Sony SA-WCT260 Service Manual ▷ View online
SA-WCT260
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
All of the units included in the HT-CT260/260HP (SA-WCT260/
SA-CT260/EZW-RT50) are required to confi rming operation of
the main unit. Check in advance that you have all of the units.
ERATION
All of the units included in the HT-CT260/260HP (SA-WCT260/
SA-CT260/EZW-RT50) are required to confi rming operation of
the main unit. Check in advance that you have all of the units.
NOTE OF REPLACING THE IC104 ON THE SUB MAIN
BOARD AND THE COMPLETE SUB MAIN BOARD
When IC104 on the SUB MAIN board and the complete SUB
MAIN board are replaced, it is necessary to spread the compound
between the SUB MAIN board and the heat sink.
BOARD AND THE COMPLETE SUB MAIN BOARD
When IC104 on the SUB MAIN board and the complete SUB
MAIN board are replaced, it is necessary to spread the compound
between the SUB MAIN board and the heat sink.
Part No.
Remarks
J-2501-221-A
THERMAL COMPOUND (G747)
Spread the compound referring to the fi gure below.
– SUB MAIN Board (Component Side) –
thermal compound G747
IC104
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C935 or
C936) to discharge the capacitor (C935 or C936).
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C935 or
C936) to discharge the capacitor (C935 or C936).
– POWER Board (Conductor Side) –
800
:/2 W
C935 (US and Canadian models)
C936 (Except US and Canadian models)
Ver. 1.1
SA-WCT260
4
MODEL IDENTIFICATION
Distinguish by model number label stuck on the rear side of a main unit.
Distinguish by model number label stuck on the rear side of a main unit.
MODEL NUMBER LABEL
US and Canadian models
AEP model
UK model
SA-WCT260 UC2
4-434-526-0s
SA-WCT260 CEL
4-434-528-0s
SA-WCT260 CEK
4-438-046-0s
Singapore model
SA-WCT260 SP1
4-438-047-0s
Russian model
SA-WCT260 RU3
4-438-049-0s
Australian model
SA-WCT260 AU1
4-447-896-0s
Brazilian model
SA-WCT260 BR1
4-447-897-0s
– Rear side view –
Ver. 1.1
SA-WCT260
5
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
SET
2-6. POWER CORD (AC1)
(Page
(Page
8)
2-7. SUB
AMP
BLOCK
(Page
9)
2-2. REAR
PANEL
(Page
5)
2-5. POWER
BOARD
(Page
7)
2-8. SUB MAIN BOARD
(Page
(Page
9)
2-10. LOUDSPEAKER (13 cm)
(SP100)
(Page
(SP100)
(Page
11)
2-9. BOTTOM PANEL BLOCK
(Page
(Page
10)
2-3. FRONT LED BOARD, TOP PANEL ASSY
(Page
(Page
6)
2-4. TOP PLATE BLOCK,
FUSE
FUSE
(F900)
(Page
7)
Note: Follow the disassembly procedure in the numerical order given.
2-2. REAR PANEL
1 two screws
(BVTP3
u 8)
1 two screws
(BVTP3
u 8)
3 Pull out the power code.
2 Remove the rear panel in
the direction of an arrow.
4 rear panel
– Rear side view –
SA-WCT260
6
2-3. FRONT LED BOARD, TOP PANEL ASSY
1 screw
(BVTP3
u 8)
1 screw
(BVTP3
u 8)
total four bosses
clamp (L35)
:LUHVHWWLQJ
sub AMP block
SW cabinet
Wire to FRONT LED board.
Wire from SUB MAIN board.
7 screw
(BVTP2.6)
6 LED cover
7 screw
(BVTP2.6)
5 connector
(CN901)
3 Remove the top panel block
in the direction of an arrow.
0 top panel assy
8 Remove the FRONT LED board
in the direction of an arrow.
9 FRONT LED board
4 Remove the wire from the clamp (L35).
–5HDUVLGHYLHZ–
3 All bosses are removed while
moving jig in the direction of
the arrow, and top panel assy
is
removed.
3 All bosses are removed while
moving jig in the direction of
the arrow, and top panel assy
is
removed.
2 Insert the jig into a space and raise
top panel assy.
Note 2: When using a jig, please work so
as not to injure top panel assy.
2 Insert the jig into a space and raise
top panel assy.
Note
2: When using a jig, please work so
as not to injure top panel assy.
• JIG
When disassembling the set, use the following jig (for speaker
When disassembling the set, use the following jig (for speaker
removal).
Part
No.
Description
J-2501-238-A
JIG FOR SPEAKER REMOVAL
