Sony ICF-403L Service Manual ▷ View online
Ver 1.0 1999.07
MICROFILM
ICF-403L
SERVICE MANUAL
FM/MW/LW 3 BAND RADIO
SPECIFICATIONS
AEP Model
East European model
AEP model
– 2 –
Specifications ........................................................................... 1
1. GENERAL
Location and Function of Controls .................................... 2
2. DISASSEMBLY
2-1. Cabinet (Rear) ............................................................. 3
2-2. Cabinet (Front) ........................................................... 3
2-3. Main Board, Chassis ................................................... 4
2-2. Cabinet (Front) ........................................................... 3
2-3. Main Board, Chassis ................................................... 4
3. DIAL POINTER INSTALLATION
........................... 5
4. ELECTRICAL ADJUSTMENTS
............................. 6
5. DIAGRAMS
5-1. Printed Wiring Boards ................................................ 7
5-2. Schematic Diagram ..................................................... 9
5-2. Schematic Diagram ..................................................... 9
6. EXPLODED VIEWS
................................................... 11
7. ELECTRICAL PARTS LIST
................................... 13
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
SECTION 1
GENERAL
Earphone jack (
@
)
DC IN 4.5V
LOCATION AND FUNCTION OF CONTROLS
– 3 –
SECTION 2
DISASSEMBLY
Note :
Follow the disassembly procedure in the numerical order given.
2-1. CABINET (REAR)
2-2. CABINET (FRONT)
r
The equipment can be removed using the following procedure.
Cabinet (Front)
Cabinet (Rear)
Set
Main board, Chassis
1
Screw
+P 2.6x8
Cabinet (front)
Black (–)
Brown
(+)
Chassis
Main board
2
Remove solder
3
Black (–)
Brown (+)
1
Screws
+BTP 3x12
4
Screw
+P 2.6x8
3
Lug, 3
Cabinet (rear)
Cabinet (front)
2
Claws
1
Screws
+BTP 3x12
– 4 –
2-3. MAIN BOARD, CHASSIS
2
Claws
4
Knob(tune)
3
1
Screw
+P 2.6x8
Chassis
Main board