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E Model

— Continued on next page —

• HCD-XGR88 is the Amplifier,

CD player, tape deck and tuner
section in LBT-XGR88.

2003C0200-1

© 2003.03

Model Name Using Similar Mechanism

HCD-XGR80

CD

CD Mechanism Type

CDM37B-30BD60C

Section

Base Unit Name

BU-30BD60C

Optical Pick-up Name

A-MAX.3

TAPE

Model Name Using Similar Mechanism

NEW

Section

Tape Mechanism Type

CWM43RR23

Amplifier section
The following measured at AC 120, 220, 230 – 240 V  50/60 Hz
DIN power output (rated):

145 + 145 watts (6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

180 x 2 + 180 x 2 watts
(6 ohms at 1 kHz, 10% THD)

Inputs
PHONO IN
(phono jacks):

sensitivity 3 mV, impedance 47 kilohms

MIC
(phone jack):

sensitivity 1 mV, impedance 10 kilohms

GAME INPUT AUDIO L/R
(phono jacks):

sensitivity 250 mV, impedance 47 kilohms

GAME INPUT VIDEO
(phono jack):

1Vp-p, 75 ohms

MD (VIDEO) IN L/R (phono jacks):

sensitivity 450 mV(250 mV),
impedance 47 kilohms

Outputs
PHONES
(stereo phone jack):

accepts headphones of 8 ohms or more

MD (VIDEO) OUT L/R
(phono jacks):

voltage 250 mV, impedance 1 kilohms

VIDEO OUT
(phono jack):

max. output level 1Vp-p,
load impedance 75 ohms

FRONT SPEAKER:

accepts impedance of 6 to 16 ohms
(SUPER WOOFER)
accepts impedance of 6 to 16 ohms
(TWEETER & WOOFER)

CD player section
System

Compact disc digital audio system

Laser

Semiconductor laser (

λ=795 nm)

Emission duration: continuous

Frequency response

2 Hz – 20 kHz (

±0.5 dB)

Signal-to-noise ratio

More than 90 dB

Dynamic range

More than 90 dB

CD OPTICAL DIGITAL OUT
(square optical connector jack, rear panel)
Wavelength

660 nm

Output level

–18 dBm

Tape deck section
Recording system

4-track 2-channel, stereo

Frequency response

50 – 13,000 Hz (

±3 dB), using Sony TYPE I

cassettes

2

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range

87.5 – 108.0 MHz (50 kHz step)

Antenna

FM lead antenna

Antenna terminals

75 ohms unbalanced

Intermediate frequency

10.7 MHz

AM tuner section
Tuning range
Pan-American models:

530 – 1,710 kHz
(with the tuning interval set at 10 kHz)
531 – 1,710 kHz
(with the tuning interval set at 9 kHz)

Other models:

530 – 1,710 kHz
(with the tuning interval set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval set at 9 kHz)

Antenna

AM loop antenna

Antenna terminals

External antenna terminal

Intermediate frequency

450 kHz

General
Power requirements

120 V, 220 V or
230 – 240 V AC, 50/60 Hz
Adjustable with voltage selector

Power consumption

330 watts

Dimensions (w/h/d) (Main Unit) Approx. 355 x 425 x 451 mm

Mass (Main Unit)

Approx. 17.0 kg

Supplied accessories:

AM loop antenna (1)
FM lead antenna (1)
Speaker cords (4)
Speaker pads (8)
Remote Commander (1)
Batteries (2)

Design and specifications are subject to change without notice.

3

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.

E2 model

E51 model

4-244-927-4s

4-244-927-5s

•

Abbreviation
E2

: Central and South America

E51

: Chilean and Peruvian

PART No.

4

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6-1. Circuit Board Location ······················································ 21
6-2. Block Diagram – CD Servo Section – ······························· 22

Block Diagram – Tuner/Tape Deck Section – ··················· 23
Block Diagram – Main Section – ······································ 24
Block Diagram

       – Display/Key Control/Power Supply  Section – ·········· 25

6-3. Printed Wiring Board – BD Section – ······························· 26
6-4. Schematic Diagram – BD Section – ·································· 27
6-5. Printed Wiring Board – Motor LED Section – ·················· 28
6-6. Schematic Diagram –Motor LED Section – ······················ 28
6-7. Schematic Diagram – Main (1/4) Section – ······················ 29
6-8. Schematic Diagram – Main (2/4) Section – ······················ 30
6-9. Schematic Diagram – Main (3/4) Section – ······················ 31
6-10. Schematic Diagram – Main (4/4) Section – ······················ 32
6-11.Printed Wiring Board – Main Section – ····························· 33
6-12. Printed Wiring Board – CD-L, CD-R Section – ················ 34
6-13. Schematic Diagram – CD-L, CD-R Section – ··················· 35
6-14. Printed Wiring Board – TC-A, TC-B Section – ················ 36
6-15. Schematic Diagram – TC-A, TC-B Section – ··················· 37
6-16.Printed Wiring Board – Panel VR, Key Section – ············· 38
6-17. Schematic Diagram – Panel VR, Key Section – ················ 39
6-18.Printed Wiring Board – Panel FL Section – ······················· 40
6-19. Schematic Diagram – Panel FL Section – ························· 41
6-20. Printed Wiring Board – Power Amp Section – ·················· 42
6-21. Schematic Diagram – Power Amp Section – ····················· 43
6-22. Printed Wiring Board – Sub Amp Section – ····················· 44
6-23. Schematic Diagram – Sub Amp Section – ························· 45
6-24. Printed Wiring Board – Mic Section – ······························ 46
6-25. Schematic Diagram – Mic Section – ································· 46
6-26. Printed Wiring Board – Power Supply Section – ·············· 47
6-27. Schematic Diagram – Power Supply Section – ················· 47
6-28. IC Pin Function Description ············································· 48
6-29. IC Block Diagram ····························································· 53

7-1. Case,Back Panel Section ··················································· 56
7-2. Front Panel Section-1 ························································ 57
7-3. Front Panel Section-2 ························································ 58
7-4. Chassis Section ·································································· 59
7-5. CD Mechanism Deck Section
        (CDM-30BD60C) ······························································· 60
7-6. Base Unit Section (BU-30BD60C) ···································· 61

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