Sony NW-MS70D Service Manual ▷ View online
5
NW-MS70D
SECTION 4
DISASSEMBLY
Note :
Follow the disassembly procedure in the numerical order given.
4-1. CASE (U) SUB ASSY, PLAY UNIT
z
The equipment can be removed using the following procedure.
Case (R) ASSY
Case (R) sub ASSY
Set
Button (MS) ASSY, chassis (R) ASSY
Case (U) sub ASSY, play unit
MI-MH battery,
POWER board
POWER board
NAND board,
MAIN board
MAIN board
LCD board
7
3
8
1
Screw (M1.4x3)
4
Cable, flexible flat (20 core)
0
Shaft (play)
6
Case (U) sub ASSY
9
Play unit
5
Hold bumper
2
Screw (M1.4x3)
Case (R) ASSY
2
1
Screws
3
LCD board
4-2. LCD BOARD
6
NW-MS70D
4-4. NI-MH BATTERY, POWER BOARD
4-3. BUTTON (MS) ASSY, CHASSIS (R) ASSY
2
1
Button (MS) ASSY
5
Spring (shutter)
4
Shutter (MS)
6
Screws (M1.4x3)
3
Screw (M1.4x3)
7
Bracket (shutter)
8
Chassis (R) ASSY
Case (R) sub ASSY
2
3
Connector (CN501)
4
NI-MH battery
Chassis (R)
1
Connector (CN502)
5
POWER Board
Note on assembling POWER board
On assembling POWER board,
secure it to the gap on the chassis (R)
assembly.
On assembling POWER board,
secure it to the gap on the chassis (R)
assembly.
7
NW-MS70D
4-5. NAND BOARD, MAIN BOARD
3
1
1
5
MAIN Board
4
NAND Board
Shassis (R)
2
Connector (CN465)
Note on assembling NAND board
On assembling NAND board, secure
it to the gap on the chassis (R) assembly.
On assembling NAND board, secure
it to the gap on the chassis (R) assembly.
Note on assembling MAIN board
On assembling MAIN board, secure
it to the gap on the chassis (R) assembly.
On assembling MAIN board, secure
it to the gap on the chassis (R) assembly.
8
NW-MS70D
Note on Schematic Diagram:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
C
: panel designation.
•
: B+ Line.
• Power voltage is dc 1.2 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : PLAY
no mark : PLAY
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
F
: PLAY
E
: CHECK OUT
j
: CHECK IN
z
Waveforms
1
IC731
9
OSCOUT
Note on Printed Wiring Board
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Main boards is six-layer pritnted board.
However, the patterns of layer 2 to 5 have not been in-
cluded in this diagrams.
cluded in this diagrams.
1.1 Vp-p
32KHz
0.5V/div
10
µ
sec/div
SECTION 5
DIAGRAMS
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