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Model
MDS-JA333ES
Pages
95
Size
24.42 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mds-ja333es.pdf
Date

Sony MDS-JA333ES Service Manual ▷ View online

SERVICE MANUAL
MINIDISC DECK
— Continued on next page —
SPECIFICATIONS
US Model
Canadian Model
AEP Model
UK Model
Model Name Using Similar Mechanism
MDS-JA555ES
MD Mechanism Type
MDM-6J
Base Unit Type
MBU-5J
Optical Pick-up Type
KMS-260B/J1N
MDS-JA333ES
U.S. and foreign patents licensed from Dolby Laboratories
Licensing Corporation.
Photo : GOLD
System
MiniDisc digital audio system
Disc
MiniDisc
Laser
Semiconductor laser (
 λ
 = 780 nm)
Emission duration: continuous
Laser output
MAX 44.6 µW
1
)
1) This output is the value
measured at a distance of
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
Laser diode
Material: GaAlAs
Revolutions (CLV)
400 rpm to 900 rpm
Error correction
ACIRC (Advanced Cross Interleave
Reed Solomon Code)
Sampling frequency
44.1 kHz
Coding
ATRAC (Adaptive TRansform
Acoustic Coding)/ATRAC 3
Modulation system
EFM (Eight-to-Fourteen
Modulation)
Number of channels
2 stereo channels
Frequency response
5 to 20,000 Hz ±0.3 dB
Signal-to-noise ratio
Over 100 dB during play
Wow and flutter
Below measurable limit
Inputs
ANALOG IN
Jack type: phono
Impedance: 47 k 
Rated input: 500 mVrms
Minimum input: 125 mVrms
DIGITAL IN OPT1
Connector type: square optical
Impedance: 660 nm (optical wave
length)
DIGITAL IN OPT2
Connector type: square optical
Impedance: 660 nm (optical wave
length)
DIGITAL IN COAXIAL
Jack type: phono
Impedance: 75 
Rated input: 0.5 Vp-p, ±20 %
Outputs
PHONES
Jack type: stereo phone
Rated output: 28 mW
Load impedance: 32 
ANALOG OUT
Jack type: phono
Rated output: 2.5 Vrms (at 50
)
Load impedance: over 10 k 
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 
0
 OR DOTTED LINE WITH
MARK 
0
 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 
0
 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
    After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
    The AC leakage from any exposed metal part to earth ground
and from all exposed metal parts to any exposed metal part having
a return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1.
A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2.
A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3.
Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
SAFETY  CHECK-OUT
To Exposed Metal 
Parts on Set
0.15 
µ
F
1.5 k
AC
Voltmeter
(0.75 V)
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the equipment manufacturer.
Discard used batteries according to manufacture’s instructions.
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilakting skifte av batteri.
Benytt samme batteritype eller en tilsvarende type anbefalt av
apparatfabrikanten.
Brukte batterier katterier kasseres i henhold til fabrikantens
VARNIG
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som rekommenderas
av apparattillverkaren.
Kassera använt batteri enligt gällande föreakrifter.
VAROITUS
Parist voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
DIGITAL OUT OPTICAL
Connector type: square optical
Rated output: –18 dBm
Load impedance: 660 nm (optical
wave length)
DIGITAL OUT COAXIAL
Jack type: phono
Rated output: 0.5 Vp-p (at 75 
)
Load impedance: 75 
General
Power requirements
Where purchased
Power requirements
US, Canadian
120 V AC, 60 Hz
AEP, UK
230 V AC, 50/60 Hz
Power consumption
20 W
Dimensions (approx.)
430 
×
 123.5 
×
 375.5 mm (17 
×
 4 
7
/
8
×
 14 
7
/
8
 in.) (w/h/d) incl. projecting
parts and controls
Mass (approx.)
10.5 kg (23 lbs 15 oz)
Supplied accessories
• Audio connecting cords (2)
• Optical cable (1)
• Remote commander (remote) (1)
• R6 (size-AA) batteries (2)
Design and specifications are subject to change without
notice.
3
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
The following caution label is located inside the unit.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
— BACK PANEL —
Parts No.
4-228-930-1
 : AEP, UK model
4-228-930-2
 : US model
4-228-930-3
 : Canadian model
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 6
2. GENERAL
········································································ 12
3. DISAssembly
3-1.
Case ·················································································· 16
3-2.
Loading Panel ··································································· 16
3-3.
Front Panel Assembly ······················································· 17
3-4.
MD Mechanism Deck ······················································ 17
3-5.
Tray Assembly ·································································· 18
3-6.
BU Holder Assembly ························································ 19
3-7.
Motor (Loading) Assembly (M10) ··································· 19
3-8.
Base Unit (MBU-5J) ························································ 20
3-9.
BD Board ·········································································· 20
3-10. Over Light Head (HR901) ················································ 21
3-11. Mini Disc Device (KMS-260B/J1N) ································ 21
4. TEST MODE
···································································· 22
5. ELECTRICAL ADJUSTMENTS
······························· 27
6. DIAGRAMS
6-1.
Block Diagrams ································································ 37
Main Section ····································································· 37
Display/Power Supply Section ········································· 38
6-2.
Circuit Board Location ····················································· 39
6-3.
Printed Wiring Board   BD Section ·································· 40
6-4.
Schematic Diagram    BD Section (1/2) ··························· 41
6-5.
Schematic Diagram    BD Section (2/2) ··························· 42
6-6.
Schematic Diagram    BD Switch Section ························ 43
6-7.
Printed Wiring Board  BD Switch Section ······················· 43
6-8.
Printed Wiring Board     AD Section ································ 44
6-9.
Schematic Diagram    AD Section ···································· 45
6-10. Printed Wiring Board     DIO Section ······························ 46
6-11. Schematic Diagram    DIO Section ·································· 47
6-12. Printed Wiring Board    DA Section ································· 48
6-13. Schematic Diagram     DA Section ··································· 49
6-14. Printed Wiring Board    DIGITAL Section ······················· 50
6-15. Schematic Diagram     DIGITAL Section ························ 51
6-16. Schematic Diagram     HP Section ··································· 52
6-17. Printed Wiring Board     HP Section ································ 53
6-18. Schematic Diagram     POWER Section ·························· 54
6-19. Printed Wiring Board     POWER Section ························ 55
6-20. Printed Wiring Board     PANEL Section ························· 56
6-21. Schematic Diagram     PANEL Section ···························· 57
6-22. Printed Wiring Board     AC Section ································ 58
6-23. Schematic Diagram     AC Section ··································· 59
6-22. IC Block Diagrams ··························································· 61
6-23. IC PinFunction Description ·············································· 66
7. EXPLODED VIEWS
7-1.
Upper Case Assembly ······················································ 73
7-2.
Front Panel Assembly ······················································· 74
7-3.
Chassis Assembly ····························································· 75
7-4.
Mechanism Deck Assembly-1 (MDM-6J) ······················· 76
7-5.
Mechanism Deck Assembly-2 (MDM-6J) ······················· 77
7-6.
Base Unit (MBU-5J) ························································ 78
8. ELECTRICAL PARTS LIST
······································· 79
4
SELF-DIAGNOSIS FUNCTION
The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and error codes which
show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box
in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self-
Diagnosis Function (Error History Display Mode)”.
The deck’s self-diagnosis function automatically checks the condition of the MD deck when an error occurs, then issues a three- or five-digit
code and an error message on the display. If the code and message alternate, find them in the following table and perform the indicated
countermeasure. Should the problem persist, consult your nearest Sony dealer.
PROCEDURE FOR USING THE SELF-DIAGNOSIS FUNCTION (ERROR HISTORY DISPLAY MODE)
Note:
Perform the self-diagnosis function in the “error history display mode” in the test mode. The following describes the least required procedure. Be
careful not to enter other modes by mistake. If you set other modes accidentally, press the  MENU/NO  button to exit the mode.
1. While pressing the  l AMS L  knob and  x  button, connect the power plug to the outlet, and release the  l AMS L  knob and
x  button.  When the test mode is set “[Check]” is displayed.
2. Turn the  l AMS L  knob and when “[Service]” is displayed, press the  YES  button.
3. Turn the  l AMS L  knob to display “Err Display”.
4. Press the  YES  button to sets the error history mode and displays “op rec tm”.
5. Select the contents to be displayed or executed using the  l AMS L  knob.
6. Press the  l AMS L  knob to display or execute the contents selected.
7. Press the  l AMS L  knob another time to return to step 4.
8. Press the  MENU/NO  button to display “Err Display” and release the error history mode.
9. To release the test mode, press the  REPEAT  button. The unit sets into the STANDBY state and the test mode ends.
Three- or five-
digit code/
Message
Cause/Remedy
C11/Protected
The inserted MD is record-protected.
 Take out the MD and close the record-
protect slot.
C12/Cannot Copy
You tried to record a CD with a format 
that the external device connected to the 
deck does not support, such as CD-ROM 
or video CD.
 Remove the disc and insert a music 
CD.
C13/REC Error
The recording was not made properly.
 Set the deck in a stable surface, and 
repeat the recording procedure.
The inserted MD is dirty (with smudges, 
fingerprints, etc.), scratched, or 
substandard in quality.
 Replace the disc and repeat the 
recording procedure.
C13/Read Error
The deck could not read the TOC on the 
MD properly.
 Take out the MD and insert it again.
C14/Toc Error
The deck could not read the TOC on the 
MD properly.
 Insert another disc.
 If possible, erase all the tracks on the 
MD.
C41/Cannot Copy
The sound source is a copy of 
commercially available music software, or 
you tried to record a CD-R (Recordable 
CD).
 The Serial Copy Management System 
prevents making a digital copy. 
 You cannot record a CD-R.
C71/Din Unlock
The sporadic appearance of this message 
is caused by the digital signal being 
recorded. This will not affect the 
recording.
While recording from a digital component 
connected through the DIGITAL IN 
connector, the digital connecting cable 
was unplugged or the digital component 
turned off.
 Connect the cable or turn the digital 
component back on.
E0001/
MEMORY NG
There is an error in the internal data that 
the deck needs in order to operate.
 Consult your nearest Sony dealer.
E0101/
LASER NG
There is a problem with the optical 
pickup.
 The optical pickup may have failed. 
Consult your nearest Sony dealer.
Three- or five-
digit code/
Message
Cause/Remedy
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  • Here you can View online or download the Service Manual for the Sony MDS-JA333ES in PDF for free, which will help you to disassemble, recover, fix and repair Sony MDS-JA333ES Audio. Information contained in Sony MDS-JA333ES Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.