Sony NW-E8P Service Manual ▷ View online
6
NW-E8P
SECTION 3
DISASSEMBLY
Note :
Follow the disassembly procedure in the numerical order given.
<R-CH section>
3-1. DRIVER ASSY (SP2), ARM LID (R), HOLDER LID (R)
3-1. DRIVER ASSY (SP2), ARM LID (R), HOLDER LID (R)
<R-CH section>
3-2. MAIN BOARD, POWER BOARD, LCD UNIT
3-2. MAIN BOARD, POWER BOARD, LCD UNIT
z
The equipment can be removed using the following procedure.
Driver ASSY (SP2), Arm lid (R), Holder lid (R)
<R-CH section>
<L-CH section>
Main board, Power board, LCD unit
Set
Driver ASSY (SP1), Arm lid (L), Holder lid (L)
8
6
3
1
LCD unit
Holder (R) ASSY
Arm lid (R)
4
Remove solder
(2 places)
2
Turn to clockwise
to release lock.
Red
Black
Black
7
Screw B1.7x5
5
Screws
B1.7x5
7
Screw
B1.7x5
Front plate
Red
Ear pad
Driver ASSY (SP2)
Driver ASSY
Marking (red)
Red
Glue
Black
• Connection of driver ASSY
Arm lid (R) (rear side)
• Installation of holder lid (R)
and arm lid (R)
Claw
Holder lid (R) (rear side)
Holder lid (R)
5
3
1
Holder (R) ASSY
2
LCD flexible board
(Power board: CN705)
Power board
LCD unit
Knob (HOLD)
Cord (4 core)
4
Remove solder
(4 places)
Red
Red/clear (rear side)
Green/clear
Green
CN704
CN702
Main board
HOLD switch
(S704)
(S704)
z
Caution during assembly
Align HOLD switch (S704) with
the position of knob (HOLD).
the position of knob (HOLD).
7
NW-E8P
<L-CH section>
3-3. DRIVER ASSY (SP1), ARM LID (L), HOLDER LID (L)
3-3. DRIVER ASSY (SP1), ARM LID (L), HOLDER LID (L)
9
6
3
1
Driver ASSY
Ear pad
Marking
(red)
(red)
Red
Glue
Black
• Connection of driver ASSY
Red
Black
Black
Green
Red
Red
Red/clear
Green/clear
Cord (4 core)
• Wiring of cord (4 core)
Arm lid (L)
Front plate
2
Turn to clockwise
to release lock.
5
Screws
B1.7x5
8
Screw
B1.7x5
8
Screws B1.7x5
7
Open the battery lid.
Driver ASSY (SP1)
Holder lid (L)
Holder (L) ASSY
MDD flexible board
4
Remove solder
(2 places)
Note:
When soldering,
paying attention as
holder (L) doesn’t
transform it by a heat.
When soldering,
paying attention as
holder (L) doesn’t
transform it by a heat.
• Installation of holder lid (L)
and arm lid (L)
Claw
Holder lid (L)
Lid (L), arm
(rear side)
(rear side)
8
NW-E8P
SECTION 4
TEST MODE
Setting the Test Mode
To enter the test mode, two methods are available :
1. Entering method with key input.
1. Entering method with key input.
Turn the HOLD switch to ON. While holding down the Bx key, press the following keys in the following order :
VOLUME +
VOLUME +
t VOLUME – t VOLUME – t VOLUME + t VOLUME – t MEGA BASS t MEGA BASS t DISPLAY
Note :
Push each key for less than 3 seconds.
2. Entering method by shorting the test point.
Solder brige the test point SL701 (TEST) on the main board and turn on the power.
Releasing the TEST mode
1. When test mode was entered with key input, turn off the power supply.
2. When test mode was entered by shorting the test point, turn off the power supply and open the solder brige of SL701 (TEST) on the main
2. When test mode was entered by shorting the test point, turn off the power supply and open the solder brige of SL701 (TEST) on the main
board.
Test mode
Short : Test mode
Open : Normal mode
Short : Test mode
Open : Normal mode
(
)
1
4
regulated
DC power supply
Connecting cable
supplied with the set
supplied with the set
USB Connector
(1-784-009-11 or 1-779-676-11)
Set
Battery terminal
CN701
(USB Connector)
regulated
DC power supply
LCD
Check
Ver. /
destination
display
All display
lit
(+)
(–)
All display
off
Flash memory
bad block
check
Bx
Bx
(+)
(–)
(+)
(–)
Destination
setting
Contrast
adjustment
(–)
Low voltage
check
(–)
Bx
Bx
(–)
High DC
detection
detection
check
Low DC
detection
check
(+)
Supply 0.9V DC to battery
terminal and press (–) key.
terminal and press (–) key.
Supply 1.24V DC to battery
terminal and 7V DC to USB
connector and press (+) key.
terminal and 7V DC to USB
connector and press (+) key.
Supply 1.24V DC to battery
terminal and 4V DC to USB
connector and press (+) key.
terminal and 4V DC to USB
connector and press (+) key.
Configuration of Test Mode
The test mode has the configuration given below.
Bx
: Play/stop key
(+)
: VOLUME + key
(–)
: VOLUME – key
Connection
C
C703
C704
R764
R769
R7
7
R705
R703
R767
R783
R7
7
R7
7
JC722
X701
TP702
TP3 TP701
TP703
(TEST)
IC820
CN701
USB
CONNECTOR
4
4
1
1
1
2
2
3
3
5
5
5
13
(13)
1-681-242-
P701
D781
MAIN BOARD (SIDE B)
9
9
NW-E8P
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Main board is six-layer printed board.
However, the patterns of layers 2 to 5 have not been
included in this diagrams.
included in this diagrams.
Lead layout of
conventional IC
conventional IC
CSP (chip size package)
*
Replacement of IC710 used in the set requires a spe-
cial tool.
cial tool.
• Lead Layouts
surface
z
Waveforms
1
VOLT/DIV : 0.5 V AC
TIME/DIV : 0.2 nsec
TIME/DIV : 0.2 nsec
Note on Schematic Diagram:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
: B+ Line.
• Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAY
no mark : PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
J
: DIGITAL
F
: ANALOG
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
form that of conventional IC.
*
Replacement of IC710 used in the set requires a spe-
cial tool.
cial tool.
2
VOLT/DIV : 1 V AC
TIME/DIV : 20
TIME/DIV : 20
µ
sec
VOLT/DIV : 1 V AC
TIME/DIV : 20
TIME/DIV : 20
µ
sec
3
Q902
D
IC901
5
EXT
VOLT/DIV :1 V AC
TIME/DIV : 5
TIME/DIV : 5
µ
sec
4
Q903
D
1Vp-p
22.5792MHz
2.8Vp-p
3Vp-p
2.2Vp-p
10
µ
sec
IC701
<zb/
XTO
— MAIN SECTION —
— POWER SECTION —
LCD check
Check the condition of indication by all display is lit or not.
Bx key : check start
Flash memory bad block check
OK
: FL OK The back light turns on
NG
: FL NG The back light turns on and off
AVLS key : select the destination
AR J (AEP, E).
Destination setting
Bx key : Enter the destination
OK
: WT OK The back light turns on
NG
: WT NG The back light turns on and off
Contrast adjustment
Display
t LC45
contrast value (Initial value : 45)
>, . key : Select the contrast value.
Bx key
: Enter the contrast value.
Normally, do not perform this adjustment.
Low voltage check
Low voltage detection check
OK
: LB OK The back light turns on
NG
: LB NG The back light turns on and off
Battery high voltage detection check
High DC detection check
OK
: HD OK The back light turns on
NG
: HD NG The back light turns on and off
Battery low voltage detection check
Low DC detection check
OK
: LD OK The back light turns on
NG
: LD NG The back light turns on and off
Description of each Mode ( : indication on display)
R
The regulated DC power supply voltage supplied to USB connector on checking each voltage value.
OK
NG
Low voltage check
0.9V
1.0V or more
High DC detection check
7.0V or more
6.0V or less
Low DC detection check
4.0V or less
5.0V or more
SECTION 5
DIAGRAMS
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