Sony SCD-XE597 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
AEP Model
UK Model
SUPER AUDIO CD PLAYER
9-879-005-05
2009D00-1
© 2009.04
© 2009.04
Ver. 1.4 2009.04
SPECIFICATIONS
SCD-XE597
General
Laser
Semiconductor laser
(Super Audio CD:
(Super Audio CD:
λ = 650
nm) (CD:
λ = 780 nm)
Emission duration:
continuous
continuous
Power requirements
230 V AC, 50/60 Hz
Power consumption
15 W
Dimensions (w/h/d)
430 95 283 mm incl.
projecting parts
projecting parts
Mass (approx.)
3.1 kg
Supplied accessories
Audio connecting cord
Red and White 2 (1)
Remote commander
RM-SX800 (1)
Battery
R6 (size-AA) (2)
Design and specifications are subject to change
without notice.
without notice.
When a Super Audio CD is played
Playing frequency range
2 Hz to 100 kHz
Frequency response
2 Hz to 40 kHz (–3 dB)
Dynamic range
100 dB or more
Total harmonic distortion rate
0.0035 % or less
Wow and flutter
Value of measurable limit
(
(
±0.001 % W. PEAK) or
less
When a CD is played
Frequency response
2 Hz to 20 kHz
Dynamic range
96 dB or more
Total harmonic distortion rate
0.0039 % or less
Wow and flutter
Value of measurable limit
(
(
±0.001 % W. PEAK) or
less
Output connector
* Output only the audio signals of the CD
Jack type
Output
level
level
Load
impedance
impedance
ANALOG
5.1CH OUT
5.1CH OUT
Phono
jacks
jacks
2 Vrms (at
50 kilohms)
50 kilohms)
Over 10
kilohms
kilohms
DIGITAL
(CD) OUT
OPTICAL*
(CD) OUT
OPTICAL*
Square
optical
output
connector
optical
output
connector
–18 dBm
(Light
emitting
wave length:
660 nm)
emitting
wave length:
660 nm)
×
×
×
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM66D-DVBU50
Optical Pick-up Name
DBU-3
2
SCD-XE597
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.
that the S curve waveform is output three times.
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................ 3
2.
GENERAL
................................................................... 4
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 6
3-2.
Cover ............................................................................... 6
3-3.
MAIN Board .................................................................... 7
3-4.
Loading Panel .................................................................. 7
3-5.
Front Panel Section ......................................................... 8
3-6.
KEY Board, DISPLAY Board ......................................... 8
3-7.
CD Mechanism Deck (CDM66D-DVBU50) .................. 9
3-8.
Base Unit (DVBU50) ...................................................... 9
3-9.
RF Board, Pick-up Unit (DBU-3) ................................... 10
3-10. Belt (LD), LOADING Board, Motor (L) Assy ................ 10
4.
DIAGRAMS
4-1.
Block Diagram ................................................................ 12
4-2.
Printed Wiring Board — RF Section — ......................... 13
4-3.
Schematic Diagram — RF Section — ........................... 14
4-4.
Printed Wiring Board — MAIN Section — ................... 15
4-5.
Schematic Diagram — MAIN Section (1/4) — ............ 16
4-6.
Schematic Diagram — MAIN Section (2/4) — ............ 17
4-7.
Schematic Diagram — MAIN Section (3/4) — ............ 18
4-8.
Schematic Diagram — MAIN Section (4/4) — ............ 19
4-9.
Printed Wiring Board — DISPLAY Section — ............ 20
4-10. Schematic Diagram — DISPLAY Section — ................ 21
5.
TEST MODE
............................................................... 22
6.
EXPLODED VIEWS
6-1.
Main Section .................................................................... 23
6-2.
Front Panel Section ......................................................... 24
6-3.
CD Mechanism Deck ...................................................... 25
6-4.
Base Unit (DVBU50) ...................................................... 26
7.
ELECTRICAL PARTS LIST
................................ 27
3
SCD-XE597
SECTION 1
SERVICING NOTES
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH
TURNS OFF
TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and turn
in the direction of arrow.
Use a flat (-) head screwdriver to open the disc tray by manual
operation. (Flat head screwdriver with nominal blade length of
3mm.)
* To close the disc table, turn the driver in the reverse direction.
in the direction of arrow.
Use a flat (-) head screwdriver to open the disc tray by manual
operation. (Flat head screwdriver with nominal blade length of
3mm.)
* To close the disc table, turn the driver in the reverse direction.
tapering driver
Parts No.
MODEL
Part No.
AEP Model
4-255-245-0
[ ]
UK Model
4-255-245-1
[ ]
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
4
SCD-XE597
SECTION 2
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
Front Panel
A
POWER switch (9)
B
SA-CD/CD button (5, 9)
Each time you press the button while playing back
a hybrid disc, the layer to be played back switches
between the SA-CD layer and the CD layer.
a hybrid disc, the layer to be played back switches
between the SA-CD layer and the CD layer.
C
PLAY MODE button (13, 14)
Press to select the play mode.
D
Disc tray (9)
E
MULTI CHANNEL DECODING indicator
Turns on when you turn on the player, or when the
Multi-channel Super Audio CD is loaded and
select the multi-channel playback area by pressing
MULTI/2CH.
Multi-channel Super Audio CD is loaded and
select the multi-channel playback area by pressing
MULTI/2CH.
F A
button (9)
G x
button (9, 14)
H m/M
buttons (12)
I l
AMS
L
dial
(AMS: Automatic Music Sensor) (8, 9, 10,
12, 14, 15, 16, 18)
12, 14, 15, 16, 18)
J X
button (9)
K H
button (9, 12, 13, 14)
L
Display window (10)
M
Remote sensor
(6)
N
TIME/TEXT button (11)
Each time you press the button, the playing time of
the track, the remaining time of the disc, or TEXT
information appears in the display.
the track, the remaining time of the disc, or TEXT
information appears in the display.
O
MULTI/2CH button (5, 9)
Press to select the playback area when a disc with
the 2 channel area and the multi-channel area
(page 5) is loaded.
the 2 channel area and the multi-channel area
(page 5) is loaded.
P
MENU button (8, 9, 10, 12, 15, 16, 18)
Press to enter the menu.
Press to exit from the menu and return to the
normal display.
Press to exit from the menu and return to the
normal display.
l
L
1
2
3
4
5
6
7
8
9
q;
qa
qs
qd
qf
qh
qg