Output jacks
* Outputs only the audio signals of the CD
General
Laser Diode Properties
Emission duration:
Continuous
Laser Output*: Less than
44.6 μW
* This output is the value
Continuous
Laser Output*: Less than
44.6 μW
* This output is the value
measurement at a
distance of 200 mm from
the objective lens surface
on the Optical Pick-up
Block with 7 mm
aperture.
distance of 200 mm from
the objective lens surface
on the Optical Pick-up
Block with 7 mm
aperture.
Power requirements
230 V AC, 50/60 Hz
Power consumption
20 W
Power consumption (during standby mode)
0.5 W
Dimensions (w/h/d)
430 × 95 × 295 mm incl.
projecting parts
projecting parts
Mass (approx.)
3.5 kg
Supplied accessories
Audio connecting cord
Red and White plugs (1)
Remote commander
RM-ASU097 (1)
Batteries
R03 (size-AAA) (2)
Design and specifications are subject to change
without notice.
without notice.
s Standby power consumption 0.5 W.
s Halogenated flame retardants are not used in
s Halogenated flame retardants are not used in
the printed wiring boards.
Jack type
Output
level
level
Load
impedance
impedance
ANALOG
OUT L/R
OUT L/R
Phono
jacks
jacks
2 Vrms
(at 50
kilohms)
(at 50
kilohms)
Over 10
kilohms
kilohms
DIGITAL
(CD) OUT
OPTICAL*
(CD) OUT
OPTICAL*
Square
optical
output
connector
optical
output
connector
–18 dBm
(Light
emitting
wave
length: 660
nm)
emitting
wave
length: 660
nm)
DIGITAL
(CD) OUT
COAXIAL*
(CD) OUT
COAXIAL*
Coaxial
output
connector
output
connector
0.5 Vp-p
75 ohms
SCD-XE800
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 5
2-2. Case, Fuse (F001) ........................................................... 5
2-3. POWER
2-3. POWER
Board
................................................................ 6
2-4. Panel
(Loading)
............................................................... 6
2-5. Front Panel Block ........................................................... 7
2-6. CD Mechanism Deck Block
(CDM66F1-DVBU101)
2-6. CD Mechanism Deck Block
(CDM66F1-DVBU101)
..................................................
7
2-7. MAIN
Board
................................................................... 8
2-8. Belt (LD), MOTOR Board,
Motor (L) Assy (Loading) (M001) ................................. 8
2-9. Base
Unit
......................................................................... 9
2-10. Optical Pick-up Block (KHM-313CAB) ........................ 9
3.
TEST MODE
............................................................ 10
4. DIAGRAMS
4-1. Block Diagram - RF/SERVO, MAIN Section - .............. 14
4-2. Block
4-2. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 15
4-3. Schematic Diagram - MAIN Section (1/5) - ................... 17
4-4. Schematic Diagram - MAIN Section (2/5) - ................... 18
4-5. Schematic Diagram - MAIN Section (3/5) - ................... 19
4-6. Schematic Diagram - MAIN Section (4/5) - ................... 20
4-7. Schematic Diagram - MAIN Section (5/5) - ................... 21
4-8. Printed Wiring Board - MAIN Section (1/2) - ................ 22
4-9. Printed Wiring Boards - MAIN Section (2/2) - .............. 23
4-10. Printed Wiring Boards - PANEL Section - ..................... 24
4-11. Schematic Diagram - PANEL Section - .......................... 25
4-12. Printed Wiring Boards - POWER Section - .................... 26
4-13. Schematic Diagram - POWER Section - ........................ 27
4-4. Schematic Diagram - MAIN Section (2/5) - ................... 18
4-5. Schematic Diagram - MAIN Section (3/5) - ................... 19
4-6. Schematic Diagram - MAIN Section (4/5) - ................... 20
4-7. Schematic Diagram - MAIN Section (5/5) - ................... 21
4-8. Printed Wiring Board - MAIN Section (1/2) - ................ 22
4-9. Printed Wiring Boards - MAIN Section (2/2) - .............. 23
4-10. Printed Wiring Boards - PANEL Section - ..................... 24
4-11. Schematic Diagram - PANEL Section - .......................... 25
4-12. Printed Wiring Boards - POWER Section - .................... 26
4-13. Schematic Diagram - POWER Section - ........................ 27
5.
EXPLODED VIEWS
5-1. Case, Front Panel Section ............................................... 36
5-2. Chassis
5-2. Chassis
Section
............................................................... 37
5-3. Mechanism Deck Section (CDM66F1-DVBU101) ........ 38
5-4. Base Unit Section ............................................................ 39
5-4. Base Unit Section ............................................................ 39
6.
ELECTRICAL PARTS LIST
.............................. 40
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
SCD-XE800
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ABOUT THE REMOTE COMMANDER USED IN THE
SERVICE MODE
When the service mode is operated, the following, remote com-
mander is necessary.
(The service mode cannot be operated by remote commander to
which this machine is attached)
Remote commander (RM-ASP004): Part No. 1-479-272-21
SERVICE MODE
When the service mode is operated, the following, remote com-
mander is necessary.
(The service mode cannot be operated by remote commander to
which this machine is attached)
Remote commander (RM-ASP004): Part No. 1-479-272-21
Note:
Above-mentioned remote commander is one example. If it is the
one printed under a remote commander as “DVD”, any remote com-
mander can be operated.
mander can be operated.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SCD-XE800
4
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
2 Pull out the tray in the
direction of arrow B.
cam (66)
1 Insert the flat-head screwdriver etc.
into the hole of bottom on the set,
and rotate the cam (66) in the
direction of arrow A.
hole
A
B
– Bottom view –
PROCESSING OF WIRES
– Top view –
(Removed the case)