View Sony SA-WFS3 / SS-FS3 Service Manual online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
SA-WFS3/SS-FS3
SPECIFICATIONS
9-889-496-01
2009E05-1
©
2009.05
AEP Model
UK Model
Ver. 1.0 2009.05
• SA-WFS3 is the amplifi er, HDMI, tuner
and active subwoofer section in HT-FS3.
• SS-FS3 is the speaker system in HT-FS3.
Photo: SS-FS3
Photo: SA-WFS3
Photo: SS-FS3
This system incorporates Dolby*
Digital and Pro Logic Surround and
the DTS** Digital Surround System.
Digital and Pro Logic Surround and
the DTS** Digital Surround System.
* Manufactured under license from
Dolby Laboratories.
“Dolby”, “Pro Logic”, and the
double-D symbol are trademarks
of Dolby Laboratories.
“Dolby”, “Pro Logic”, and the
double-D symbol are trademarks
of Dolby Laboratories.
** Manufactured under license under
U.S. Patent #'s: 5,451,942;
5,956,674; 5,974,380; 5,978,762;
5,956,674; 5,974,380; 5,978,762;
6,487,535 & other U.S. and
worldwide patents issued &
pending. DTS and DTS Digital
Surround are registered trademarks
and the DTS logos and Symbol are
trademarks of DTS, Inc.
© 1996-2008 DTS, Inc. All Rights
Reserved.
worldwide patents issued &
pending. DTS and DTS Digital
Surround are registered trademarks
and the DTS logos and Symbol are
trademarks of DTS, Inc.
© 1996-2008 DTS, Inc. All Rights
Reserved.
This system incorporates
High-Definition Multimedia Interface
(HDMI™) technology.
HDMI, the HDMI logo and
High-Definition Multimedia Interface
are trademarks or registered
trademarks of HDMI Licensing LLC.
High-Definition Multimedia Interface
(HDMI™) technology.
HDMI, the HDMI logo and
High-Definition Multimedia Interface
are trademarks or registered
trademarks of HDMI Licensing LLC.
“BRAVIA Sync” is a trademark of
Sony Corporation.
Sony Corporation.
“PLAYSTATION” is a trademark of
Sony Computer Entertainment Inc.
Sony Computer Entertainment Inc.
“S-AIR” and its logo are trademarks
of Sony Corporation.
of Sony Corporation.
“x.v.Colour (x.v.Color)” and
“x.v.Colour (x.v.Color)” logo are
trademarks of Sony Corporation.
“x.v.Colour (x.v.Color)” logo are
trademarks of Sony Corporation.
SA-WFS3
ACTIVE SUBWOOFER
SS-FS3
SPEAKER SYSTEM
Formats supported by this
system
system
Digital input formats supported by this system
are as follows.
are as follows.
* Linear PCM accepts sampling frequencies of no
more than 48 kHz.
Amplifier section (SA-WFS3)
Power output (rated)
L / R:
L / R:
80 W + 80 W
(at 4 ohms, 1 kHz, 1 %
THD)
(at 4 ohms, 1 kHz, 1 %
THD)
Power output (reference)
RMS output power
L / R:
100 W/ch (per channel at 4
ohms, 1 kHz, 10 % THD)
ohms, 1 kHz, 10 % THD)
Subwoofer:
200 W (at 2 ohms, 100 Hz,
10 % THD)
10 % THD)
Inputs (Analog)
TV
TV
Sensitivity: 550 mV
Impedance: 33 kohms
Impedance: 33 kohms
Inputs (Digital)
TV, DIGITAL 1 Optical
DIGITAL 2
TV, DIGITAL 1 Optical
DIGITAL 2
Coaxial
Format
Supported/Not supported
Dolby Digital
a
DTS
a
Linear PCM (2ch)*
a
Linear PCM (5.1ch,
7.1ch)* (Only on
HDMI)
7.1ch)* (Only on
HDMI)
a
Dolby Digital Plus
×
Dolby True HD
×
×
D
H
-
S
T
D
HDMI section (SA-WFS3)
Connector
HDMI
TM
Connecter
Video inputs/outputs
BD, DVD, SAT/CATV:
640 × 480p@60 Hz
720 × 480p@59.94/60 Hz
1280 × 720p@59.94/60 Hz
1920 × 1080i@59.94/
60 Hz
1920 × 1080p@59.94/
60 Hz
720 × 576p@50 Hz
1280 × 720p@50 Hz
1920 × 1080i@50 Hz
1920 × 1080p@50 Hz
1920 × 1080p@24 Hz
640 × 480p@60 Hz
720 × 480p@59.94/60 Hz
1280 × 720p@59.94/60 Hz
1920 × 1080i@59.94/
60 Hz
1920 × 1080p@59.94/
60 Hz
720 × 576p@50 Hz
1280 × 720p@50 Hz
1920 × 1080i@50 Hz
1920 × 1080p@50 Hz
1920 × 1080p@24 Hz
Audio inputs
BD, DVD, SAT/CATV:
Linear PCM 7.1ch/
Dolby Digital/DTS
Linear PCM 7.1ch/
Dolby Digital/DTS
Tuner section (SA-WFS3)
System
PLL quartz-locked digital
synthesizer
synthesizer
FM tuner section
Tuning range
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Tuning range
531 kHz – 1,602 kHz (with
the interval set at 9 kHz)
the interval set at 9 kHz)
Antenna (aerial)
AM loop antenna (aerial)
Intermediate frequency
450 kHz
Speakers (SS-FS3)
Speaker system
Full range, Bass reflex
Speaker unit
65 mm cone type
Rated impedance
4 ohms
Dimensions (approx.)
102 mm × 163 mm × 77
mm (with foot) (w/h/d)
mm (with foot) (w/h/d)
Mass (approx.)
0.55 kg
Subwoofer (SA-WFS3)
Speaker system
Subwoofer, Bass reflex
Speaker unit
130 mm cone type
Rated impedance
2 ohms
Dimensions (approx.)
212 mm × 374 mm × 364
mm (w/h/d)
mm (w/h/d)
Mass (approx.)
8.9 kg
General
Power requirements
220 – 240 V AC, 50/60 Hz
Power consumption
On: 95 W
Standby mode: 0.3 W (when “CTRL: HDMI”
Standby mode: 0.3 W (when “CTRL: HDMI”
and “S-AIR STBY” are set
to “OFF.”)
to “OFF.”)
Power output
(DIGITAL MEDIA PORT) DC OUT: 5 V, 700 mA
(DIGITAL MEDIA PORT) DC OUT: 5 V, 700 mA
Design and specifications are subject to change without
notice.
notice.
s Standby power consumption 0.3 W.
s Halogenated flame retardants are not used in the
certain printed wiring boards.
s Over 85 % power efficiency of amplifier block is
achieved with the full digital amplifier, S-Master.
SA-WFS3/SS-FS3
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 4
2-2. AMP
Block
..................................................................... 4
2-3. Front Panel Block ........................................................... 5
2-4. Bracket
2-4. Bracket
(TOP)
................................................................. 7
2-5. S-AIR Board, Tuner (FM/AM) ....................................... 7
2-6. HDMI
2-6. HDMI
Board
................................................................... 8
2-7. MAIN
Board
................................................................... 9
2-8. POWER
Board
................................................................ 9
3.
TEST MODE
............................................................ 10
4. DIAGRAMS
4-1. Block Diagram - HDMI Section - ................................... 12
4-2. Block Diagram - INPUT Section - .................................. 13
4-3. Block Diagram - DSP Section - ...................................... 14
4-4. Block Diagram - AMP, PANEL Section - ....................... 15
4-5. Block Diagram - POWER SUPPLY Section - ................ 16
4-6. Schematic Diagram - HDMI Board (1/2) - ..................... 18
4-7. Schematic Diagram - HDMI Board (2/2) - ..................... 19
4-8. Printed Wiring Board - HDMI Board - ........................... 20
4-9. Printed Wiring Board - IO Section - ............................... 21
4-10. Schematic Diagram - IO-DIGITAL Board - ................... 22
4-11. Schematic Diagram - S-AIR Board - .............................. 23
4-12. Printed Wiring Board
4-2. Block Diagram - INPUT Section - .................................. 13
4-3. Block Diagram - DSP Section - ...................................... 14
4-4. Block Diagram - AMP, PANEL Section - ....................... 15
4-5. Block Diagram - POWER SUPPLY Section - ................ 16
4-6. Schematic Diagram - HDMI Board (1/2) - ..................... 18
4-7. Schematic Diagram - HDMI Board (2/2) - ..................... 19
4-8. Printed Wiring Board - HDMI Board - ........................... 20
4-9. Printed Wiring Board - IO Section - ............................... 21
4-10. Schematic Diagram - IO-DIGITAL Board - ................... 22
4-11. Schematic Diagram - S-AIR Board - .............................. 23
4-12. Printed Wiring Board
- ANALOG-POMODORO Board - ................................ 24
4-13. Schematic Diagram
- ANALOG-POMODORO Board - ................................ 25
4-14. Printed Wiring Board
- MAIN Board (Component Side) - ................................ 26
4-15. Printed Wiring Board
- MAIN Board (Conductor Side) - .................................. 27
4-16. Schematic Diagram - MAIN Board (1/6) - ..................... 28
4-17. Schematic Diagram - MAIN Board (2/6) - ..................... 29
4-18. Schematic Diagram - MAIN Board (3/6) - ..................... 30
4-19. Schematic Diagram - MAIN Board (4/6) - ..................... 31
4-20. Schematic Diagram - MAIN Board (5/6) - ..................... 32
4-21. Schematic Diagram - MAIN Board (6/6) - ..................... 33
4-22. Printed Wiring Boards - KEY, SPEAKER Section - ...... 34
4-23. Schematic Diagram - KEY, SPEAKER Section - ........... 35
4-24. Printed Wiring Board - DISPLAY Board - ..................... 36
4-25. Schematic Diagram - DISPLAY Board - ........................ 37
4-26. Printed Wiring Board - POWER Board - ........................ 38
4-27. Schematic Diagram - POWER Board - .......................... 39
4-17. Schematic Diagram - MAIN Board (2/6) - ..................... 29
4-18. Schematic Diagram - MAIN Board (3/6) - ..................... 30
4-19. Schematic Diagram - MAIN Board (4/6) - ..................... 31
4-20. Schematic Diagram - MAIN Board (5/6) - ..................... 32
4-21. Schematic Diagram - MAIN Board (6/6) - ..................... 33
4-22. Printed Wiring Boards - KEY, SPEAKER Section - ...... 34
4-23. Schematic Diagram - KEY, SPEAKER Section - ........... 35
4-24. Printed Wiring Board - DISPLAY Board - ..................... 36
4-25. Schematic Diagram - DISPLAY Board - ........................ 37
4-26. Printed Wiring Board - POWER Board - ........................ 38
4-27. Schematic Diagram - POWER Board - .......................... 39
5.
EXPLODED VIEWS
5-1. Cabinet Section (SA-WFS3) ........................................... 56
5-2. Front Panel Section (SA-WFS3) ..................................... 57
5-3. AMP Section (SA-WFS3) ............................................... 58
5-4. Main Section (SA-WFS3) ............................................... 59
5-5. Chassis Section (SA-WFS3) ........................................... 60
5-6. SS-FS3
5-2. Front Panel Section (SA-WFS3) ..................................... 57
5-3. AMP Section (SA-WFS3) ............................................... 58
5-4. Main Section (SA-WFS3) ............................................... 59
5-5. Chassis Section (SA-WFS3) ........................................... 60
5-6. SS-FS3
............................................................................ 61
6.
ELECTRICAL PARTS LIST
.............................. 62
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Note: Refer to page 61 for information of SS-FS3.
SA-WFS3/SS-FS3
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
• JIG
When disassembling the set, use the following jig (for speaker
When disassembling the set, use the following jig (for speaker
removal).
Part No. J-2501-238-A JIG FOR SPEAKER REMOVAL
NOTE OF CONFIRMING THE BOARDS (SA-WFS3)
Protecting is generated when energizing with the heat sink de-
tached. Fix the heat sink to the MAIN board by using the screw
and the nut without fail when you confi rm the board.
Protecting is generated when energizing with the heat sink de-
tached. Fix the heat sink to the MAIN board by using the screw
and the nut without fail when you confi rm the board.
CONFIRMING THE POWER BOARD (SA-WFS3)
The POWER board can be confi rmed by removing the bottom
plate of the active subwoofer.
The POWER board can be confi rmed by removing the bottom
plate of the active subwoofer.
NOTE THE IC3511 AND IC3513 ON THE HDMI BOARD
REPLACING (SA-WFS3)
IC3511 and IC3513 on the HDMI board cannot exchange with sin-
gle. When these parts are damaged, exchange the entire mounted
board.
REPLACING (SA-WFS3)
IC3511 and IC3513 on the HDMI board cannot exchange with sin-
gle. When these parts are damaged, exchange the entire mounted
board.
NOTE OF REPLACING THE IC340 AND IC400 ON
THE MAIN BOARD AND THE COMPLETE MAIN
BOARD (SA-WFS3)
When IC340 and IC400 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(OIL COMPOUND G777) (Part No. J-2501-335-A ) between the
main board and the heat sink.
Spread the compound referring to the fi gure below.
THE MAIN BOARD AND THE COMPLETE MAIN
BOARD (SA-WFS3)
When IC340 and IC400 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(OIL COMPOUND G777) (Part No. J-2501-335-A ) between the
main board and the heat sink.
Spread the compound referring to the fi gure below.
oil compound G777
(J-2501-335-A)
(J-2501-335-A)
IC340
IC400
– MAIN Board (Component Side) –
CAPACITOR ELECTORICAL DISCHARGE
PROCESSING (SA-WFS3)
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C903) to
discharge the capacitor (C903).
PROCESSING (SA-WFS3)
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C903) to
discharge the capacitor (C903).
C903
800
:/2 W
– POWER Board (Conductor Side) –
SA-WFS3/SS-FS3
4
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
• SA-WFS3 only is described in this section.
• SA-WFS3 only is described in this section.
2-1. DISASSEMBLY FLOW
Note: Follow the disassembly procedure in the numerical order given.
2-2. AMP BLOCK
2-2. AMP
BLOCK
(Page
4)
SET
2-3. FRONT PANEL BLOCK
(Page
(Page
5)
2-4. BRACKET
(TOP)
(Page
7)
2-5. S-AIR BOARD, TUNER (FM/AM)
(Page
(Page
7)
2-6. HDMI
BOARD
(Page
8)
2-7. MAIN
BOARD
(Page
9)
2-8. POWER
BOARD
(Page
9)
1 five screws (BVTT4 u 20)
3 connector
(CN562)
5 wire (flat type)
(15 core) (CN1001)
4 cushion
(saranet-A)
2
6 AMP block