Sony NAS-50HDE / SS-50HDE Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
AEP Model
UK Model
HDD NETWORK AUDIO SYSTEM
9-887-677-04
2008H16-1
© 2008.08
© 2008.08
NAS-50HDE/SS-50HDE
CD
Model Name Using Similar Mechanism
NEW
Section
CD-ROM Drive Name
CD5010A
— Continued on next page —
US and foreign patents licensed from
Dolby Laboratories.
Dolby Laboratories.
Photo: AEP Model
SPECIFICATIONS
Amplifier section
DIN power output (rated):
DIN power output (rated):
68 + 68 W (4
Ω at 1 kHz, DIN)
Continuous RMS power output (reference):
85 + 85 W (4
Ω at 1 kHz, 10 % THD)
Music Power output (reference):
85 + 85 W (4
Ω at 1 kHz, 10 % THD)
CD player section
System:
System:
Compact disc and digital audio system
Laser Diode Properties:
Emission duration: continuous
Laser Output*: Less than 44.6
Laser Output*: Less than 44.6
µ
w
* This output is the value measurement at a
distance of 200 mm from the objective lens
surface on the Optical Pick-up Block with
7 mm aperture.
surface on the Optical Pick-up Block with
7 mm aperture.
Frequency response:
20 Hz - 20 kHz (
±
0.5 dB)
Total harmonic distortion:
less than 0.1 %
HDD Jukebox section
Capacity:
Capacity:
80 GB*
Recording system:
ATRAC3
ATRAC3plus
MP3
Linear PCM
ATRAC3plus
MP3
Linear PCM
Maximum recording time (measured with ATRAC
48 kbps):
48 kbps):
About 3,400 h
Maximum number of tracks:
40,000
* A portion of the memory is used for system
management functions. Actual available memory
is approx. 68 GB (73,014,444,032 bytes).
is approx. 68 GB (73,014,444,032 bytes).
Tuner section
FM stereo, FM/AM superheterodyne tuner
Circuit system:
FM stereo, FM/AM superheterodyne tuner
Circuit system:
PLL digital frequency synthesizer quarts lock
system
system
FM tuner section
Frequency range:
87.5 - 108.0 MHz (50 kHz step)
Antenna:
FM wire antenna
Antenna terminals:
75
Ω unbalanced
Intermediate frequency:
10.7 MHz
AM tuner section
Frequency range:
531 - 1,602 kHz (with the interval set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
DAB tuner section (UK model only)
DAB stereo tuner
Antenna:
Antenna:
DAB wire antenna
Frequency range:
Band-III: 174.928 (5A)
–
239.200 (13F) MHz
DAB frequency table (Band-III)
Frequency
Label
Frequency
Label
174.928 MHz
5A
209.936 MHz
10A
176.640 MHz
5B
211.648 MHz
10B
178.352 MHz
5C
213.360 MHz
10C
180.064 MHz
5D
215.072 MHz
10D
181.936 MHz
6A
216.928 MHz
11A
183.648 MHz
6B
218.640 MHz
11B
185.360 MHz
6C
220.352 MHz
11C
187.072 MHz
6D
222.064 MHz
11D
188.928 MHz
7A
223.936 MHz
12A
190.640 MHz
7B
225.648 MHz
12B
192.352 MHz
7C
227.360 MHz
12C
194.064 MHz
7D
229.072 MHz
12D
195.936 MHz
8A
230.784 MHz
13A
197.648 MHz
8B
232.496 MHz
13B
199.360 MHz
8C
234.208 MHz
13C
201.072 MHz
8D
235.776 MHz
13D
202.928 MHz
9A
237.488 MHz
13E
204.640 MHz
9B
239.200 MHz
13F
206.352 MHz
9C
208.064 MHz
9D
* Frequencies are displayed with two decimal places
on this unit.
Ver. 1.3 2008.08
2
NAS-50HDE/SS-50HDE
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Inputs/Outputs
AUDIO IN (front: stereo minijack), AUDIO IN
(rear: phono jacks):
AUDIO IN (front: stereo minijack), AUDIO IN
(rear: phono jacks):
Voltage 0.8 V (standard), impedance 10 k
Ω
/
1.5 V (low sensitivity), impedance 10 k
Ω
(rear)
MONITOR OUT (phono jack):
1 Vp-p, 75
Ω
unbalanced
AUDIO OUT (phono jacks):
Voltage 0.5 V, impedance 680
Ω
NETWORK port:
10BASE-T/100BASE-TX
USB connecting jack:
USB type A, Hi-Speed USB for connecting USB
devices such as “WALKMAN” (ATRAC AD)
devices such as “WALKMAN” (ATRAC AD)
i
(headphones) (stereo mini jack):
accepts headphones of 8
Ω
or more
Speaker (SS-50HDE)
Speaker system:
Speaker system:
2-way, bass-reflex type
Speaker units:
Woofer: 130 mm, cone type
Tweeter: 25 mm, soft dome type
Tweeter: 25 mm, soft dome type
Nominal impedance:
4
Ω
Dimensions (w/h/d)
Approx. 159
×
237
×
220 mm
Mass
Approx. 2.7 kg net per speaker
General
Power requirements:
Power requirements:
230 V AC, 50/60 Hz
Power consumption:
65 W (0.5 W or lower at the standard start-up
mode)
mode)
Dimensions (w/h/d) (Approx.):
165
×
254
×
282 mm incl. projecting parts and
controls
Mass (Approx.):
5.3 kg
Operating temperature:
+5
°
C (+41
°
F) to +35
°
C (+95
°
F)
Operating humidity:
25 % to 80 %
Supplied accessories:
Speaker cords (2)
Speaker pads (8)
FM wire antenna (1)
AM loop antenna (1)
DAB wire antenna (1) (for the UK model only)
Remote control (1)
LR6 (size AA) batteries (2)
Operating Instructions (1)* See Note
Quick connection and operating guide (1)* See Note
Speaker pads (8)
FM wire antenna (1)
AM loop antenna (1)
DAB wire antenna (1) (for the UK model only)
Remote control (1)
LR6 (size AA) batteries (2)
Operating Instructions (1)* See Note
Quick connection and operating guide (1)* See Note
U.S. and foreign patents licensed from Dolby
Laboratories.
Laboratories.
Design and specifications are subject to change
without notice.
without notice.
Trademarks
•
This software is based in part on the work of the Independent
JPEG Group.
JPEG Group.
•
ATRAC, , OpenMG and are
trademarks of Sony Corporation.
trademarks of Sony Corporation.
•
“WALKMAN”, and are registered
trademarks of Sony Corporation.
trademarks of Sony Corporation.
•
US and foreign patents licensed from Dolby Laboratories.
•
MPEG Layer-3 audio coding technology and patents licensed
from Fraunhofer IIS and Thomson.
from Fraunhofer IIS and Thomson.
•
Microsoft and Windows are trademarks or registered
trademarks of Microsoft Corporation in the United States and/
or other countries.
trademarks of Microsoft Corporation in the United States and/
or other countries.
•
The font type (Shin Go R) installed in this unit is provided by
MORISAWA & COMPANY LTD.
These names are the trademarks of MORISAWA &
COMPANY LTD., and the copyright of the font also belongs
to MORISAWA & COMPANY LTD.
MORISAWA & COMPANY LTD.
These names are the trademarks of MORISAWA &
COMPANY LTD., and the copyright of the font also belongs
to MORISAWA & COMPANY LTD.
•
Built with Linter Database.
Copyright
Copyright
2006-2007, Brycen Corp., Ltd.
Copyright
1990-2003, Relex, Inc., All rights reserved.
•
Music recognition technology and related data are provided
by Gracenote®. Gracenote is the industry standard in music
recognition technology and related content delivery. For more
information visit www. gracenote.com.
CD and music-related data from Gracenote, Inc., copyright
by Gracenote®. Gracenote is the industry standard in music
recognition technology and related content delivery. For more
information visit www. gracenote.com.
CD and music-related data from Gracenote, Inc., copyright
2000-2006 Gracenote. Gracenote Software, copyright
2000-
2006 Gracenote. This product and service may practice one
or more of the following U.S. Patents: #5,987,525; #6,061,680;
#6,154,773, #6,161,132, #6,230,192, #6,230,207, #6,240,459,
#6,330,593, and other patents issued or pending. Some services
supplied under license from Open Globe, Inc. for U.S. Patent:
#6,304,523. Gracenote and CDDB are registered trademarks
of Gracenote. The Gracenote logo and logotype, and the
“Powered by Gracenote” logo are trademarks of Gracenote.
or more of the following U.S. Patents: #5,987,525; #6,061,680;
#6,154,773, #6,161,132, #6,230,192, #6,230,207, #6,240,459,
#6,330,593, and other patents issued or pending. Some services
supplied under license from Open Globe, Inc. for U.S. Patent:
#6,304,523. Gracenote and CDDB are registered trademarks
of Gracenote. The Gracenote logo and logotype, and the
“Powered by Gracenote” logo are trademarks of Gracenote.
Note:
“Operating Instructions” and “Quick connection and operating
guide” are prepared separately for the destinations of CE1 and
CE2 respectively.
For details, refer to “SECTION 6. ELECTRICAL PATS LIST,
ACCESSORIES” on page 94.
guide” are prepared separately for the destinations of CE1 and
CE2 respectively.
For details, refer to “SECTION 6. ELECTRICAL PATS LIST,
ACCESSORIES” on page 94.
•
Abbreviation
CE1 : For AEP model
CE2 : For AEP model
CE1 : For AEP model
CE2 : For AEP model
3
NAS-50HDE/SS-50HDE
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
7
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 13
3-2.
Top Cover, Case (L/R) ..................................................... 14
3-3.
Front Panel Section ......................................................... 14
3-4.
PANEL L Board .............................................................. 15
3-5.
PANEL U Board .............................................................. 15
3-6.
Holder (LCD) Assy ......................................................... 16
3-7.
LCD Board, LCD Module ............................................... 16
3-8.
Top Chassis ...................................................................... 17
3-9.
MOTHER Board ............................................................. 17
3-10. PS Board .......................................................................... 18
3-11. MAIN Board .................................................................... 19
3-12. D AMP Board .................................................................. 20
3-13. Rear Panel Assy ............................................................... 21
3-14. DC Fan, Tuner (FM/AM), SP OUT Board ...................... 21
3-15. Rear Panel Assy (UK Model) .......................................... 22
3-16. DAB POWER Board (UK Model) .................................. 22
3-17. DC Fan, Tuner (FM/AM), SP OUT Board (UK Model) . 23
3-18. Chassis, Bracket (S-master) ............................................ 23
3-19. Hdd .................................................................................. 24
3-20. CD-ROM Drive ............................................................... 24
3-21. HP/USB/LINE IN Board ................................................. 25
3-22. Eject ................................................................................. 25
3-11. MAIN Board .................................................................... 19
3-12. D AMP Board .................................................................. 20
3-13. Rear Panel Assy ............................................................... 21
3-14. DC Fan, Tuner (FM/AM), SP OUT Board ...................... 21
3-15. Rear Panel Assy (UK Model) .......................................... 22
3-16. DAB POWER Board (UK Model) .................................. 22
3-17. DC Fan, Tuner (FM/AM), SP OUT Board (UK Model) . 23
3-18. Chassis, Bracket (S-master) ............................................ 23
3-19. Hdd .................................................................................. 24
3-20. CD-ROM Drive ............................................................... 24
3-21. HP/USB/LINE IN Board ................................................. 25
3-22. Eject ................................................................................. 25
4.
DIAGRAMS
4-1.
Block Diagram — MAIN Section — ............................. 28
4-2.
Block Diagram — MOTHER 1 Section — .................... 29
4-3.
Block Diagram — MOTHER 2 Section — .................... 30
4-4.
Block Diagram — POWER Section — .......................... 31
4-5.
Printed Wiring Board — D AMP Board — ................... 32
4-6.
Schematic Diagram — D AMP Board — ...................... 33
4-7.
Printed Wiring Board
— MOTHER Board (Side A) — ..................................... 34
— MOTHER Board (Side A) — ..................................... 34
4-8.
Printed Wiring Board
— MOTHER Board (Side B) — ..................................... 35
— MOTHER Board (Side B) — ..................................... 35
4-9.
Schematic Diagram — MOTHER Board (1/8) — ......... 36
4-10. Schematic Diagram — MOTHER Board (2/8) — ......... 37
4-11. Schematic Diagram — MOTHER Board (3/8) — ......... 38
4-11. Schematic Diagram — MOTHER Board (3/8) — ......... 38
4-12. Schematic Diagram — MOTHER Board (4/8) — ......... 39
4-13. Schematic Diagram — MOTHER Board (5/8) — ......... 40
4-14. Schematic Diagram — MOTHER Board (6/8) — ......... 41
4-15. Schematic Diagram — MOTHER Board (7/8) — ......... 42
4-16. Schematic Diagram — MOTHER Board (8/8) — ......... 43
4-17. Printed Wiring Boards — PANEL Section — ................ 44
4-18. Schematic Diagram — PANEL Section — .................... 45
4-19. Printed Wiring Board
4-13. Schematic Diagram — MOTHER Board (5/8) — ......... 40
4-14. Schematic Diagram — MOTHER Board (6/8) — ......... 41
4-15. Schematic Diagram — MOTHER Board (7/8) — ......... 42
4-16. Schematic Diagram — MOTHER Board (8/8) — ......... 43
4-17. Printed Wiring Boards — PANEL Section — ................ 44
4-18. Schematic Diagram — PANEL Section — .................... 45
4-19. Printed Wiring Board
— MAIN Board Suffix-11 (Side A) — ........................... 46
4-20. Printed Wiring Board
— MAIN Board Suffix-11 (Side B) — ........................... 47
4-21. Printed Wiring Board
— MAIN Board Suffix-21 (Side A) — ........................... 48
4-22. Printed Wiring Board
— MAIN Board Suffix-21 (Side B) — ........................... 49
4-23. Schematic Diagram — MAIN Board (1/3) — ............... 50
4-24. Schematic Diagram — MAIN Board (2/3) — ............... 51
4-25. Schematic Diagram — MAIN Board (3/3) — ............... 52
4-26. Printed Wiring Boards
4-24. Schematic Diagram — MAIN Board (2/3) — ............... 51
4-25. Schematic Diagram — MAIN Board (3/3) — ............... 52
4-26. Printed Wiring Boards
— LCD Board, LCD-SUB Board — .............................. 53
4-27. Schematic Diagram
— LCD Board, LCD-SUB Board — .............................. 54
4-28. Printed Wiring Boards
— HP/USB/LINE IN Board, SP OUT Board — ............ 55
4-29. Schematic Diagram
— HP/USB/LINE IN Board, SP OUT Board — ............ 56
4-30. Printed Wiring Board — PS Board — ........................... 57
4-31. Schematic Diagram — PS Board — .............................. 58
4-32. Printed Wiring Board
4-31. Schematic Diagram — PS Board — .............................. 58
4-32. Printed Wiring Board
— DAB POWER Board (UK) — .................................... 59
4-33. Schematic Diagram
— DAB POWER Board (UK) — .................................... 60
5.
EXPLODED VIEWS
5-1.
Overall Section ................................................................ 73
5-2.
Front Panel Section ......................................................... 74
5-3.
Chassis Section-1 ............................................................ 75
5-4.
Chassis Section-2 ............................................................ 76
5-5.
Speaker (SS-50HDE) ...................................................... 77
6.
ELECTRICAL PARTS LIST
.................................. 78
4
NAS-50HDE/SS-50HDE
About the self-diagnosis function
How to reset the unit
It is usually unnecessary to reset this unit. However, on rare
occasions, the unit enters an abnormal state and stops responding
to button or on-screen operations. In this case, reset the unit by
pressing the x button together with the ?/1 (power) button on the
unit.
occasions, the unit enters an abnormal state and stops responding
to button or on-screen operations. In this case, reset the unit by
pressing the x button together with the ?/1 (power) button on the
unit.
About repairing the hard disk drive
•
The contents of the hard disk drive may be checked in case of
repair or inspection during a malfunction or modification.
However, the contents will not be backed up or saved by Sony.
repair or inspection during a malfunction or modification.
However, the contents will not be backed up or saved by Sony.
•
If the hard disk needs to be formatted or replaced, it will be
done at the discretion of Sony. All contents of the hard disk
drive will be erased, including contents that violate copyright
laws.
done at the discretion of Sony. All contents of the hard disk
drive will be erased, including contents that violate copyright
laws.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SECTION 1
SERVICING NOTES
This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT
MARKING is located on the rear
exterior.
CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT
MARKING is located on the rear
exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
Replacement of MOTHER board IC1001, IC1002, IC2001,
IC2101, IC4001, IC9101, IC9201, or IC9301
IC2101, IC4001, IC9101, IC9201, or IC9301
•
If IC1001, IC1002, IC2001, IC2101, IC4001, IC9101, IC9201,
or IC9301 of the MOTHER board is damaged and needs
replacement, replace the entire MOTHER board with the new
replacement MOTHER board because the individual IC cannot
be replaced separately.
or IC9301 of the MOTHER board is damaged and needs
replacement, replace the entire MOTHER board with the new
replacement MOTHER board because the individual IC cannot
be replaced separately.
A service number consisting of five
alphanumeric letters (e.g., E 00 11)
appears in the display when the self-
diagnosis function activates to prevent
abnormal operation.
alphanumeric letters (e.g., E 00 11)
appears in the display when the self-
diagnosis function activates to prevent
abnormal operation.
When this service number appears, consult the local authorized
service facility and report this service number to the service
personnel.
service facility and report this service number to the service
personnel.
Note on replacement of MOTHER BOARD and HDD
•
When MOTHER BOARD and HDD is replaced, in initial
setting using the jig is required.
When replacement of MOTHER BOARD and HDD becomes
necessary, contact Sony Service Center of your local area.
setting using the jig is required.
When replacement of MOTHER BOARD and HDD becomes
necessary, contact Sony Service Center of your local area.
Ver. 1.3
Note on replacement of MAIN board IC501
•
If IC501 of the MAIN board is damaged and need replacement,
replace the entire MAIN board with the new replacement
MAIN board because the individual IC cannot be replaced
separately.
replace the entire MAIN board with the new replacement
MAIN board because the individual IC cannot be replaced
separately.