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AEP Model

Korean Model

Model Name Using Similar Mechanism

SCD-XB780

CD Mechanism Type

CDM66B-DVBU6B

Base Unit Name

DVBU-6B

Optical Pick-up Name

KHM-234AMA

2005E05-1

C

 2005.05

2 Hz to 100 kHz

2 Hz to 50 kHz (–3 dB)

105 dB or more

0.0017 % or less

Value of measurable limit (

±0.001 %

W. PEAK) or less

2 Hz to 20 kHz

99 dB or more

0.0019 % or less

Value of measurable limit (

±0.001 %

W. PEAK) or less

*Output only the audio signals of the CD

ANALOG OUT

DIGITAL (CD)
OUT
OPTICAL*

DIGITAL (CD)
OUT
COAXIAL*

PHONES

Phono
jacks

Square
optical
output
connector

Coaxial
output
connector

Stereo
phone jack

2 Vrms
(at 50 kilohms)

–18 dBm

0.5 Vp-p

10 mW

Over 10 kilohms

75 ohms

32 ohms

(         )

Light emitting
wave length:
660 nm

Semiconductor laser

(Super Audio CD: 

λ = 650 nm)

(CD: 

λ = 780 nm)

Emission duration: continuous

5.47 uW at 650 nm

*These output is the value measured at a distance of about
  200mm from the objective lens surface on the optical pick-up.

AEP model: 230 V AC, 50/60 Hz
Korean model: 220 V AC, 60 Hz

24 W

430 

× 124 × 390 mm incl. projecting

parts

8.2 kg

Design and specifications are subject to change without notice.

• Audio connecting cord

phono jack

×2 (Red and White) ↔ phono jack×2 (Red

and White) (2)
phono jack

×1 (Black) ↔ phono jack×1 (Black) (2)

• Remote commander RM-SX700 (1)
• R06 (size-AA) batteries (2)

2

0

0

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.

This appliance is classified as a CLASS 1
LASER product.
This label is located on the rear exterior.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

3

...............................................

4

...................................................................

9

3-1. Disassembly Flow ........................................................... 11
3-2. Case ................................................................................. 11
3-3. Loading Panel Assy ......................................................... 12
3-4. Mechanism Deck (CDM66B-DVBU6B) ....................... 12
3-5. AUDIO Board ................................................................. 13
3-6. MAIN Board ................................................................... 13
3-7. POWER Board ................................................................ 14
3-8. Front Panel Assy ............................................................. 14
3-9. Base Unit (DVBU-6B) .................................................... 15

.............................................................. 16

5-1. Block Diagram  – RF/SERVO Section – ........................ 24
5-2. Block Diagram  – SERVO Section – .............................. 25
5-3. Block Diagram  – MAIN Section – ................................ 26
5-4. Block Diagram  – AUDIO Section – .............................. 27
5-5. Block Diagram  – DISPLAY/KEY CONTROL/

POWER SUPPLY Section – ........................................... 28

5-6. Notes for Printed Wiring Boards and

Schematic Diagrams ....................................................... 29

5-7. Printed Wiring Boards  – RF Section – .......................... 30
5-8. Schematic Diagram  – RF Section – ............................... 31
5-9. Printed Wiring Board

– MAIN Section (Component Side) – ............................ 32

5-10. Printed Wiring Board

– MAIN Section (Conductor Side) – .............................. 33

5-11. Schematic Diagram  – MAIN Section (1/5) – ................ 34
5-12. Schematic Diagram  – MAIN Section (2/5) – ................ 35
5-13. Schematic Diagram  – MAIN Section (3/5) – ................ 36
5-14. Schematic Diagram  – MAIN Section (4/5) – ................ 37
5-15. Schematic Diagram  – MAIN Section (5/5) – ................ 38
5-16. Schematic Diagram  – AUDIO Section – ....................... 39
5-17. Printed Wiring Board

– AUDIO Section (Component Side) – .......................... 40

5-18. Printed Wiring Board

– AUDIO Section (Conductor Side) – ............................ 41

5-19. Printed Wiring Boards  – PANEL Section – .................. 42
5-20. Schematic Diagram  – PANEL Section – ....................... 43
5-21. Printed Wiring Board

– POWER Section (Component Side) – ......................... 44

5-22. Printed Wiring Board

– POWER Section (Conductor Side) – ........................... 45

5-23. Printed Wiring Boards

– AC Section (Component Side) – .................................. 46

5-24. Printed Wiring Boards

– AC Section (Conductor Side) – ................................... 47

5-25. Schematic Diagram  – POWER Section – ..................... 48
5-26. Printed Wiring Board  – HP Section – ........................... 49
5-27. Schematic Diagram  – HP Section – .............................. 49
5-28. IC Pin Function Description ........................................... 57

6-1. Overall Section ................................................................ 69
6-2. Front Panel Section-1 ...................................................... 70
6-3. Front Panel Section-2 ...................................................... 71
6-4. Chassis Section-1 ............................................................ 72
6-5. Chassis Section-2 ............................................................ 73
6-6. Mechanism Deck Section (CDM66B-DVBU6B) .......... 74
6-7. Base Unit Section (DVBU-6B) ....................................... 75

............................... 76

4

1

Rotate the cam (66)
with a screw driver.

cam (66)

2

Pull out the
loading panel assy.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.

In cleaning the lens of optical pick-up, use the air blower.
Never use a cotton swab for cleaning the lens of optical pick-up,
which otherwise causes a trouble.