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Model
NW-E5
Pages
26
Size
25.53 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
nw-e5.pdf
Date

Sony NW-E5 Service Manual ▷ View online

10
NW-E5
LCD check
Check the condition of indication by all display is lit or not.
Bx key : check start
Flash memory bad block check
OK
:  Flash  The back light turns on
NG
:  Flash  The back light turns on and off
AVLS key : select the destination
  AREA E-12  (AEP, UK, Franch, German).
Destination setting
Bx key : Enter the destination
OK
: The back light turns on
NG
: The back light turns on and off
Contrast adjustment
Display 
n LCD 45 – 13
contrast value (Initial value : 45)
>, . key  : Select the contrast value.
Bx key
: Enter the contrast value.
Normally, do not perform this adjustment.
Low voltage check
Low voltage detection check
OK
:  Lo Bat OK  The back light turns on
NG
:  Lo Bat NG  The back light turns on and off
Battery high voltage detection check
High DC detection check
OK
:  Hi DC OK  The back light turns on
NG
:  Hi DC NG  The back light turns on and off
Battery low voltage detection check
Low DC detection check
OK
:  Lo DC OK  The back light turns on
NG
:  Lo DC NG  The back light turns on and off
Description of each Mode (         : indication on display)
n
The regulated DC power supply voltage supplied to USB connector on checking each voltage value.
OK
NG
Low voltage check
0.9V
1.0V or more
High DC detection check
7.0V or more
6.0V or less
Low DC detection check
4.0V or less
5.0V or more
11
11
NW-E5
SECTION 5
DIAGRAMS
5-1. BLOCK DIAGRAMS
• Signal path.
F
: ANALOG
J
: DIGITAL
12
12
NW-E5
5-2. PRINTED WIRING BOARDS – MAIN SECTION –
 D781
C-6
 D782
E-7
 D783
B-2
 IC710
E-3
 IC751
C-3
 IC752
E-4
 IC753
C-5
 IC810
A-3
 IC820
B-1
 IC851
D-6
 IC852
B-7
 IC853
B-7
 Q710
F-1
 Q831
B-1
 Q832
B-1
 Q833
C-1
Ref. No.
Location
z
 Semiconductor
   Location
Note:
• X : parts extracted from the component side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
  Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Main board is six-layer printed board.
However, the patterns of layers 2 to 5  have not been
included in this diagrams.
Lead layout of
conventional IC
CSP (chip size package)
* Replacement of IC710 used in the set requires a spe-
cial tool.
• Lead Layouts
surface
02
R764
R773
R767
R771
R752
C757
C703
C721
C722
C723
C724
C725
R703
R757
R783
R772
R707
JC701
R706
R770
R769
R716
R774
R775
R786 R705
JC722
C727
C704
C719 C720
C730
C701
C726
Q701
C763
C702
1
2
5
15
20
25 29
30
10
CN702
IC710
C731
C735
C732
C736
C737
C738
C739
C740
C741
R717
FB703
R777
JC705
R776
JC706
R731
R782
R781
R780
R779
R778
C729
C733
C851
C753
C755
R762 R761 R760
C734
FB702
FB704
JC739
1
5
7
14
10
8
IC851
1
5
14
10 8
IC852
1
5
15
20
10
11
IC853
D782
JC746
JC723
T701
P701
1
5
10
15
20
22
CN701
USB
CONNECTOR
R924
R925
C852
C853
D781
C761
C762
C752
C751
C728
C804
TP2
1
25
24
15
20
48
45
40
30
35
5
10
IC752
1
25
24
15
20
48
45
40
30
35
5
10
IC753
1
25
24
15
20
48
45
40
30
35
5
10
IC751
1
5
10
15
13
20
24
25
30
3536
37
40
45
48
12
IC810
R801
R802
R805
R804
R814
C801
C617
C808
C802
C803
X801
D783
R806
R812 R813
R811
R810
R702
JC704
TP3
SL701
(TEST)
TP701
Q833
Q831
Q832
IC820
1
2
3
4
5
C616
C807
G
S
D
A
POWER BOARD
CN704
11
(11)
1-680-217-
11
(11)
1-680-217-
*
MAIN BOARD   (SIDE B)
MAIN BOARD   (SIDE A)
2
3
4
5
6
7
8
9
A
1
B
C
D
E
F
G
BCE
X701
 : Uses unleaded solder.
13
13
NW-E5
5-3. SCHEMATIC DIAGRAM  – MAIN SECTION (1/2) –
IC B/D
IC B/D
IC B/D
z
 See page 17 for Notes.
    z
 See page 17 for IC Block Diagrams
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