SCD-XE670 — Sony Audio Service Manual (repair manual)

Model
SCD-XE670
Pages
87
Size
6.12 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
scd-xe670.pdf
Date

View Sony SCD-XE670 Service Manual online

SERVICE MANUAL
SUPER AUDIO CD PLAYER
US Model
Canadian Model
AEP Model
UK Model
SCD-XE670
Ver 1.0  2001.07
SPECIFICATIONS
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM66B-DVBU6A
Base Unit Name
DVBU6A
Optical Pick-up Name
KHM-230AAA
9-873-176-01
Sony Corporation
2001G0500-1
Home Audio Company
C
 2001.7
Shinagawa Tec Service Manual Production Group
When a  super audio CD  is  played
Playing frequency range
2 Hz to 100 kHz
Frequency response
2 Hz to 50 kHz (–3 dB)
Dynamic range
103 dB or more
Total harmonic distortion
rate
0.0020 % or less
Wow  and flutter
Value  of  measurable limit
(
±
0.001 % W. PEAK) or
less
When a  CD  is played
Frequency response
2 Hz to 20 kHz
Dynamic range
98 dB or more
Total harmonic distortion
rate
0.0025 % or less
Wow  and flutter
Value  of measurable limit
(
±
0.001 % W. PEAK) or
less
Output connector
ANALOG
OUT
DIGITAL
(CD) OUT
OPTICAL *
PHONES
*Output only the audio signals of the CD
Load
impedance
Over 10
kilohms
Wave
length:
660 nm
32 ohms
Jack
type
Phono
jacks
Square
optical
output
connector
Stereo
phone
jack
Output level
2 Vrms
(at 50 kilohms)
–18 dBm
10 mW
General
Laser:
Semiconductor laser
(SACD: 
λ
 = 650 nm)
(CD: 
λ
 = 780 nm)
Emission duration: continuous
Power requirements
120 V AC, 60 Hz
Power consumption
26 W
Dimensions (w/h/d)
430 
×
 95 
×
 285 mm
(w/h/d)
(17 x 3 3/4 x 11 1/4 in.)
incl. projecting parts
Mass (approx.)
3.9 kg (9 lbs 5 oz)
Supplied accessories
Design and specifications are subject to change
without notice.
This player comes with the following items:
• Audio connecting cord
phono jack 
×
 2 (Red and White) y phono
jack 
×
 2 (Red and White)  (2)
phono jack 
×
 1 (Black) y phono jack 
×
 1
(Black)  (2)
• Remote commander RM-SX700 (1)
• Size AA (R6) batteries (2)
2
SCD-XE670
TABLE  OF  CONTENTS
1.
SERVICING  NOTES
...............................................
4
2.
GENERAL
...................................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
8
3-2. Case (408226) .................................................................
9
3-3. Front Panel Section .........................................................
9
3-4. AUDIO Board, MAIN Board .......................................... 10
3-5. Mechanism Deck (CDM66B-DVBU6A) ....................... 10
3-6. Base Unit (DVBU6A) ..................................................... 11
4.
TEST  MODE
.............................................................. 12
5.
DIAGRAMS
5-1. Block Diagram  – RF/SERVO Section – ........................ 26
5-2. Block Diagram  – SERVO Section – .............................. 27
5-3. Block Diagram  – MAIN Section – ................................ 28
5-4. Block Diagram  – AUDIO Section – .............................. 29
5-5. Block Diagram  – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 30
5-6. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 31
5-7. Schematic Diagram  – RF Board – ................................. 32
5-8. Printed Wiring Boards  – RF/LOADING Boards – ....... 33
5-9. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 34
5-10. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 35
5-11. Schematic Diagram
– MAIN (1/5)/LOADING Boards  – .............................. 36
5-12. Schematic Diagram  – MAIN Board (2/5) – .................. 37
5-13. Schematic Diagram  – MAIN Board (3/5) – .................. 38
5-14. Schematic Diagram  – MAIN Board (4/5) – .................. 39
5-15. Schematic Diagram  – MAIN Board (5/5) – .................. 40
5-16. Schematic Diagram
– AUDIO/HEADPHONE Boards – ................................ 41
5-17. Printed Wiring Board
– AUDIO Board (Component Side) – ............................ 42
5-18. Printed Wiring Boards  – AUDIO (Conductor Side)/
HEADPHONE Boards – ................................................. 43
5-19. Printed Wiring Boards  – DISPLAY/KEY Boards – ...... 44
5-20. Schematic Diagram  – DISPLAY/KEY Boards – .......... 45
5-21. Printed Wiring Boards
– POWER/POWER SW/PT Boards – ............................ 46
5-22. Schematic Diagram
– POWER/POWER SW/PT Boards – ............................ 47
5-23. IC Pin Function Description ........................................... 55
6.
EXPLODED  VIEWS
6-1. Case Section .................................................................... 70
6-2. Front Panel Section ......................................................... 71
6-3. Chassis Section ............................................................... 72
6-4. Mechanism Deck Section (CDM66B-DVBU6A) .......... 73
6-5. Base Unit Section (DVBU6A) ........................................ 74
7.
ELECTRICAL  PARTS  LIST
............................... 75
3
SCD-XE670
This label is located on the LEFT exterior.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able.  (See Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15 
µ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0
SUR  LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE
DES  PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ
DE  FONCTIONNEMENT.  NE  REMPLACER  CES  COM-
POSANTS  QUE  PAR  DES  PIÈCES  SONY  DONT  LES
NUMÉROS  SONT  DONNÉS  DANS  CE  MANUEL  OU
DANS  LES  SUPPLÉMENTS  PUBLIÉS  PAR  SONY.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
This appliance is classified as a CLASS 1
LASER  product.
The CLASS 1 LASER PRODUCT
MARKING is located on the rear exterior.
The following caution label is located
inside the unit.
4
SCD-XE670
(1) CD
 1.
Sled reverse move (sled in)
 2.
Disc detect
 3.
IC setting for CD
 4.
Servo error signal offset auto adjustment
 5.
Spindle kick for LD on
 6.
LD on
 7.
Focus search
 8.
Focus servo on
 9.
Spindle kick
 10. Spindle servo on
 11. E-F balance auto adjustment
 12. Tracking & sled servo on
 13. Focus bias auto adjustment
 14. Focus servo gain auto adjustment
 15. Tracking servo gain auto adjustment
 16. Jump to lead-in area
 17. Read TOC
 18. Stop
(2) SACD (single layer)
 1.
Sled reverse move (sled in)
 2.
Disc detect
 3.
IC setting for SACD
 4.
Servo error signal offset auto adjustment
 5.
Spindle kick for LD on
 6.
LD on
 7.
Focus search
 8.
Focus servo on
 9.
Spindle kick
 10. Spindle servo on
 11. E-F balance auto adjustment
 12. Tracking & sled servo on
 13. Focus bias auto adjustment
 14. Focus servo gain auto adjustment
 15. Tracking servo gain auto adjustment
 16. Jump to lead-in area
 17. Read TOC
 18. Stop
(3) SACD (dual layer)
 1.
Sled reverse move (sled in)
 2.
Disc detect
 3.
IC setting for SACD
 4.
Servo error signal offset auto adjustment
 5.
Spindle kick for LD on
 6.
LD on
 7.
Focus search
 8.
Focus servo on (layer 0)
 9.
Spindle kick
 10. Spindle servo on
 11. E-F balance auto adjustment (layer 0)
 12. Tracking & sled servo on (layer 0)
 13. Focus bias auto adjustment (layer 0)
 14. Focus servo gain auto adjustment (layer 0)
 15. Tracking servo gain auto adjustment (layer 0)
 16. Jump to lead-in area
 17. Read TOC
 18. Focus jump (layer 0
tlayer 1)
 19. E-F balance auto adjustment (layer 1)
 20. Tracking & sled servo on (layer 1)
 21. Focus bias auto adjustment (layer 1)
 22. Focus servo gain auto adjustment (layer 1)
 23. Tracking servo gain auto adjustment (layer 1)
 24. Focus Jump (layer 1
tlayer 0)
 25. Stop
SECTION  1
SERVICING  NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
CLEANING  OF  OPTICAL  PICK-UP LENS
In cleaning the lens of optical pick-up, use the air blower.
Never use a cotton swab for cleaning the lens of optical pick-up,
which otherwise causes a trouble.
MODEL IDENTIFICATION
– Rear Panel –
RESETTING  OPERATION  AT  POWER  ON
If the power is turned on with a disc loaded in the set, a sequence
of operation as shown below will be performed.
(The operation varies depending on the type of disc)
Condition: continue mode
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
PART No.
MODEL
PART No.
AEP and UK models
4-234-033-0
[]
US model
4-234-033-2
[]
Canadian model
4-234-033-4
[]
5
SCD-XE670
HOW  TO  OPEN  THE  TRAY  WHEN  POWER  SWITCH  TURNS  OFF
DISPLAY  BOARD  SERVICE  POSITION
In checking the DISPLAY board, prepare jig (extension cable J-8000-024-A : 1.00 mm Pitch, 12 cores, Length 300 mm.)
tray
tapering driver
cam (66)
1
Insert a tapering driver (3 mm in diameter) 
in the hole at the bottom of the unit,
turn the cam (66) fully in the direction of arrow 
A.
A
MAIN board
(CN706)
DISPLAY board
(CN801)
Connect jig (extension cable J-8000-024-A)
to the DISPLAY board (CN801) and 
MAIN board (CN706).

Download Sony SCD-XE670 Service Manual (Repair Manual)

Here you can view online or download Sony SCD-XE670 Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony SCD-XE670 Audio. Information contained in Sony SCD-XE670 service manual (repair manual) typically includes:

  • Disassembly, troubleshooting, programming, maintenance, remote, adjustment, installation and setup instructions.
  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).