Sony ICD-MX20DR9 Service Manual ▷ View online
10
ICD-MX20DR9
[Test Mode]
The following checks can be implemented using the Test Mode.
How to Enter the Test Mode
To enter the test mode, turn ON the HOLD switch while pressing
the MENU key and VOLUME + key at the same time with the
power on.
To enter the test mode, turn ON the HOLD switch while pressing
the MENU key and VOLUME + key at the same time with the
power on.
How to Exit the Test Mode
Exit the test mode by turning OFF the power.
Exit the test mode by turning OFF the power.
Initial Status of the Test Mode
When the machine enters the test mode, the LCD display appears
as shown below.
When the machine enters the test mode, the LCD display appears
as shown below.
Select the desired item by using the > / . key, and press the
Nx button to set the selection.
Nx button to set the selection.
1. Version test
•
Version of the respective modules are verified.
2. Key Chk + Format test
•
Perform the key check by pressing the keys. The NAND
formatting (deleting all events) and the default settings of the
menus (default language and LCD contrast remain unchanged)
are executed at the same time.
formatting (deleting all events) and the default settings of the
menus (default language and LCD contrast remain unchanged)
are executed at the same time.
*
Nx / > / . / MENU /
/ REC/PAUSE zX /
STOP x / VOLUME + / VOLUME – / DIVIDE / A-B
/
DPC (ON/OFF) / VOICE UP (ON/OFF) /
DIRECTNT (ON/OFF) / HOLD
DIRECTNT (ON/OFF) / HOLD
3. Language test
•
Check the language and select the language. (Default language
is Japanese.)
is Japanese.)
•
Press VOLUME + button for English (ENG).
•
Press A-B
button for Japanese (JPN).
4. Loop Back test
Execute the DSP LOOP BACK.
5. Beep test
•
Beep sound of 1.3 kHz or 2 kHz is output.
•
Press the Nx key to start outputting and press the x button
to stop.
to stop.
6. LCD Cont test
•
Adjust the LCD contrast.
Default value is 07.
Default value is 07.
•
Adjust the LCD contrast using the > / . key.
7. RTC Int test
•
Perform the self test of the RTC..
8. Battery test
•
The detected A/D value of the battery remaining power is
checked.
checked.
Selecting items.
setting by the
button
F/W version of
CPU (ARM block)
CPU (ARM block)
F/W version of
CPU (DSP block)
CPU (DSP block)
F/W version of
SUB-SPU
SUB-SPU
The checked key is display.
When all checks are completed,
the back-Light turns on for 0.5
seconds
the back-Light turns on for 0.5
seconds
The NAND formatting
(deleting all events)
and the befault settings
of the menus are completed.
(deleting all events)
and the befault settings
of the menus are completed.
Total of 15 keys* are counted.
SECTION 3
TEST MODE
11
ICD-MX20DR9
9. DC-IN test
•
The present A/D value of the DC-IN signal is checked.
•
When the external DC-IN is not connected, NG is display.
10. VBUS test
•
Presence/absence of the VBUS is checked.
If it is connected, OK is display.
If it is connected, OK is display.
11. Sleep test
•
Sleep is tested.
Note:
When < Sleep > is selected, the machine enter the sleep mode.
To exit the sleep mode, turn off the power.
To exit the sleep mode, turn off the power.
12. Log Output test
•
This is the log output to be used for engineering design.
Note:
Not used.
13. Key Chk test
•
Key check only is executed when the key is pressed.
[F/W Upgrade Method]
When upgrading of the F/W becomes necessary for bug corrrection
and others, perform upgrading as described below.
and others, perform upgrading as described below.
1. Copy the following files into the destination that is immediately
below the Memory Stick Duo drive.
(The following files will be distributed as necessitated when
bug fix becomes necessary.)
(The following files will be distributed as necessitated when
bug fix becomes necessary.)
• ldrasm.mot (Upgrade driver)
• CHIPEXEC.MOT (F/W of the product)
• update.pls (Upgrade MS identification file)
• CHIPEXEC.MOT (F/W of the product)
• update.pls (Upgrade MS identification file)
2. Insert the Memory Stick Duo that is prepared in step 1 into
the Memory Stick slot of the product. Then turn on the power.
(Use either a new battery or the AC adapter.)
(Use either a new battery or the AC adapter.)
3. While the screen showing the access menu is being displayed,
leave the machine as it is. The OPE-LED (red) lights on and it
turns off after about one minute.
Then remove the battery or disconnect the AC adapter. Remove
the Memory Stick Duo. This completes the F/W upgrade. Use
the test mode to check the version number of the F/W.
turns off after about one minute.
Then remove the battery or disconnect the AC adapter. Remove
the Memory Stick Duo. This completes the F/W upgrade. Use
the test mode to check the version number of the F/W.
4. Once the upgrading is executed, the update.pls file will be
automatically deleted.
If you want to repeat the F/W upgrading, copy the update.pls
file again in the Memory Stick Duo.
If you want to repeat the F/W upgrading, copy the update.pls
file again in the Memory Stick Duo.
Supplementary information:
If you want to a great many number of products, copy the
testmode.ind file additionally that enables repetition of the
upgrading.
If you want to a great many number of products, copy the
testmode.ind file additionally that enables repetition of the
upgrading.
• ldrasm.mot (Upgrade driver)
• CHIPEXEC.MOT (F/W of the product)
• update.pls (Upgrade MS identification file)
• testmode.ind (Special file to be used in assembly factory)
• CHIPEXEC.MOT (F/W of the product)
• update.pls (Upgrade MS identification file)
• testmode.ind (Special file to be used in assembly factory)
Note:
Never turn off the power while upgrading is in progress. If the power
is turned off or if the Memory Stick Duo is removed while the
upgrading is in progress, the upgrading will end with failure. (It can
result in defective operations such as power cannot be turned on, or
operation becomes strange.)
In such a case, the product must be disassembled and the upgrading
is required. Please contact us for more details in such a case.
is turned off or if the Memory Stick Duo is removed while the
upgrading is in progress, the upgrading will end with failure. (It can
result in defective operations such as power cannot be turned on, or
operation becomes strange.)
In such a case, the product must be disassembled and the upgrading
is required. Please contact us for more details in such a case.
The following files can be created by creating an arbitrary text file
and by changing the file name.
and by changing the file name.
• update.pls (Upgrade MS identification file)
• testmode.ind (Special file to be used in assembly factory)
• testmode.ind (Special file to be used in assembly factory)
12
ICD-MX20DR9
SECTION 4
DIAGRAMS
Note on Schematic Diagrams:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise specified.
•
f
: internal tolerance.
•
C
: panel designation.
•
A
: B+ Line.
• Power voltage is dc 3V and fed with regulated dc power supply
from DC IN jack (J1501).
• Voltages and waveforms are dc with respect to ground under no-
signal (detuned) conditions.
no mark : PB
( )
no mark : PB
( )
: REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production toler-
ances.
ances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
ances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PB
L
: REC
*
Replacement of IC6001, IC8101 and IC8201 used in this set re-
quires a special tool.
quires a special tool.
• The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conven-
tional IC.
tional IC.
Note on Printed Wiring Boards:
•
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
*
Replacement of IC6001, IC8101 and IC8201 used in this set
requires a special tool.
requires a special tool.
• Lead layouts
Lead layout of
conventional IC
CSP (chip size package)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
surface
13
13
ICD-MX20DR9
ICD-MX20DR9
4-1. BLOCK DIAGRAM – MAIN SECTION-1 –
Signal path
: REC
: PB
28
24
13
12
8
6
5
31
1
53
62
172
44
177
64
IC6001(1/3)
CPU
G10-P29
BLCD-AD
SIOM_CLK
SIOM_CLK
GIO_P20
GIO_P11
70 GIO_P37
SIOM CS2
2
CKO
69
GIO P36
1
CKI
X6001
11.2896MHz
IC5204
VDD DSP1
RESET
XCS BLCD
XCS BLCD
1
IC1304
CLOCK GEN
IC7001(1/3)
SYSTEM CONTROLLER
FOUT
Q1301
MUTE
J1302
(SPEAKER)
3
9
7
8
10
IC4201
REAL TIME CLOCK
CLK
DI
DO
CE
IRQ
82
GIO_P49
174 IDM MOS1
IDM MOS1
IC1303
ADC, DAC, HEADPHONE AMP
LINPUT1
22 MICBIAS
LINPUT3
LOUT1
ROUT1
10 MONOOUT
25
26
RINPUT2
LINPUT2
ADCDAT
STDO
DCLK
SDIN
SDIN
DACDAT
MCLK
BCLK
BEEP
23
RINPUT3
7
DACLRC
LRCK
SO
30
CSB
32
SCLK
CSB
SCLK
41
P07
60
P41/INT21/SCK2
53
P33/S11(U11)
52
P32/S01(U01)
51
P31/SCK1(UCK1)/LMCO
SP3001
LIQUID
CRYSTAL
DISPLAY
SWITCH UNIT
A
MIC
IC1305
POWER AMP
OUT–
OUT+
-IN
XSHUT-
DOWN
5
8
4
1
J1301
5
3
XT
XXT
X1301
11.2896MHz
Q1351
MIC AMP
Q1251
MIC AMP
Q1151
MIC AMP
3
P50/AN0
SCPU_XRST
KEY AD1
LED XRED
LED XGREEN
BLCD
LIGHT
8
P55/AN5
31
P21/PPG01
30
P22/PPG02
26
P26
VDD I01
Q9503
SWITCH
27 RINPUT1
MAIN
SECTION-2
(Page 14)
(PLUG IN POWER)
(CENTER)
(R-ch)
(L-ch)
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