Sony ICD-V21 Service Manual ▷ View online
ICD-V21
US Model
Canadian Model
AEP Model
E Model
Tourist Model
SERVICE MANUAL
IC RECORDER
MICROFILM
SPECIFICATIONS
Recording media
Built-in flash memory
Recording time
10 minutes
Frequency response
200 Hz - 2,500 Hz
Speaker
approx. 2.8 cm (1
1
/
8
in.) dia.
Power output
40 mw
Power requirements
Two lithium batteries : 3V DC
Dimensions (w/h/d) (incl. projecting parts and controls)
approx. 62
×
67.5
×
23.5 mm (2
3
/
8
×
2
5
/
8
×
15
/
16
in.)
Mass (including battery) Approx. 50g (1.8 oz)
Supplied accessories
Supplied accessories
Hand strap
(1)
CR2032 lithium batteries
(
2)
Design and specifications are subject to change without notice.
— 2 —
TABLE OF CONTENTS
SERVICE NOTE
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be damaged
by heat.
by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of soldering iron around 270 ˚C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering or
unsoldering.
unsoldering.
SERVICING NOTE
······················································ 2
1.
GENERAL
······································································ 3
2.
DISASSEMBLY
2-1.
MAIN board ······································································· 4
3.
DIAGRAMS
3-1.
IC Block Diagrams ····························································· 5
3-2.
Printed Wiring Board — MAIN Section — ······················· 6
3-3.
Schematic Diagram — MAIN Section — ·························· 9
3-4.
IC Pin Functions ······························································· 12
4.
EXPLODED VIEWS
·················································· 15
5.
ELECTRICAL PARTS LIST
··································· 16
ICD-V21
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
SECTION 3
DIAGRAMS
— 3 —
— 4 —
— 5 —
2-1.
MAIN board
SECTION 1
GENERAL
FRONT SIDE
3-1.
IC BLOCK DIAGRAMS
IC101
MSM6588LGS-2K
D3 10
D2 9
RSEL1 30
RSEL2 31
D1 8
D0 7
WR 1
RD 2
CE 3
MCUM 6
RESET 44
MON 42
XT 37
XT 38
MIN
22
MOUT
21
FIN
14
AOUT
13
FOUT
12
ADIN
11
SG
18
20 Stage
Address Counter
Address
Controller
DV
DD
39
DV
DD'
17
AV
DD
16
DGND
24
AGND
23
TEST
43
TEST
33
TEST
32
SAD
27
SAS
26
TAS
25
RWCK
41
WE
40
CS1
28
CS2
29
CS3 (STBY)
34
CS4 (RSEL0)
35
DI/O
36
TEST
4
TEST
5
OSC
LPF
_
+
Date I/O
I/O
CS4
20-bit
Address Register
20-bit
Stop Address Register
20-bit
Comparator
ADPCM
Analyzer/Synthsizer
Register
Contoroller
12 bit
DAC
12 bit
ADC
SG
Circuit
MCU I/F
T
iming
Controller
Status
Register
LIN
20
LOUT
19
AMON
15
_
+
RSEL0
1
REC/PB (OPB) LAMP
2
LCD window
3
Built-in MIC
4
ERASE button
1
2
3
4
5
7
6
!º
!¡
8
9
!™
REAR SIDE
5
SPECIAL MESSAGE button
6
Hand strap
7
REC START/STOP button
8
VOL knob
9
Jog lever
!º
BEEP/SHUFFULE button
!¡
Speaker
!™
HOLD knob
Remove the three claws
3
Front panel assy
4
Main board
1
Lid, battery case
2
Screw
(B 1.7
×
4)
ICD-V21
Ref. No.
Location
• Semiconductor
Location
Note:
• Y
: parts extracted from the conductor side.
•
®
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
— 6 —
— 7 —
— 8 —
3-2.
PRINTED WIRING BOARD —MAIN SECTION —
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component A)
the parts face are indicated.
1
2
A
B
C
D
E
F
3
4
5
6
7
8
9
10
11
D101
C-10
D102
B-10
D501
C-11
D550
C-3
D551
D-9
D701
B-8
IC101
E-4
IC102
C-9
IC103
D-3
IC502
C-2
IC503
D-2
IC701
C-8
IC702
C-4
IC703
C-5
Q103
D-3
Q104
B-10
Q501
B-3
Q701
E-5
Q702
E-5
Q703
D-5
Q704
B-8
Q753
B-3