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2012D33-1

© 

2012.04

Note:
Be sure to keep your PC used for service and 
checking of this unit always updated with the 
latest version of your anti-virus software.
In case a virus affected unit was found during 
service, contact your Service Headquarters. 

Capacity (User available capacity)
ICD-SX712/SX712D: 2 GB
(approx. 1.80 GB = 1,932,735,283 Byte)
ICD-SX713/SX813: 4 GB
(approx. 3.60 GB = 3,865,470,566 Byte)
A part of the memory capacity is used as a
management area.

Frequency range
•  LPCM 44.1 kHz/16bit: 40 Hz - 20,000 Hz
•  MP3 320 kbps: 40 Hz - 16,000 Hz
•  MP3 192 kbps: 40 Hz - 16,000 Hz
•  MP3 128 kbps: 40 Hz - 16,000 Hz
•  MP3 48 kbps (MONO): 40 Hz - 14,000 Hz
•  MP3 8 kbps (MONO): 50 Hz - 2,000 Hz

Bit rates and sampling frequencies for
MP3 fi les*

1

Bit rate: 32 - 320 kbps, VBR
Sampling frequencies: 16/22.05/24/32/44.1/
48 kHz
File extension: mp3

*

1

  The playback of MP3 fi les recorded using 

 

the IC recorder is also supported.

 

Not all encoders are supported.

Photo: ICD-SX713

Bit rate and sampling frequencies for
WMA fi les*

2

Bit rate: 32 - 192 kbps, VBR
Sampling frequencies: 44.1 kHz
File extension: wma

*

2

  WMA Ver. 9 is compatible, however, MBR

 

(Multi Bit Rate), Lossless, Professional, and

 

Voice are not supported.

 Copyright-protected 

fi le cannot

 

be played back.

 

Not all encoders are supported.

Bit rate and sampling frequencies for
AAC-LC fi les*

3

Bit rate: 16 - 320 kbps, VBR
Sampling frequencies:
11.025/12/16/22.05/24/32/44.1/48 kHz
File extension: .m4a

*

3

 Copyright-protected fi le cannot be

 played 

back.

 

Not all AAC encoders are supported.

Sampling frequencies and bit for linear
PCM fi les
Sampling frequencies: 22.05/44.1 kHz
Bit: 16 bit
File extension: .wav

Noise canceling function (for
ICD-SX813 only)
Digital noise canceling function
Environment setting:
Bus/ Train/ Airplane/ Offi ce

Total noise suppression ratio*

4

ICD-SX813 only)
Approx. 17 dB*

5

*

4

  Under the Sony measurement standard.

*

5

  Equivalent to approx. 98.0% reduction of

 

energy of sound compared with not wearing

 

headphones. ("Select NC Environment": 

 “Airplane”)

Speaker
Approx. 16 mm dia.

Input/Output
•  Microphone jack (minijack, stereo)
  – input for plug in power, minimum input
  level
 – 

1.5 

mW

•  Headphone jack (minijack, stereo)
  – output for 8 - 300 ohms impedance
  headphones
•  USB connector (mini-B jack)
  – High-Speed USB compatible
•  Memory Stick Micro

TM

 (M2

TM

)/ microSD 

  memory card slot

Playback speed control (DPC)
3.00 - 0.25 times

Power output
150 mW

– Continued on next page –

Power requirements
Two NH-AAA rechargeable batteries: 2.4 V DC
Two LR03 (size AAA) alkaline batteries: 3.0 V DC

Operating temperature
5 ˚C - 35 ˚C 

Dimensions (w/h/d) (not incl.
projecting parts and controls) (JEITA)*

6

Approx. 32.4 mm 

× 137.8 mm × 16 mm 

Mass (JEITA)*

6

Approx. 92 g including NH-AAA rechargeable batteries

*

6

  Measured value by the standard of JEITA

  (Japan Electronics and Information
 Technology 

Industries 

Association)

• 

Microsoft, Windows, Windows Vista and Windows

 

Media are registered trademarks or trademarks of

 

Microsoft Corporation in the United States and/or

 other 

countries.

• 

Macintosh and Mac OS are trademarks of Apple

 

Inc., registered in the USA and other countries.

• 

Pentium is a registered trademark of Intel

 Corporation.
• 

MPEG Layer-3 audio coding technology and

 

patents licensed from Fraunhofer IIS and Thomson.

• 

microSD and microSDHC logos are trademarks of

 SD-3C, 

LLC.

 
• 

“Memory Stick Micro,” “M2” and 

 are

 

trademarks or registered trademarks of Sony

 Corporation.
• 

“MagicGate” is a trademark of Sony Corporation.

• 

Nuance, the Nuance logo, Dragon, Dragon

 

NaturallySpeaking, and RealSpeak are trademarks

 

and/or registered trademarks of Nuance

 

Communications Inc., and/or its affi liates in the

 

United States and/or other countries.

• 

US and foreign patents licensed from Dolby

 Laboratories.

All other trademarks and registered trademarks are
trademarks or registered trademarks of their
respective holders. Furthermore, “

TM

 ” and “®” are

not mentioned in each case in this manual.

The “Sound Organizer” uses software modules as
shown below:
Windows Media Format Runtime

Design and specifi cations are subject to change without notice.

• Abbreviation
  CH 

: Chinese model

  CND  : Canadian model
  KR 

: Korean model

  LA 

: Latin American model

Remove the film on the display window 
before you use the IC recorder.

(for SX712: US, CND, CH, LA/SX712D: US, CND/SX713 only)

(for ICD-SX813 only)

(for ICD-SX813 only)

(for SX712: CH/SX712D/SX713/SX813 only)

Use this to cover the built-in microphones.

(for E, CH, KR only)

(for SX712D only)

(for SX712D only)

(for SX712: AEP, CH/SX712D/SX713/SX813 only)

(for ICD-SX813: CH only)

This card has a user available area and a 
management area. The capacity of this 
card available to the user is approximately 
3.6 GB.

(for ICD-SX813:CH only)

Operations are not guaranteed if you use 
any SD card adaptor other than the one 
supplied.

The operating instructions are stored as 
PDF files in the built-in memory of the IC 
recorder.

1-1.   Case (Rear) Assy .............................................................   5
1-2.   Panel (Front) Assy ..........................................................   5
1-3.   Sheet Switch ...................................................................   6
1-4.  Liquid Crystal Display Panel (LCD101) ........................   6
1-5.  Audio Board, LED Board ...............................................   7
1-6. Mic 

Sub 

Assy 

..................................................................   7

1-7. System 

Board 

..................................................................   8

1-8. SP001 

..............................................................................   8

1-9. Ornament 

(Mic) 

..............................................................   9

1-10. Cap (Mic) ........................................................................   9
1-11.  Cover (Mic) (Rear) .........................................................   10
1-12.  Cover (Mic) (Front) ........................................................   10
1-13.  Microphone Assy (MIC101, MIC102) ...........................   11

TEST  MODE 

 ............................................................   12

3-1.  Block Diagram –Audio Section– ....................................   17
3-2.  Block Diagram –Digital Section– ...................................   18
3-3.  Block Diagram –Display Section– .................................   19
3-4.  Schematic Diagram –Audio Section (1/3)– ....................   21
3-5.  Schematic Diagram –Audio Section (2/3)– ....................   22
3-6.  Schematic Diagram –Audio Section (3/3)– ....................   23
3-7.  Printed Wiring Boards –Audio Section (1/2)– ................   24
3-8.  Printed Wiring Board –Audio Section (2/2)– .................   25
3-9.  Printed Wiring Board –System Section (1/2)– ...............   26
3-10.  Printed Wiring Board –System Section (2/2)– ...............   27
3-11.  Schematic Diagram –System Section (1/6)– ..................   28
3-12.  Schematic Diagram –System Section (2/6)– ..................   29
3-13.  Schematic Diagram –System Section (3/6)– ..................   30
3-14.  Schematic Diagram –System Section (4/6)– ..................   31
3-15.  Schematic Diagram –System Section (5/6)– ..................   32
3-16.  Schematic Diagram –System Section (6/6)– ..................   33

4-1.  Panel (Front) Section ......................................................   53
4-2.  Case (Rear) Section ........................................................   54
4-3. LCD 

Section 

...................................................................  55

4-4. Chassis 

Section 

...............................................................  56

4-5. Mic 

Section 

.....................................................................  57

  ..............................   58

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

CAUTION
Risk of explosion if battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions of batter-
ies.

•  This set can be disassembled in the order shown below.