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2

Index to Parts and Controls ..................................................... 3

2-1.   Upper Lid Assy ................................................................... 4
2-2.   F-SW Board, P-SW Board .................................................. 5
2-3.   Main Board ......................................................................... 5

3-1.   IC Pin Description ............................................................... 6
3-2.   Block Diagram .................................................................... 9
3-3.   Schematic Diagram – Main Section – ............................... 10
3-4.   Printed Wiring Board – Main Section – ............................ 11
3-5.   Printed Wiring Board – F-SW Section – ........................... 12
3-6.   Printed Wiring Board – P-SW Section – ........................... 13
3-7.   IC Block Diagrams ............................................................ 14

4-1.   Case Section ...................................................................... 15
4-2.   Main Board Section .......................................................... 16

......................................... 17

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than

ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

3

This section is extracted
from instruction manual.

MIC jack
(PLUG IN POWER)
EAR (earphone) jack

OPR (operation) indicator

z

REC (record) /STOP

X

 PAUSE

— .REVIEW/
>

+CUE

Nx

PLAY/STOP•

EXECUTE

HOLD

VOL (volume)

MIC

(built-in microphone)

Display window

FOLDER

INDEX

DISPLAY

MIC SENSE

(microphone sensitivity)

MENU

ERASE

Speaker

STOP

Battery
compartment

Hook for handstrap
(not supplied)

Selected message
number/Mode
indication of the
menu (ON, OFF, etc.)

REC (recording)
indicator

Remaining battery
indicator

Remaining memory
indicator

Counter /Remaining time indication /Recording date
indication /Current time indication (15:30, etc.) /Menu
indication (ALARM, BEEP,  etc.) /Messages (ERASE, HOLD,
etc.)

Folder indication

Alarm indicator

Repeat play indicator

Microphone sensitivity

indication

REC DATE (recorded date)

indication

REMAIN indicator

4

Note : This set can be disassemble according to the following sequence.

Note : Follow the disassembly procedure in the numerical order given.

2-1.

UPPER LID ASSY
(Page 4)

2-2.

F-SW BOARD,
P-SW BOARD
(Page 5)

SET

2-3.

MAIN BOARD
(Page 5)

1

 B 1.7x10

4

 claw

2

 B 1.7x7

7

 screws 1.7x2.5

8

 speaker (SP101)

3

 claws

5

 claws

9

 upper lid assy

case assy

6

claw

5

1

 CN701

2

case assy

4

 F-SW board

5

 P-SW board

3

 Removal the five solders.

3

 screw

4

 claw

5

 claw

case assy

1

 Removal the two solders.

6

 MAIN board

2

 speaker (SP101)