Sony MDS-NT1 Service Manual ▷ View online
5
MDS-NT1
SELF-DIAGNOSIS FUNCTION
...........................
2
1.
SERVICING NOTES
...............................................
7
2.
GENERAL
................................................................... 12
3.
DISASSEMBLY
3-1. Disassembly Flow ........................................................... 13
3-2. Case (Upper) ................................................................... 14
3-3. Main Board ...................................................................... 15
3-4. MD Mechanism Deck (MDM-7S2B) ............................. 15
3-5. Front Panel Section ......................................................... 16
3-6. BD Board, Over Write Head (HR901) ........................... 16
3-7. Holder Assy ..................................................................... 17
3-8. Loading Motor Assy (M103) .......................................... 17
3-9. Sled Motor Assy (M102) ................................................ 18
3-10. Optical Pick-Up (KMS-262E) ........................................ 18
3-11. Spindle Motor Assy (M101) ........................................... 19
3-2. Case (Upper) ................................................................... 14
3-3. Main Board ...................................................................... 15
3-4. MD Mechanism Deck (MDM-7S2B) ............................. 15
3-5. Front Panel Section ......................................................... 16
3-6. BD Board, Over Write Head (HR901) ........................... 16
3-7. Holder Assy ..................................................................... 17
3-8. Loading Motor Assy (M103) .......................................... 17
3-9. Sled Motor Assy (M102) ................................................ 18
3-10. Optical Pick-Up (KMS-262E) ........................................ 18
3-11. Spindle Motor Assy (M101) ........................................... 19
4.
TEST MODE
.............................................................. 20
5.
ELECTRICAL ADJUSTMENTS
........................ 24
6.
DIAGRAMS
6-1. Block Diagram – SERVO Section – ............................... 36
6-2. Block Diagram – MAIN Section – ................................. 37
6-3. Note for Printed Wiring Boards and
6-2. Block Diagram – MAIN Section – ................................. 37
6-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 38
6-4. Printed Wiring Board – BD Board – .............................. 39
6-5. Schematic Diagram – BD Board (1/2) – ........................ 40
6-6. Schematic Diagram – BD Board (2/2) – ........................ 41
6-7. Printed Wiring Board
6-5. Schematic Diagram – BD Board (1/2) – ........................ 40
6-6. Schematic Diagram – BD Board (2/2) – ........................ 41
6-7. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 42
6-8. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 43
6-9. Schematic Diagram – MAIN Board (1/2) – ................... 44
6-10. Schematic Diagram – MAIN Board (2/2) – ................... 45
6-11. Printed Wiring Board – Panel Board – ........................... 46
6-12. Schematic Diagram – Panel Board – .............................. 47
6-13. IC Pin Function Description ........................................... 51
6-10. Schematic Diagram – MAIN Board (2/2) – ................... 45
6-11. Printed Wiring Board – Panel Board – ........................... 46
6-12. Schematic Diagram – Panel Board – .............................. 47
6-13. IC Pin Function Description ........................................... 51
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 59
7-2. Front Panel Section ......................................................... 60
7-3. Case (B) Section .............................................................. 61
7-4. MD Mechanism Deck Section-1 (MDX-7S2B) ............. 62
7-5. MD Mechanism Deck Section-2 (MDX-7S2B) ............. 63
7-2. Front Panel Section ......................................................... 60
7-3. Case (B) Section .............................................................. 61
7-4. MD Mechanism Deck Section-1 (MDX-7S2B) ............. 62
7-5. MD Mechanism Deck Section-2 (MDX-7S2B) ............. 63
8.
ELECTRICAL PARTS LIST
............................... 64
TABLE OF CONTENTS
6
MDS-NT1
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as a CLASS 1
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
bottom exterior.
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
bottom exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
7
MDS-NT1
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
(Figure A)
CLEANING OBJECTIVE LENS OF OPTICAL PICK-UP
• In cleaning the objective lens of optical pick-up, be sure the
following below.
1. In cleaning the lens, do not apply an excessive force.
As the optical pick-up is vulnerable, application of excessive
force could damage the lens holder.
force could damage the lens holder.
2. In cleaning, do not use a cleaner other than exclusive cleaning
liquid (KK-91 or isopropyl alcohol).
3. Wipe the objective lens spirally from center toward outside.
(See Figure A)
NOTES ON REPLACING BD BOARD OR MD MECHANISM
DECK
DECK
In replacing the BD board or MD mechanism deck, perform the
work through the steps provided below:
work through the steps provided below:
1. Remove the IC195 from the BD board to be replaced.
2. Remove the IC195 from new BD board.
3. Mount the IC195 on new BD board, which was removed from
2. Remove the IC195 from new BD board.
3. Mount the IC195 on new BD board, which was removed from
the BD board to be replaced.
4. Install new BD board in the set.
Note:
The IC195 cannot be replaced with a new part. If IC195 is faulty,
replace the entire BD board.
replace the entire BD board.
IC195
– BD BOARD (Conductor Side) –
4. Eject the disc, if loaded.
5. Disconnect the power cord from the socket to shut off the power
5. Disconnect the power cord from the socket to shut off the power
supply.
OPERATION CHECK IN NORMAL MODE
The set alone is capable of performing the play function only. In
checking the recording and other functions, connect the set to the
PC with a USB cable and perform the operation on the application
software “OpenMG Jukebox” attached.
checking the recording and other functions, connect the set to the
PC with a USB cable and perform the operation on the application
software “OpenMG Jukebox” attached.
8
MDS-NT1
I+3V
Iop
GND
TE
FE
VC
RF
Iop
GND
TE
FE
VC
RF
I+3V
Iop
GND
TE
FE
FE
VC
RF
1
7
for
MDM-7S2B
I+3V
CN105
Iop
TE
VC
GND
FE
RF
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be
performed are shown as follows.
performed are shown as follows.
GND : Ground
I+3V : For measuring Iop (Check the deterioration of the optical pick-up laser)
Iop
I+3V : For measuring Iop (Check the deterioration of the optical pick-up laser)
Iop
: For measuring Iop (Check the deterioration of the optical pick-up laser)
TE
: Tracking error signal (Traverse adjustment)
VC
: Reference level for checking the signal
RF
: RF signal (Check jitter)
FE
: Focus error signal
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