DOWNLOAD Sony MHC-VX888 (serv.man2) Service Manual ↓ Size: 12.49 MB | Pages: 83 in PDF or view online for FREE

Model
MHC-VX888 (serv.man2)
Pages
83
Size
12.49 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mhc-vx888-sm2.pdf
Date

Sony MHC-VX888 (serv.man2) Service Manual ▷ View online

SERVICE MANUAL
MINI HI-FI COMPONENT SYSTEM
E Model
SPECIFICATIONS
HCD-VX888
Ver 1.4  2003.05
9-873-817-15
Sony Corporation
2003E05-1
Home Audio Company
C
 2003.05
Published by Sony Engineering Corporation
VIDEO CD/CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(
λ
=780nm)
Laser Output
Max. 44.6 
µ
W*
*This output is the value
measured at a distance of
200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
Frequency response
2 Hz – 20 kHz (
±
0.5 dB)
Wave length
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format
NTSC, PAL
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length
660 nm
Output level
–18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±
3 dB),
(DOLBY NR OFF)
using Sony TYPE I
cassette
40 – 14,000 Hz (
±
3 dB),
using Sony TYPE II
cassette
Wow and flutter
±
0.15% W.Peak (IEC)
0.1% W.RMS (NAB)
±
0.2% W.Peak (DIN)
Amplifier section
The following measured at AC 120, 220, 240V,
50/60 Hz
DIN power output (rated) 160 + 160 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
200 + 200 watts
(6 ohms at 1 kHz, 10%
THD)
Inputs
GAME (VIDEO):
1Vp-p, 75 ohms
(phono jacks)
GAME (AUDIO):
voltage 250 mV,
(phono jacks)
impedance 47 kilohms
MD/VIDEO (AUDIO) IN: voltage 450 mV/250 mV,
(phono jacks)
impedance 47 kilohms
MIC 1/2:
sensitivity 1 mV,
(phone jack)
impedance 10 kilohms
Outputs
VIDEO OUT:
max. output level
(phono jacks)
1 Vp-p, unbalanced,
Sync negative, load
impedance
75 ohms
S. VIDEO  OUT:
Y: 1 Vp-p, unbalanced,
(4-pin/mini-DIN jack)
Sync negative,
C: 0.286Vp-p,
load impedance 75 ohms
AUDIO OUT:
voltage 140 mV,
(phono jacks)
impedance 47 kilohms
PHONES:
accepts headphones of 8
(stereo mini jack)
ohms or more
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
SURROUND SPEAKER: accepts impedance of
6 to 16 ohms
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Latin American models:
530 – 1,710 kHz
(with the interval set at
10 kHz)
531 – 1,710 kHz
(with the interval set at
9 kHz)
Middle Eastern models:
531 – 1,602 kHz
(with the interval set at
9 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
• HCD-VX888 is the tuner, deck, Video CD
and amplifier section in MHC-VX888.
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol 
;
 are trade-
marks of Dolby Laboratories Licensing Corporation.
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM58E-30BD61A
Section
Base Unit Name
BU-30BD61A
Optical Pick-up Name
A-MAX.3
Tape deck
Model Name Using Similar Mechanism
HCD-DX80
Section
Tape Transport Mechanism Type
TCM-230AWR41
– Continued on next page –
2
HCD-VX888
General
Power requirements
Australian models:
230 – 240 V AC,
50/60 Hz
Mexican models:
120 V AC, 60 Hz
Thailand models:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Power consumption
250 watts
Dimensions (w/h/d)
Approx. 280 x 360 x 425
mm
Mass
Approx. 10.5 kg
Design and specifications are subject to change
without notice.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
E3, EA, SP2/6, IA models
E91 model
PARTS No.
4-232-028-2
[]
4-232-028-4
[]
• Abbreviation
E3
: 240 V AC Area in E model
E91
: 220 V AC Area in E model
EA
: Saudi Arabia model
SP2/6 : Malaysia, singapore model
IA
: Indonesia model
PARTS No.
3
HCD-VX888
1.
GENERAL
...................................................................
4
2.
DISASSEMBLY
2-1. Disassembly Flow ...........................................................
7
2-2. Case (Top) .......................................................................
8
2-3. Loading Panel ..................................................................
8
2-4. CD Mechanism Deck (CDM58E-30BD61A) ................
9
2-5. Front Panel Section .........................................................
9
2-6. Tape Mechanism Deck (TCM-230AWR41) ................... 10
2-7. Back Panel Section .......................................................... 10
2-8. Main Board ...................................................................... 11
2-9. LEAF SW Board, HEAD (A) Board,
HEAD (B) Board ............................................................ 11
2-10. Base Unit (BU-30BD61A) .............................................. 12
2-11. VIDEO Board, DRIVER Board ..................................... 12
2-12. MOTOR Board, ADDRESS SENSOR Board ................ 13
3.
TEST MODE
............................................................... 14
4.
MECHANICAL ADJUSTMENTS
........................ 17
5.
ELECTRICAL ADJUSTMENTS
.......................... 17
6.
DIAGRAMS
6-1. Block Diagram  – TUNER/CD Section – ....................... 23
6-2. Block Diagram  – MAIN Section – ................................ 24
6-3. Block Diagram  – DISPLAY/POWER Section – ........... 25
6-4. Block Diagram  – VIDEO CD Section – ........................ 26
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 27
6-6. Schematic Diagram  – BD Board – ................................ 28
6-7. Printed Wiring Board  – BD Board – ............................. 29
6-8. Schematic Diagram  – MAIN Board (1/4) – .................. 30
6-9. Schematic Diagram  – MAIN Board (2/4) – .................. 31
6-10. Schematic Diagram  – MAIN (3/4)/HEAD Board – ...... 32
6-11. Schematic Diagram  – MAIN Board (4/4) – .................. 33
6-12. Printed Wiring Board  – MAIN Board – ........................ 34
6-13. Schematic Diagram  – VIDEO SWITCH Board – ......... 35
6-14. Printed Wiring Boards  – HEAD (A)/(B) Board – ......... 35
6-15. Printed Wiring Board  – VIDEO SWITCH Board – ...... 35
6-16. Schematic Diagram
– POWER AMP/SENSOR Board – ................................ 36
6-17. Printed Wiring Boards
– POWER AMP/SENSOR Board – ................................ 37
6-18. Schematic Diagram  – PANEL Board – .......................... 38
6-19. Printed Wiring Board  – PANEL Board – ....................... 39
6-20. Schematic Diagram
– CD SWITCH/PAD SWITCH Board – ........................ 40
6-21. Printed Wiring Boards
– CD SWITCH/PAD SWITCH Board – ........................ 41
6-22. Schematic Diagram  – LEAF SW Board – ..................... 42
6-23. Printed Wiring Board  – LEAF SW Board – .................. 42
6-24. Schematic Diagram
– ADDRESS SENSOR/DRIVER/MOTOR Board – ...... 43
6-25. Printed Wiring Boards
– ADDRESS SENSOR/DRIVER/MOTOR Board – ...... 43
6-26. Schematic Diagram  – VIDEO Board (1/3) – ................ 44
6-27. Schematic Diagram  – VIDEO Board (2/3) – ................ 45
6-28. Schematic Diagram  – VIDEO Board (3/3) – ................ 46
6-29. Printed Wiring Board  – VIDEO Board – ....................... 47
6-30. Schematic Diagram
 – MAIN TRANS/SUB TRANS Board – ....................... 48
6-31. Printed Wiring Boards
– MAIN TRANS/SUB TRANS Board – ........................ 49
6-32. IC Pin Function Description ........................................... 55
TABLE  OF  CONTENTS
7.
EXPLODED VIEWS
7-1. Cabinet Section ............................................................... 60
7-2. Front Panel Section ......................................................... 61
7-3. Main Board Section ........................................................ 62
7-4. CD Mechanism Deck Section (CDM58E-30BD61A) ... 63
7-5. Base Unit Section (BU-30BD61A) ................................ 64
7-6. Tape Mechanism Deck Section-1 (TCM-230AWR41) .... 65
7-7. Tape Mechanism Deck Section-2 (TCM-230AWR41) .... 66
8.
ELECTRICAL PARTS LIST
.................................. 67
4
HCD-VX888
SECTION  1
GENERAL
This section is extracted from
instruction manual.
4
Parts Identification
Main unit
The items are arranged in alphabetical order. Refer to the pages indicated in parentheses ( ) for
details.
1
2
3
4
5
6
7
8
9
0
L
K
M
N
O
P
Q
R
T
U
V
W
S
X
wg
wh
wj
wk
wl
ea es ed ef
rd
rs
ra r; el
eg
ej
eh
ek
rf
e;
CD 6 (9, 11~14, 20, 22)
CD SYNC HI-DUB qj (21, 22)
CINEMA SPACE el (25)
DECK A Z wf (20, 21)
DECK B Z qd (20, 21)
DIRECTION ed (20~22, 27)
DISC 1~3 2 (11~14, 22)
DISC SKIP/EX-CHANGE 4
(11~14)
Disc tray 3 (11)
DISPLAY ea (10, 15, 32)
DOLBY NR ef (20~22)
ECHO LEVEL wj (26)
EDIT ed (21)
EFFECT ON/OFF rd (24, 26)
ENTER ej (10, 12, 14, 17, 18, 23,
25, 28, 33)
FM MODE ef (19, 33)
GAME e; (29)
GAME EQ rs (8, 24, 29)
GROOVE ra (24)
KARAOKE PON wl (26)
MD (VIDEO) 9 (29, 32)
MIC 1/2 wg (26)
MIC LEVEL wh (26)
MOVIE EQ eh (8, 24, 29)
MUSIC EQ rf (8, 24, 29)
P FILE ek (25)
PICTURE EFFECT wd (17)
PHONES jack qs
: Connect the headphones
PLAY MODE eg (11, 13, 22, 33)
REC PAUSE/START qg (21, 22,
27)
REPEAT ef (12, 14)
SHUTTLE qa (12, 13)
SPECTRUM es (26)
SURROUND SPEAKER MODE
wk (24)
TAPE A/B 8 (20, 21, 27)
TUNER/BAND 7 (18, 19, 21)
TUNER MEMORY eg (18)
VOLUME control q; (28)
: Adjusts the volume.
BUTTON DESCRIPTIONS
@/1 (power) 1 (8, 9, 19, 29, 32,
33)
Z OPEN/CLOSE (disc tray)
5 (11, 12, 14)
x (stop) w; (11~13, 16, 17, 20,
21, 33)
nN (play) ql (11~14, 16, 21,
27)
> (go forward) qh (11~14,
16~21)
X (pause) qk (11, 13, 20, 21)
. (go back) wa (11~14, 16~21)
m/– (rewind) ws (12, 13,
17~21, 33)
M/+ (fast forward) qf (12, 13,
17~21)
v/V/b/B (cursor) r; (10, 22, 25,
28)
Page of 83
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  • Here you can View online or download the Service Manual for the Sony MHC-VX888 (serv.man2) in PDF for free, which will help you to disassemble, recover, fix and repair Sony MHC-VX888 (serv.man2) Audio. Information contained in Sony MHC-VX888 (serv.man2) Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.