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2015E33-1

© 

2015.05

Model Name Using Similar Mechanism

NEW

DVD Mechanism Type

CDM90-DVBU202 or CDM90-DVBU204

Optical Pick-up Block Name

CMS-S76RFS7G or CMS-S76RFS7G1 
or CMS-S76RFS7GP

Note:
Be sure to keep your PC used for service and 
checking of this unit always updated with the 
latest version of your anti-virus software.
In case a virus affected unit was found during 
service, contact your Service Headquarters. 

Power output (rated):

Left/Right Channel: 320 W + 
320 W (at 5 ohms, 1 kHz, 1% THD)

Power output (reference):

Left/Right Channel: 480 W + 
480 W (per channel at 5 ohms,
1 kHz)

100 Hz)

Subwoofer: 480 W (at 5 ohms, 

Speaker system: Tweeter + Mid range 

speaker + woofer

Tweeter L/R: 40 mm cone type
Mid L/R: 100 mm cone type
Woofer: 250 mm cone type

AUDIO IN/PARTY CHAIN IN L/R:

Voltage 2 V, impedance 
47 kilohms

MIC 1, MIC 2:

Sensitivity 1 mV, impedance 
10 kilohms

 A (USB), 

 B (USB) port:

Type A, maximum current: 
500 mA

AUDIO OUT/PARTY CHAIN OUT L/R:

Voltage 2 V, impedance 
47 kilohms

VIDEO OUT:

Max. output level 1 Vp-p, 
unbalanced, Sync. negative load 
impedance 75 ohms

– iPhone 5s
– iPhone 5c
– iPhone 5
– iPhone 4s
– iPhone 4
– iPhone 3GS
– iPod touch (5th generation)
– iPod touch (4th generation)

System:

Compact disc and digital audio 
and video system

Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
*  This output is the value 

measurement at a distance of 
200 mm from the objective lens 
surface on the Optical Pick-up 
Block with 7 mm aperture.

Frequency response:

Signal-to-noise ratio:

Dynamic range:

Video color system format:

NTSC and PAL

More than 88 dB

More than 90 dB

20 Hz - 20 kHz

FM stereo, FM/AM superheterodyne 
tuner
Antenna:

FM lead antenna
AM loop antenna

Tuning range:

step)

87.5 MHz - 108.0 MHz (50 kHz

Tuning range:

Communication system:

BLUETOOTH Standard version 3.1

Output:

BLUETOOTH Standard Power 
Class 2

Maximum communication range:

Line of sight approx. 10 m

1)

Frequency band:

2.4 GHz band (2.4000 GHz – 
2.4835 GHz)

Modulation method:

FHSS (Freq Hopping Spread 
Spectrum)

Compatible BLUETOOTH profiles

2)

:

A2DP (Advanced Audio 
Distribution Profile)
AVRCP 1.3 (Audio Video Remote 
Control Profile)
SPP (Serial Port Profile)

Supported codecs:

SBC (Sub Band Codec)
AAC (Advanced Audio Coding)

1)

 The actual range will vary depending 

on  factors such as obstacles between 
devices, magnetic fields around a 
microwave oven, static electricity, 
reception sensitivity, antenna’s 
performance, operating system, 
software application, etc.

2)

 BLUETOOTH standard profiles 

indica te the purpose of BLUETOOTH 
communication between devices.

Supported bit rate:

MPEG1 Layer-3:
32 kbps – 320 kbps, VBR
WMA (USB devices only):
48 kbps – 192 kbps, VBR
AAC (USB devices only):
48 kbps – 320 kbps, VBR

Sampling frequencies:

MPEG1 Layer-3:
32 kHz/44.1 kHz/48 kHz
WMA (USB devices only):
44.1 kHz
AAC (USB devices only):
44.1 kHz

Xvid:

Video codec: Xvid video
Bit rate: 4.854 Mbps (MAX)
Resolution/Frame rate:
720 × 480 (30 fps)
720 × 576 (25 fps)
Audio codec: MP3

MPEG4:

File format: MP4 File Format
Video codec: MPEG4 Simple 
Profile (AVC is not compatible.)
Bit rate: 4 Mbps
Resolution/Frame rate:
720 × 480 (30 fps)
720 × 576 (25 fps)
Audio codec: AAC-LC (HE-AAC is 
not compatible.)
DRM: Not compatible

Power requirements:

Indian and Thai models:
AC 220 V – 240 V, 50/60 Hz
Other models:
AC 120 V – 240 V, 50/60 Hz

Power consumption:

Indian model:
195 W (0.5 W at the Power Saving

240 W (0.5 W at the Power Saving

mode)
Other models:

mode)

Dimensions (W/H/D) (Approx.):

339 mm × 908 mm × 325 mm

Mass (Approx.):

18 kg

Supplied accessories:

Remote control (1)
R6 (Size AA) batteries (2)
AC power cord (1)
FM lead/AM loop antenna (1)
Video cord (1)

Design and specifications are subject 
to change without notice.

Latin American model:
530 kHz – 1,710 kHz (10 kHz step)
531 kHz – 1,710 kHz (9 kHz step)
Other models:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

CAUTION
The use of optical instruments with 
this product will increase eye hazard.

This appliance is classified as a CLASS 1 
LASER product. This marking is located 
on the rear exterior.

 

 is a trademark of DVD Format/

Logo Licensing Corporation.

  “DVD+RW” , “DVD-RW”, “DVD+R”, 

“DVD-R”, “DVD VIDEO”, and the “CD” 
logos are trademarks.

  WALKMAN® and WALKMAN® logo 

are registered trademarks of Sony 
Corporation.

  MPEG Layer-3 audio coding 

technology and patents licensed 
from Fraunhofer IIS and Thomson.

  Windows Media is either a 

registered trademark or trademark 
of Microsoft Corporation in 
the United States and/or other 
countries.

  This product is protected by 

certain intellectual property rights 
of Microsoft Corporation. Use or 
distribution of such technology 
outside of this product is prohibited 
without a license from Microsoft or 
an authorized Microsoft subsidiary.

  This system incorporates Dolby* 

Digital.

*  Manufactured under license from 

Dolby Laboratories. Dolby and the 
double-D symbol are trademarks of 
Dolby Laboratories.

  The BLUETOOTH® word mark and 

logos are registered trademarks 
owned by Bluetooth SIG, Inc. and 
any use of such marks by Sony 
Corporation is under license. Other 
trademarks and trade names are 
those of their respective owners.

  The N Mark is a trademark or 

registered trademark of NFC Forum, 
Inc. in the United States and in other 
countries.

  Android™ is a trademark of Google 

Inc.

  Google Play™ is a trademark of 

Google Inc.

  iPhone and iPod touch are 

trademarks of Apple Inc., registered 
in the U.S. and other countries. App 
Store is a service mark of Apple Inc.

  “Made for iPod” and “Made for 

iPhone” mean that an electronic 
accessory has been designed 
to connect specifically to iPod 
or iPhone, respectively, and has 
been certified by the developer 
to meet Apple performance 
standards. Apple is not responsible 
for the operation of this device 
or its compliance with safety and 
regulatory standards. Please note 
that the use of this accessory with 
iPod or iPhone may affect wireless 
performance.

  THIS PRODUCT IS LICENSED UNDER 

THE MPEG-4 VISUAL PATENT 
PORTFOLIO LICENSE FOR THE 
PERSONAL AND NON-COMMERCIAL 
USE OF A CONSUMER FOR

(i)  ENCODING VIDEO IN 

COMPLIANCE WITH THE MPEG-4 
VISUAL STANDARD (“MPEG-4 
VIDEO”)

AND/OR

(ii) DECODING MPEG-4 VIDEO THAT 

WAS ENCODED BY A CONSUMER 
ENGAGED IN A PERSONAL AND 
NON-COMMERCIAL ACTIVITY 
AND/OR WAS OBTAINED FROM 
A VIDEO PROVIDER LICENSED TO 
PROVIDE MPEG-4 VIDEO.

NO LICENSE IS GRANTED OR SHALL 
BE IMPLIED FOR ANY OTHER 
USE. ADDITIONAL INFORMATION 
INCLUDING THAT RELATING TO 
PROMOTIONAL, INTERNAL AND 
COMMERCIAL USES AND LICENSING 
MAY BE OBTAINED FROM MPEG LA, 
L.L.C. 
HTTP://WWW.MPEGLA.COM

  All other tr ademarks are trademarks 

of their respective owners.

When the self-diagnosis function 
is activated to prevent the system 
from malfunctioning, a service 
number appears on the TV screen. 
The service number consists of an 
alphabet and numerals (e.g. C 13 50). 
See the following table for the cause 
and corrective action.

C 13

This disc is dirty.

Clean the disc with a 
soft cloth.

C 31

The disc is not inserted 
correctly.

Restart the system, 
then re-insert the disc 
correctly.

E XX
(XX is a 
number)

To prevent a 
malfunction, the system 
has performed the 
self-diagnosis function.

Contact your nearest 
Sony dealer or local 
authorized Sony service 
facility and give the 
5-character service 
number. 
Example: E 61 10

 .............................................  

4

2-1. Disassembly 

Flow 

...........................................................   7

2-2.  Side L, R Panel Block .....................................................   8
2-3.  Top Panel Block ..............................................................   9
2-4.  Volume Knob Block ........................................................   10
2-5.  Loading Panel Block .......................................................   11
2-6. CDM 

Block 

.....................................................................  12

2-7.  Back Panel Block ............................................................   13
2-8. ARAGON 

Board-1 

.........................................................  14

2-9. ARAGON 

Board-2 

.........................................................  15

2-10. ARAGON Board-3 .........................................................   16
2-11. D-AMP Board-1 

..............................................................   17

2-12. D-AMP Board-2 ..............................................................   18
2-13. Sub Chassis .....................................................................   19
2-14.  Front Panel Block-1 ........................................................   20
2-15.  Front Panel Block-2 ........................................................   21
2-16.  Switching Regulator (SWR1) .........................................   22
2-17.  Front Panel (SP) Block ...................................................   23
2-18.  Speaker LED Board, Front Panel (SP) Assy ...................   24
2-19.  Loudspeaker (25 cm) (Woofer) (SP5) .............................   25
2-20.  Loudspeaker (10 cm) (Mid: L-ch) (SP1) ........................   26
2-21.  Loudspeaker (10 cm) (Mid: R-ch) (SP3) ........................   27
2-22.  FL Board Block ...............................................................   28
2-23.  Bluetooth Module (BT1) ................................................   29
2-24.  USB Board Block ...........................................................   30
2-25. MIC Board ......................................................................   31
2-26.  NFC Module (NFC1) ......................................................   31
2-27. FFC Holder .....................................................................   32
2-28.  Optical Pick-up Block (CMS-S76RFS7G) (OP1) ..........   33

 ............................................................   34

 .........................................   39

5-1.  Block Diagram - CD/USB Section - ...............................   40
5-2.  Block Diagram - MAIN Section - ...................................   41
5-3.  Block Diagram - AMP Section - .....................................   42
5-4. Block 

Diagram 

- PANEL/POWER SUPPLY Section - ............................   43

5-5.  Schematic Diagram - MAIN Section (1/9) - ...................   45
5-6.  Schematic Diagram - MAIN Section (2/9) - ...................   46

5-7.  Schematic Diagram - MAIN Section (3/9) - ...................   47
5-8.  Schematic Diagram - MAIN Section (4/9) - ...................   48
5-9.  Schematic Diagram - MAIN Section (5/9) - ...................   49
5-10.  Schematic Diagram - MAIN Section (6/9) - ...................   50
5-11.  Schematic Diagram - MAIN Section (7/9) - ...................   51
5-12.  Schematic Diagram - MAIN Section (8/9) - ...................   52
5-13.  Schematic Diagram - MAIN Section (9/9) - ...................   53
5-14.  Printed Wiring Boards - MAIN Section (1/2) - ..............   54
5-15.  Printed Wiring Board - MAIN Section (2/2) - ................   55
5-16. Printed Wiring Board 

- D-AMP Board (Component Side) (Suffi x-11) - ...........   56

5-17. Printed Wiring Board 

- D-AMP Board (Conductor Side) (Suffi x-11) - .............   57

5-18. Printed Wiring Board 

- D-AMP Board (Component Side) (Suffi x-12) - ...........   58

5-19. Printed Wiring Board 

- D-AMP Board (Conductor Side) (Suffi x-12) - .............   59

5-20.  Schematic Diagram - D-AMP Board (1/2) - ...................   60
5-21.  Schematic Diagram - D-AMP Board (2/2) - ...................   61
5-22.  Printed Wiring Board - USB Board - ..............................   62
5-23.  Schematic Diagram - USB Board - .................................   62
5-24.  Printed Wiring Boards - MIC/VIDEO Boards - .............   63
5-25.  Schematic Diagram - MIC/VIDEO Boards - ..................   63
5-26.  Printed Wiring Boards - PANEL Section - .....................   64
5-27.  Schematic Diagram - PANEL Section - ..........................   65
5-28.  Printed Wiring Boards - KEY Section - ..........................   66
5-29.  Schematic Diagram - KEY Section - ..............................   67

6-1.  Side Panel Section ..........................................................   80
6-2.  Loading Panel Section ....................................................   81
6-3.  Back Panel Section .........................................................   82
6-4.  D-AMP Board, ARAGON Board Section ......................   83
6-5.  Switching Regulator Section ..........................................   84
6-6.  Speaker Cabinet Section .................................................   85
6-7.  Top Panel Section ...........................................................   86
6-8.  Front Panel Section .........................................................   87
6-9.  CDM Block Section ........................................................   88
6-10.  DVD Mechanism Deck Section 

(CDM90-DVBU202 or CDM90-DVBU204) .................   89

 ..............................   90

Note: Refer to the “NEW/FORMER DISCRIMINATION OF D-AMP 

AND SPEAKER LED BOARDS” on page 4 for how to distin-
guish suffi x-11 and suffi x-12 of D-AMP and SPEAKER LED 
boards.

Accessories are given in the last of the electrical parts list.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

NOTE  OF  REPLACING  THE  MS-476  BOARD
When the MS-476 board is defective, replace the CDM90 ASSY 
(Ref. No. CDM1).

NOTE  OF  REPLACING  THE  IC001,  IC002,  IC105,  IC106,  
IC301 AND  IC302  ON  THE  ARAGON  BOARD
IC001, IC002, IC105, IC106, IC301 and IC302 on the ARAGON 
board cannot replace with single. When these parts are damaged, 
replace the complete mounted board.

NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But don’t perform the operation 
check in the long time, and perform the operation check in the 
volume state as low as possible.

TEST  DISCS
Use following TEST DISC when this unit confi rms the operation 
and checks it.

• For 

CD

Part No.

   

Description

3-702-101-01 DISC 

(YEDS-18), 

TEST

4-225-203-01 DISC 

(PATD-012), 

TEST

J-2501-307-A DISC 

(HLX-A1), 

TEST

• 

For DVD SL (Single Layer)

Part No.

   

Description

J-6090-069-A 

DISC (HLX-503), TEST (NTSC)

J-6090-088-A 

DISC (HLX-504), TEST (NTSC)

J-6090-077-A 

DISC (HLX-506), TEST (PAL)

• 

For DVD DL (Double Layer)

Part No.

   

Description

J-6090-071-A 

DISC (HLX-501), TEST (NTSC)

J-6090-089-A 

DISC (HLX-505), TEST (NTSC)

J-6090-078-A 

DISC (HLX-507), TEST (PAL)

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of sample disc in the 
shop is equipped.
Disc tray lock function can be released by the following procedure.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to turn the DVD/CD function.
3.  Press two buttons of the [

x] and [ENTER] simultaneously for 

three seconds.

4.  The message “UNLOCKED” is displayed on the fl uorescent 

indicator tube and the disc tray is unlocked.

Note: When “LOCKED” is displayed, the disc tray lock is not released by 

turning power on/off with the [

?/1] button.

NEW/FORMER  DISCRIMINATION  OF  D-AMP  AND  SPEAK-
ER  LED  BOARDS
D-AMP and SPEAKER LED boards have been changed in the 
midway of production.
Distinguish by the part number of the silk print.