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2015J33-1

© 

2015.10

•  SA-WRT5 is the active subwoofer in HT-RT5.
•  All of the units included in the HT-RT5 (SA-WRT5/

SA-RT5/SA-SLRT5/SA-SRRT5/Remote control) 
are required to confi rming operation of SA-WRT5. 
Check in advance that you have all of the units.

•  For the TEST MODE for this unit, refer to the service manual of HT-RT5.

POWER OUTPUT (reference)

(Except CH)

140 W (at 4 ohms, 80 Hz)

POWER OUTPUT

(CH)

65 W (at 5 ohms, 80 Hz)

Speaker system

Subwoofer system, Bass reflex

Speaker 

160 mm (6 3/8  in) cone type

Power requirements

120 V AC, 60 Hz (US, CND)
110 V - 240 V AC, 50 Hz/60 Hz (EA3, LA)
220 V - 240 V AC, 50 Hz/60 Hz 
(Except US, CND, EA3, LA)

Power consumption

On: 20 W
Standby mode: 0.5 W or less

Dimensions (approx.) (w/h/d)

191 mm × 383 mm × 386 mm (7 5/8 in × 
15 1/8 in × 15 1/4  in)

Mass (approx.)

8.5 kg (18 lb 12 oz)

Communication system 

Wireless Sound Specification version 3.0

Frequency band (US, CND, AEP, UK, AUS, AR)

5.2 GHz (5.180 GHz - 5.240 GHz)

Frequency band (CH)

5.15 GHz - 5.25 GHz

Frequency band (EA3)

5.2 GHz (5.180 GHz - 5.240 GHz)

Frequency band (E3, SP, LA)

5.8 GHz (5.736 GHz - 5.814 GHz)

5.8 GHz (5.736 GHz - 5.814 GHz)

Modulation method

Design and specifications are subject to change 
without notice.

DSSS

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

0  SUR  

This system incorporates Dolby* Digital and 
the DTS** Digital Surround System.

* Manufactured under license from Dolby 

Laboratories.
Dolby, Pro Logic, and the double-D 
symbol are trademarks of Dolby 
Laboratories.

** For DTS patents, see http://

patents.dts.com. Manufactured under 
license from DTS Licensing Limited. DTS, 
DTS-HD, the Symbol, & DTS and the 
Symbol together are registered 
trademarks of DTS, Inc. © DTS, Inc. All 
Rights Reserved.

The BLUETOOTH®  word mark and logos 
are registered trademarks owned by 
Bluetooth SIG, Inc. and any use of such 
marks by Sony Corporation is under 
license. Other trademarks and trade 
names are those of their respective 
owners.

This system incorporates High-Definition 
Multimedia Interface (HDMI™) 
technology. 

The terms HDMI and HDMI High-
Definition Multimedia Interface, and the 
HDMI Logo are trademarks or registered 
trademarks of HDMI Licensing LLC in the 
United States and other countries.

The N Mark is a trademark or registered 
trademark of NFC Forum, Inc. in the 
United States and in other countries.

Android and Google Play are trademarks 
of Google Inc.

Google Cast is a trademark of Google Inc.

“Xperia” is a trademark of Sony Mobile 
Communications AB.

Apple, the Apple logo, iPhone, iPod, iPod 
touch, and Retina are trademarks of 
Apple Inc., registered in the U.S. and other 
countries. App Store is a service mark of 
Apple Inc.

“Made for iPod,” and “Made for iPhone” 
mean that an electronic accessory has 
been designed to connect specifically to 
iPod or iPhone, respectively, and has 
been certified by the developer to meet 
Apple performance standards. Apple is 
not responsible for the operation of this 
device or its compliance with safety and 
regulatory standards. Please note that the 
use of this accessory with iPod or iPhone 
may affect wireless performance.

“BRAVIA” logo is a trademark of Sony 
Corporation.

“ClearAudio+” is a trademark of Sony 
Corporation.

“x.v.Color” and “x.v.Color” logo are 
trademarks of Sony Corporation.

“PlayStation®” is a registered trademark of 

Sony Computer Entertainment  Inc.

MPEG Layer-3 audio coding technology 
and patents licensed from Fraunhofer IIS 
and Thomson.

Windows Media is either a registered 
trademark or trademark of Microsoft 
Corporation in the United States and/or 
other countries.
This product is protected by certain 
intellectual property rights of Microsoft 
Corporation. Use or distribution of such 
technology outside of this product is 
prohibited without a license from 
Microsoft or an authorized Microsoft 
subsidiary.

Opera® Devices SDK from Opera Software 
ASA. Copyright 1995-2013 Opera Software 
ASA. All rights reserved.

Wi-Fi®, Wi-Fi Protected Access®, Wi-Fi 
Alliance® and Wi-Fi CERTIFIED Miracast® 
are registered trademarks of Wi-Fi 
Alliance.

Wi-Fi CERTIFIED™, WPA™, WPA2™, Wi-Fi 
Protected Setup™ and Miracast™ are 
trademarks of Wi-Fi Alliance.

LDAC™ and LDAC logo are 
trademarks of Sony Corporation.

LDAC is an audio coding technology 
developed by Sony that enables the 
transmission of High-Resolution (Hi-Res) 
Audio content, even over a Bluetooth 
connection. Unlike other Bluetooth 
compatible coding technologies such as 
SBC, it operates without any down-
conversion of the Hi-Res Audio content*, 
and allows approximately three times 
more data** than those other 
technologies to be transmitted over a 
Bluetooth wireless network with 
unprecedented sound quality, by means 
of efficient coding and optimized 
packetization.

* excluding DSD format contents

** in comparison with SBC (Subband Coding) 

when the bitrate of 990kbps (96/48kHz) 
or 909kbps (88.2/44.1kHz) is selected

This product contains software that is 
subject to the GNU General Public License 
(“GPL”) or GNU Lesser General Public 
License (“LGPL”). These establish that 
customers have the right to acquire, 
modify, and redistribute the source code 
of said software in accordance with the 
terms of the GPL or the LGPL.

For details of the GPL, LGPL and other 
software licenses, please refer to 
[Software License Information] in [System 
Settings] of the [Setup] menu on the 
product.

The source code for the software used in 
this product is subject to the GPL and 
LGPL, and is available on the Web. To 
download, please access the following:
URL: 
http://oss.sony.net/Products/Linux

Please note that Sony cannot answer or 
respond to any inquiries regarding the 
content of this source code.

“DSEE” is a trademark of Sony 
Corporation.

All other trademarks are trademarks of 
their respective owners.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But don’t perform the operation 
check in the long time, and perform the operation check in the 
volume state as low as possible.

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING 
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of capacitors to discharge the capaci-
tor as shown in the fi gure below.

:/2 W

:/2 W

 .............................................  

3

2-1. Disassembly 

Flow 

...........................................................   6

2-2.  Rear Panel Block ............................................................   6
2-3.  SUB KEY Board, RF Modulator (WS001) (RF1), 

AMP Block .....................................................................   7

2-4.  SUB MAIN Board, Power Cord (AC1), 

Switching Regulator (3L405W) (SWR1) .......................   8

2-5.  Front Panel Block ...........................................................   9
2-6.  SUB LED Board, Grille Frame Assy, Front Panel..........   10
2-7.  Loudspeaker (160 mm)-130-11 (SP1) ............................   11

 ..........................................   12

4-1.  Printed Wiring Board - MAIN Section - .........................   14
4-2.  Schematic Diagram - MAIN Section (1/3) - ...................   15
4-3.  Schematic Diagram - MAIN Section (2/3) - ...................   16
4-4.  Schematic Diagram - MAIN Section (3/3) - ...................   17
4-5.  Printed Wiring Board - SUB LED Board - .....................   18
4-6.  Schematic Diagram - SUB LED Board - ........................   18

5-1. Overall 

Section 

...............................................................  20

5-2.  Sub Main Section ............................................................   21
5-3.  Speaker Cabinet Section .................................................   22

 ..............................   23

MODEL  IDENTIFICATION
Distinguish by Part No. and Destination code on the rear side of 
a main unit.

Part No.

Destination code

Part No.

Destination code

US, CND

4-570-314-0[]

(UC2)

AEP

4-570-315-0[]

(CEL)

UK

4-572-275-0[]

(CEK)

AUS

4-572-276-0[]

(AU1)

EA3

4-572-279-0[]

(EA3)

BR

4-572-280-0[]

(BR1)

E3

4-572-281-0[]

(E3)

SP

4-572-282-0[]

(SP1)

LA

4-572-285-0[]

(LA9)

CH

4-572-292-0[]

(CN4)

AR

4-572-293-0[]

(AR2)

DESTINATION  ABBREVIATIONS
The following abbreviations for model destinations are used in this 
service manual.

• Abbreviations
 AR  : 

Argentina 

model

 AUS : 

Australian 

model

  CH 

: Chinese model

  CND  : Canadian model
  E3 

: African model (Except for Kenyan, Tanzania, Nigerian)

  EA3 

: Saudi Arabia, UAE, Kuwait, Iraqi, Kenyan, Tanzanian and 

   

  Nigerian models

  LA 

: Latin American model (Except for Brazilian, Argentina)

  SP 

: Singapore model

ADVANCE  PREPARATION  WHEN  CONFIRMING  OP-
ERATION
All of the units included in the HT-RT5 (SA-WRT5/SA-RT5/SA-
SLRT5/SA-SRRT5/Remote control) are required to confi rming 
operation of SA-WRT5. Check in advance that you have all of 
the units.

NOTE  OF  REPAIRING  THE  SUB  KEY  BOARD
When the SUB KEY board installed by this unit is defective, re-
place the complete mounted board.
The mounted parts cannot replace with single.

NOTE  OF  REPLACING  THE  IC7400  ON  THE  SUB  MAIN  
BOARD
IC7400 on the SUB MAIN board cannot replace with single. When 
this part is damaged, replace the complete mounted board.

NOTE  OF  REPLACING  THE  IC7203  ON  THE  SUB  
MAIN  BOARD  OR  THE  SUB  MAIN  BOARD
When IC7203 on the SUB MAIN board or the SUB MAIN board 
are replaced, it is necessary to spread the compound  between the 
SUB MAIN board and the heat sink.
Spread the compound referring to the fi gure below.