Sony SCD-XB790 Service Manual ▷ View online
SERVICE MANUAL
SUPER AUDIO CD PLAYER
AEP Model
UK Model
SCD-XB790
Ver 1.0 2003.04
SPECIFICATIONS
Model Name Using Similar Mechanism
SCD-XB780
CD Mechanism Type
CDM66B-DVBU6B
Base Unit Name
DVBU-6B
Optical Pick-up Name
KHM-234AMA
9-877-171-01
Sony Corporation
2003D0500-1
Home Audio Company
C
2003.04
Published by Sony Engineering Corporation
When a super audio CD is played
Playing frequency range 2 Hz to 100 kHz
Frequency response
2 Hz to 50 kHz (–3 dB)
Dynamic range
104 dB or more
Total harmonic distortion rate
0.0018 % or less
Wow and flutter
Value of measurable limit (±0.001 %
W. PEAK) or less
W. PEAK) or less
When a CD is played
Frequency response
2 Hz to 20 kHz
Dynamic range
99 dB or more
Total harmonic distortion rate
0.002 % or less
Wow and flutter
Value of measurable limit (±0.001 %
W. PEAK) or less
W. PEAK) or less
Output connector
*Output only the audio signals of the CD
ANALOG OUT
DIGITAL (CD)
OUT
OPTICAL*
OUT
OPTICAL*
DIGITAL (CD)
OUT
COAXIAL*
OUT
COAXIAL*
PHONES
Jack type
Phono
jacks
jacks
Square
optical
output
connector
optical
output
connector
Coaxial
output
connector
output
connector
Stereo
phone jack
phone jack
Output level
2 Vrms
(at 50 kilohms)
(at 50 kilohms)
–18 dBm
0.5 Vp-p
10 mW
Load impedance
Over 10 kilohms
Light emitting
wave length:
660 nm
wave length:
660 nm
75 ohms
32 ohms
( )
General
Laser
Semiconductor laser
(Super Audio CD:
(Super Audio CD:
λ = 650 nm)
(CD:
λ = 780 nm)
Emission duration: continuous
Laser radiant power: 5.47 uW at 650 nm
*These output is the value measured at a distance of about
200mm from the objective lens surface on the optical pick-up.
*These output is the value measured at a distance of about
200mm from the objective lens surface on the optical pick-up.
Power requirements
230 V AC, 50/60 Hz
Power consumption
25 W
Dimensions (w/h/d)
430
× 111 × 283 mm incl. projecting
parts
Mass (approx.)
5.8 kg
Supplied accessories
• Audio connecting cord
Stereo cable (1)
•Remote commander RM-SX700 (1)
• R06 (size-AA) batteries (2)
• R06 (size-AA) batteries (2)
Design and specifications are subject to change without notice.
2
SCD-XB790
This appliance is classified as a CLASS 1
LASER product.
This label is located on the rear exterior.
LASER product.
This label is located on the rear exterior.
The following caution label is located
inside the unit.
inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
8
3-2. Case .................................................................................
9
3-3. Front Panel Section .........................................................
9
3-4. AUDIO Board, MAIN Board .......................................... 10
3-5. Mechanism Deck (CDM66B-DVBU6B) ....................... 10
3-6. Base Unit (DVBU-6B) .................................................... 11
3-5. Mechanism Deck (CDM66B-DVBU6B) ....................... 10
3-6. Base Unit (DVBU-6B) .................................................... 11
4.
TEST MODE
.............................................................. 12
5.
DIAGRAMS
5-1. Block Diagram – RF/SERVO Section – ........................ 20
5-2. Block Diagram – SERVO Section – .............................. 21
5-3. Block Diagram – MAIN Section – ................................ 22
5-4. Block Diagram – AUDIO Section – .............................. 23
5-5. Block Diagram – DISPLAY/KEY CONTROL/
5-2. Block Diagram – SERVO Section – .............................. 21
5-3. Block Diagram – MAIN Section – ................................ 22
5-4. Block Diagram – AUDIO Section – .............................. 23
5-5. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 24
5-6. Notes for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
5-7. Schematic Diagram – RF Board – ................................. 26
5-8. Printed Wiring Boards
5-8. Printed Wiring Boards
– RF/LOADING Boards – .............................................. 27
5-9. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 28
5-10. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 29
5-11. Schematic Diagram
– MAIN (1/5)/ LOADING Boards – ............................. 30
5-12. Schematic Diagram – MAIN Board (2/5) – .................. 31
5-13. Schematic Diagram – MAIN Board (3/5) – .................. 32
5-14. Schematic Diagram – MAIN Board (4/5) – .................. 33
5-15. Schematic Diagram – MAIN Board (5/5) – .................. 34
5-16. Schematic Diagram – AUDIO/HP Boards – ................. 35
5-17. Printed Wiring Board
5-13. Schematic Diagram – MAIN Board (3/5) – .................. 32
5-14. Schematic Diagram – MAIN Board (4/5) – .................. 33
5-15. Schematic Diagram – MAIN Board (5/5) – .................. 34
5-16. Schematic Diagram – AUDIO/HP Boards – ................. 35
5-17. Printed Wiring Board
– AUDIO Board (Component Side) – ............................ 36
5-18. Printed Wiring Boards
– AUDIO (Conductor Side)/HP Boards – ..................... 37
5-19. Printed Wiring Boards – DISPLAY/KEY Boards – ...... 38
5-20. Schematic Diagram – DISPLAY/KEY Boards – .......... 39
5-21. Printed Wiring Boards
5-20. Schematic Diagram – DISPLAY/KEY Boards – .......... 39
5-21. Printed Wiring Boards
– POWER/POWER SW/PT Boards – ............................ 40
5-22. Schematic Diagram
– POWER/POWER SW/PT Boards – ............................ 41
5-23. IC Pin Function Description ........................................... 49
6.
EXPLODED VIEWS
6-1. Case Section .................................................................... 61
6-2. Front Panel Section ......................................................... 62
6-3. Chassis Section ............................................................... 63
6-4. Mechanism Deck Section (CDM66B-DVBU6B) .......... 64
6-5. Base Unit Section (DVBU-6B) ....................................... 65
6-2. Front Panel Section ......................................................... 62
6-3. Chassis Section ............................................................... 63
6-4. Mechanism Deck Section (CDM66B-DVBU6B) .......... 64
6-5. Base Unit Section (DVBU-6B) ....................................... 65
7.
ELECTRICAL PARTS LIST
............................... 66
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
3
SCD-XB790
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
CLEANING OF OPTICAL PICK-UP LENS
In cleaning the lens of optical pick-up, use the air blower.
Never use a cotton swab for cleaning the lens of optical pick-up,
which otherwise causes a trouble.
Never use a cotton swab for cleaning the lens of optical pick-up,
which otherwise causes a trouble.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURNS OFF
tray
tapering driver
cam (66)
1
Insert a tapering driver (3 mm in diameter)
in the hole at the bottom of the unit,
turn the cam (66) fully in the direction of arrow
in the hole at the bottom of the unit,
turn the cam (66) fully in the direction of arrow
A
.
A
SECTION 1
SERVICING NOTES
4
SCD-XB790
DISPLAY BOARD SERVICE POSITION
In checking the DISPLAY board, prepare jig (extension cable J-2501-200-A : 1.00 mm Pitch, 11 cores, Length 300 mm.)
MAIN board
DISPLAY board
CN801
Connect jig (extension cable J-2501-200-A)
to the DISPLAY board (CN801) and
MAIN board (CN706).
to the DISPLAY board (CN801) and
MAIN board (CN706).
CN706
Note:
Follow the assembly procedure in the numerical order given.
INSTALLATION OF THE TRANS BOARD
3
four screws
(PTTWH3
(PTTWH3
×
6)
2
power transformer
(T902)
(T902)
4
3
four screws
(PTTWH3
(PTTWH3
×
6)
1
power transformer
(T901)
(T901)
5
Solder seventeen portions.
Note : Solder the TRANS board after installing power transformers (T901, T902)
to the chassis.
(To prevent the TRANS board from being cracked.)
(To prevent the TRANS board from being cracked.)