Sony ICF-S79W Service Manual ▷ View online
ICF-S79W
5
Adjustment Location:
– MAIN BOARD (Component Side) –
– MAIN BOARD (Conductor Side) –
TP (VT)
TP (GND)
L6
AM
Frequency
Coverage Adjustment
L2
WB
Frequency
Coverage Adjustment
L4
FM
Frequency
Coverage Adjustment
L5
CT3
AM Tracking Adjustment
WB Tracking Adjustment
FM Tracking Adjustment
L11
WB/FM IF Adjustment
CT1
L1
T1
AM IF Adjustment
L3
CT2
ICF-S79W
6
SECTION 5
DIAGRAMS
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω and
1
/
4
W or less unless otherwise
specifi ed.
• f :
internal
component.
• C : panel designation.
• A : B+ Line.
• C : adjustment for repair.
• Power voltage is dc 4.5 V and fed with regulated dc power
• C : adjustment for repair.
• Power voltage is dc 4.5 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
( ) : AM
‹‹ ›› : WEATHER
• Voltages are taken with a VOM (Input impedance 10
( ) : AM
‹‹ ›› : WEATHER
• Voltages are taken with a VOM (Input impedance 10
M
Ω).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
F :
FM
f :
AM
L : WEATHER (1 – 5 ch)
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : parts extracted from the conductor side.
• W : indicates side identifi ed with part number.
• z :
• X : Parts extracted from the component side.
• Y : parts extracted from the conductor side.
• W : indicates side identifi ed with part number.
• z :
Through
hole.
• f : internal component.
•
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
ICF-S79W
ICF-S79W
7
7
5-1. SCHEMATIC DIAGRAM - MAIN Section -
• See page 10 for waveforms. • See page 10 for IC Block Diagrams. • See page 11 for IC Pin Function Description.
F l o a t i n g
L a n d
ICF-S79W
ICF-S79W
8
8
5-2. PRINTED WIRING BOARD - MAIN Board (Component Side) -
•
: Uses unleaded solder.
Ref. No. Location
• Semiconductor
Location
Q6
B-6
MAIN BOARD
(COMPONENT SIDE)
C29
C28
C31
C77
C93
JC24
JC2
JC32
JC25
JC23
C30
R61
R62
C74
L12
R17
R13
R12
R63
ECB
Q6
L14
JC31
C123
L13
C124
JC21
JC22
C35
1-718-070-
(13)
13
A
B
C
D
E
F
G
H
1
2
3
4
5
6
7
8
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