DOWNLOAD Sony MHC-DX8 (serv.man2) Service Manual ↓ Size: 7.2 MB | Pages: 65 in PDF or view online for FREE

Model
MHC-DX8 (serv.man2)
Pages
65
Size
7.2 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mhc-dx8-sm2.pdf
Date

Sony MHC-DX8 (serv.man2) Service Manual ▷ View online

SERVICE MANUAL
E Model
Australian Model
HCD-DX8
Ver 1.3  2003.07
9-929-221-14
Sony Corporation
2003G05-1
Home Audio Company
C
 2003.07
Published by Sony Engineering Corporation
HCD-DX8 is the tuner, tape player, CD player
and amplifier section in MHC-DX8.
SPECIFICATIONS
— Continued on next page —
Amplifier section
The following measured at AC 120, 220, 240V
50/60 Hz
DIN power output (rated) 160 + 160 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
200 + 200 watts
(6 ohms at 1 kHz,
10% THD)
Inputs
MD/VIDEO (AUDIO) IN: voltage 450 mV/250 mV,
(phono jacks)
impedance 47 kilohms
MIC:
sensitivity 1 mV,
(phone jack)
impedance 10 kilohms
Outputs
PHONES:
accepts headphones of 8
(stereo mini jack)
ohms or more
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
SATELLITE SPEAKER:
accepts impedance of 6 to
16 ohms
CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(
λ
=780nm)
Emission duration:
continuous
Laser output
Max. 44.6 
µ
W*
*This output is the value
measured at a distance of
200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
Frequency response
2 Hz – 20 kHz (
±
0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
–18 dBm
This stereo system is equipped with the Dolby B-
type noise reduction system*.
* Manufactured under license from Dolby
Laboratories Licensing Corporation.
DOLBY and the double-D symbol ; are
trademarks  of Dolby Laboratories Licensing
Corporation.
COMPACT DISC DECK RECEIVER
Model Name Using Similar Mechanism
HCD-BX7
CD Mechanism Type
CDM58-K2BD38
Base Unit Name
BU-K2BD38
Optical Pick-up Block Name
KSM-213DAP
Optical Pick-up Name
KSS-213D
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
TCM-230AWR11
CD
SECTION
TAPE DECK
SECTION
2
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±
3 dB),
(DOLBY NR OFF)
using Sony TYPE I
cassette
40 – 14,000 Hz (
±
3 dB),
using Sony TYPE II
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Middle Eastern models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
Australian models:
230 - 240 V AC, 50/60 Hz
Mexican models:
120 V AC, 60 Hz
Other models:
120 V, 220 V or 230 - 240
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
250 watts
Dimensions (w/h/d)
Approx. 280 x 360 x 425
mm
Mass :
Approx. 9.5 kg
Design and specifications are subject to change
without notice.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS
PUBLISHED  BY  SONY.
3
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
— BACK PANEL —
TABLE OF CONTENTS
1. SERVICE NOTE
······························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
································································ 7
4. TEST MODE
···································································· 12
5. MECHANICAL ADJUSTMENTS
····························· 16
6. ELECTRICAL ADJUSTMENTS
······························· 16
7. DIAGRAMS
7-1.
Circuit Boards Location ··················································· 21
7-2.
Block Diagrams ································································ 22
7-3.
Printed Wiring Board  – BD Section – ····························· 24
7-4.
Schematic Diagram  – BD Section – ································ 25
7-5.
Printed Wiring Board  – MAIN Section – ························ 26
7-6.
Schematic Diagram  – MAIN (1/3) Section – ·················· 27
7-7.
Schematic Diagram  – MAIN (2/3) Section – ·················· 28
7-8.
Schematic Diagram  – MAIN (3/3) Section – ·················· 29
7-9.
Printed Wiring Board  – POWER AMP Section – ··········· 30
7-10. Schematic Diagram  – POWER AMP Section – ·············· 31
7-11. Printed Wiring Boards  – PANEL Section – ····················· 32
7-12. Schematic Diagram  – PANEL Section – ························· 33
7-13. Printed Wiring Boards  – LEAF SW Section – ················ 34
7-14. Schematic Diagram  – LEAF SW Section – ···················· 35
7-15. Printed Wiring Boards  – DRIVER Section – ·················· 36
7-16. Schematic Diagram  – DRIVER Section – ······················ 37
7-17. Printed Wiring Board  – TRANS Section – ······················ 38
7-18. Schematic Diagram  – TRANS Section – ························ 39
7-19. IC Pin Function Description ············································· 40
7-20. IC Block Diagrams ··························································· 42
8. EXPLODED VIEWS
······················································ 46
9. ELECTRICAL PARTS LIST
······································· 52
PART No.
• Abbreviation
AR
: Argentine
AUS
: Australian
E2
: 120 V AC Area in E model
E3
: 240 V AC Area in E model
MODEL
E2, E3, EA, MY, SP, AR models
MX, AUS models
PART No.
4-225-040-3
s
4-225-040-4
s
EA
: Saudi Arabia
MY
: Malaysia
MX
: Mexican
SP
: Singapore
This appliance is classified
as a  CLASS 1 LASER
product. The CLASS 1
LASER PRODUCT
MARKING is located on
the rear exterior.
4
SECTION 1
SERVICE NOTE
Screw hole
Attach the panel board with 
six screws (+BVTP 2.6 
× 
8 ) 
after the board is removed once.
Do not tighten the screws excessively.
1
Cut the nine melted-connection points with cutting pliers.
Note for installing the panel board
2
Panel board
Hot melt
: melted-connection point
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  • DOWNLOAD Sony MHC-DX8 (serv.man2) Service Manual ↓ Size: 7.2 MB | Pages: 65 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony MHC-DX8 (serv.man2) in PDF for free, which will help you to disassemble, recover, fix and repair Sony MHC-DX8 (serv.man2) Audio. Information contained in Sony MHC-DX8 (serv.man2) Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.