Sony MDS-JE700 Service Manual ▷ View online
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Model Name Using Similar Mechanism
MDS-JE500
MD Mechanism Type
MDM-3A
Optical Pick-up Type
KMS-260A/J1N
MDS-JE700
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
SPECIFICATIONS
— Continued on next page —
MiNi DiSC DECK
9-960-804-12
2004I02-1
© 2004.09
Ver 1.1 2004. 09
Sony Corporation
Audio Group
Published by Sony Engineering Corporaton
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CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the equipment manufacturer.
Discard used batteries according to manufacture’s instructions.
Replace only with the same or equivalent type recommended by
the equipment manufacturer.
Discard used batteries according to manufacture’s instructions.
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilakting skifte av batteri.
Benytt samme batteritype eller en tilsvarende type anbefalt av
apparatfabrikanten.
Brukte batterier katterier kasseres i henhold til fabrikantens
VARNIG
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som rekommenderas
av apparattillverkaren.
Kassera använt batteri enligt gällande föreakrifter.
Använd samma batterityp eller en likvärdig typ som rekommenderas
av apparattillverkaren.
Kassera använt batteri enligt gällande föreakrifter.
VAROITUS
Parist voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
MODEL IDENTIFICATION
— BACK PANEL —
— BACK PANEL —
Parts No.
4-985-444-1
4-985-444-2
4-985-444-3
4-985-444-4
Parts No.
MODEL
AEP model
UK model
US model
Canadian model
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Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is classified as a CLASS 1
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
rear exterior.
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
rear exterior.
The following caution label is located
inside the unit.
inside the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
The laser component in this product is
capable of emitting radiation exceeding
the limit for Class 1.
capable of emitting radiation exceeding
the limit for Class 1.
To Exposed Metal
Parts on Set
Parts on Set
0.15µF
1.5k
Ω
AC
voltmeter
(0.75V)
voltmeter
(0.75V)
Earth Ground
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS
SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
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TABLE OF CONTENTS
1. SERVICING NOTE
.......................................................... 5
2. GENERAL
.......................................................................... 8
3. DISASSEMBLY
3-1. Case and Front Panel Assembly .......................................... 24
3-2. Bracket (T), (L) and (R) ...................................................... 24
3-3. BD Board ........................................................................... 25
3-4. SUB Chassis ........................................................................ 25
3-5. Shutter Assembly ................................................................ 26
3-6. Over Write Head ................................................................. 26
3-7. Slider Complete Assembly .................................................. 27
3-2. Bracket (T), (L) and (R) ...................................................... 24
3-3. BD Board ........................................................................... 25
3-4. SUB Chassis ........................................................................ 25
3-5. Shutter Assembly ................................................................ 26
3-6. Over Write Head ................................................................. 26
3-7. Slider Complete Assembly .................................................. 27
4. TEST MODE
..................................................................... 28
5. ELECTRICAL ADJUSTMENTS
............................... 31
6. DIAGRAMS
6-1. Circuit Boards Location ...................................................... 36
6-2. Brock Diagrams
6-2. Brock Diagrams
• BD Section ....................................................................... 37
• Main Section .................................................................... 39
• Main Section .................................................................... 39
6-3. Waveforms ......................................................................... 41
6-4. Printed Wiring Board — BD Section — ............................. 43
6-5. Schematic Diagram — BD Section — ............................... 45
6-6. Schematic Diagram — Main Section — ............................ 49
6-7. Printed Wiring Board — Main Section — .......................... 53
6-8. Printed Wiring Board — Panel Section — ......................... 55
6-9. Schematic Diagram — Panel Section — ............................ 57
6-10. Printed Wiring Board — HP Section — .......................... 59
6-11. Schematic Diagram — HP Section — ............................. 60
6-12. IC Block Diagrams ........................................................... 61
6-13. IC Pin Functions ............................................................... 67
6-4. Printed Wiring Board — BD Section — ............................. 43
6-5. Schematic Diagram — BD Section — ............................... 45
6-6. Schematic Diagram — Main Section — ............................ 49
6-7. Printed Wiring Board — Main Section — .......................... 53
6-8. Printed Wiring Board — Panel Section — ......................... 55
6-9. Schematic Diagram — Panel Section — ............................ 57
6-10. Printed Wiring Board — HP Section — .......................... 59
6-11. Schematic Diagram — HP Section — ............................. 60
6-12. IC Block Diagrams ........................................................... 61
6-13. IC Pin Functions ............................................................... 67
7. EXPLODED VIEWS
7-1. Case and Main Board Section ............................................. 76
7-2. Front Panel Section ............................................................. 77
7-3. Mechanism Deck Section (1) (MDM-3A) .......................... 78
7-4. Mechanism Deck Section (2) (MDM-3A) .......................... 79
7-2. Front Panel Section ............................................................. 77
7-3. Mechanism Deck Section (1) (MDM-3A) .......................... 78
7-4. Mechanism Deck Section (2) (MDM-3A) .......................... 79
8. ELECTRICAL PARTS LIST
........................................ 80