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Model
NW-MS11
Pages
44
Size
1.82 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
nw-ms11.pdf
Date

Sony NW-MS11 Service Manual ▷ View online

17
NW-MS11
Note on Printed Wiring Boards:
X
: parts extracted from the component side.
Y
: parts extracted from the conductor side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
5-3.
NOTE  FOR  PRINTED  WIRING  BOARDS AND  SCHEMATIC DIAGRAMS
• Lead Layouts
surface
Lead layout of conventional IC
CSP (chip size package)
• MAIN board and SUB board are six-layer printed boards.
However, the patterns of layers 2 to 5 have not been included
in these diagrams.
*
Replacement of C5000, IC5600, IC7001and IC8000 used
in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
Note on Schematic Diagram:
• All capacitors are in 
µ
F unless otherwise noted.  pF: 
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
%
: indicates tolerance.
A
: B+ Line.
• Power voltage is dc 1.2 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
• no mark : PLAYBACK
(
) : when USB connection
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PLAYBACK
E
: Check-out
j
: Check-in
*
Replacement of IC5000, IC5600, IC7001and IC8000
used in this set requires a special tool.
18
NW-MS11
2.3 Vp-p
5.7 
µ
s
2.6 Vp-p
83 ns
4.3 Vp-p
5.7 
µ
s
• Waveforms
– MAIN board –
2
IC7001 
<z.m
 (FS256)
500 mV/DIV, 50 ns/DIV
3
IC1001 
8
 (OSCOUT)
500 mV/DIV, 10 
µ
s/DIV
1.2 Vp-p
30.6 
µ
s
1.9 Vp-p
89 ns
1.7 Vp-p
44.2 ns
4
IC8000 
9
 (XTAL1)
1 V/DIV, 50 ns/DIV
5
IC9005 
qs
qh
 (L2)
2 V/DIV, 2 
µ
s/DIV
6
IC9005 
wk
es
 (L1)
2 V/DIV, 2 
µ
s/DIV
7
IC9005 
th
 (CLK)
1 V/DIV, 2 
µ
s/DIV
9
Q9008 (drain)
2 V/DIV, 2 
µ
s/DIV
1
IC7001 
<zb/
 (XTO)
500 mV/DIV, 20 ns/DIV
2.8 Vp-p
5.7 
µ
s
3.5 Vp-p
4.2 
µ
s
5.8 Vp-p
3.5 
µ
s
8
Q9005 (drain) (USB connection)
2 V/DIV, 2 
µ
s/DIV
– SUB board –
2 Vp-p
22.8 
µ
s
2 Vp-p
352 ns
2.6 Vp-p
89 ns
qd
IC3100 
5
 (LRCK)
1 V/DIV, 10 
µ
s/DIV
qa
IC3100 
1
 (MCLK)
1 V/DIV, 50 ns/DIV
qs
IC3100 
3
 (BICK)
1 V/DIV, 200 ns/DIV
NW-MS11
19
19
5-4.
SCHEMATIC  DIAGRAM  – MAIN Section (1/4) –
 See page 18 for Waveforms.
 See page 27 for IC Block Diagrams.
(Page
20)
(Page 21)
(Page 22)
(Page 25)
NW-MS11
20
20
5-5.
SCHEMATIC  DIAGRAM  – MAIN Section (2/4) –
 See page 27 for IC Block Diagram.
µ
PD442002FQ-BB70X-BC1
(Page 19)
(Page 21)
(Page 22)
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