Sony HT-ST3 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HT-ST3
SA-WST3
SPECIFICATIONS
HT-ST3
SOUND BAR
SA-WST3
ACTIVE SUBWOOFER
9-893-830-01
2013I33-1
©
2013.09
AEP Model
UK Model
E Model
Australian Model
Ver. 1.0 2013.09
• All of the units included in the HT-ST3 (SA-
WST3/SS-ST3) are required to confi rming
operation of SA-WST3. Check in advance
that you have all of the units.
operation of SA-WST3. Check in advance
that you have all of the units.
COMPONENT MODEL NAME
HT-ST3
Bar Speaker (Speaker System)
SS-ST3
Subwoofer (Active Subwoofer)
SA-WST3
• Please refer to service manual separately issued
for Bar Speaker.
Amplifier section
POWER OUTPUT (rated)
Front L + Front R: 15 W + 15 W (at 3 ohms, 1 kHz, 1 % THD)
POWER OUTPUT (reference)
Front L / Front R speaker: 25 W × 2 (per channel at 3 ohms, 1 kHz)
Center speaker: 25 W × 2 (per channel at 3 ohm, 1 kHz)
Subwoofer: 75 W × 2 (per channel at 4 ohm, 100 Hz)
Center speaker: 25 W × 2 (per channel at 3 ohm, 1 kHz)
Subwoofer: 75 W × 2 (per channel at 4 ohm, 100 Hz)
Inputs
HDMI IN 1/2/3*
DIGITAL IN TV/OPT
ANALOG IN
DIGITAL IN TV/OPT
ANALOG IN
* These 3 jacks are identical. Using any of them makes no difference.
Output
Output
HDMI OUT ARC(TV)
Speaker section
Speaker system
Subwoofer, Bass Reflex
Speaker
100 mm × 150 mm cone type × 2
Rated impedance
4 ohms
BLUETOOTH section
Communication system
BLUETOOTH Specification version 3.0
Output
BLUETOOTH Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m
1)
Maximum number of devices to be registered
9 devices
Frequency band
2.4 GHz band (2.4000 GHz - 2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible BLUETOOTH profiles
2)
A2DP (Advanced Audio Distribution Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)
Supported Codecs
3)
SBC
4)
, AAC
5)
, aptX
1) The actual range will vary depending on factors such as obstacles
between devices, magnetic fields around a microwave oven, static
electricity, cordless phone, reception sensitivity, operating system,
software application, etc.
electricity, cordless phone, reception sensitivity, operating system,
software application, etc.
2) BLUETOOTH standard profiles indicate the purpose of BLUETOOTH
communication between devices.
3) Codec: Audio signal compression and conversion format
4) Subband Codec
5) Advanced Audio Coding
4) Subband Codec
5) Advanced Audio Coding
General
Power requirements
220 V - 240 V AC, 50 Hz/60 Hz
Power consumption
On: 40 W
At Standby mode “Control for HDMI” is off and BLUETOOTH Standby
mode is off : 0.5 W or less
At Standby mode “Control for HDMI” is off and BLUETOOTH Standby
mode is off : 0.5 W or less
Dimensions (approx.)
430 mm × 135 mm × 370.5 mm (w/h/d)
Mass (approx.)
8.2 kg
Digital audio input formats supported by the system
* It is possible to input these formats only with HDMI connection.
Dolby Digital
DTS-HD High Resolution Audio*
Dolby TrueHD*
DTS-HD Low Bit Rate*
DTS
Linear PCM 2ch 48 kHz or less
DTS 96/24
Linear PCM Maximum 7.1ch 192 kHz or less*
DTS-HD Master Audio*
– Continued on next page –
HT-ST3
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This system incorporates Dolby* Digital and the DTS** Digital Surround
System.
* Manufactured under license from Dolby Laboratories.
System.
* Manufactured under license from Dolby Laboratories.
Dolby, and the double-D symbol are trademarks of Dolby Laboratories.
** Manufactured under license under U.S. Patent Nos: 5,956,674;
5,974,380; 6,226,616; 6,487,535; 7,212,872; 7,333,929; 7,392,195;
7,272,567 & other U.S. and worldwide patents issued & pending.
DTS-HD, the Symbol, & DTS-HD and the Symbol together are registered
trademarks of DTS, Inc.
Product includes software. © DTS, Inc.
All Rights Reserved.
7,272,567 & other U.S. and worldwide patents issued & pending.
DTS-HD, the Symbol, & DTS-HD and the Symbol together are registered
trademarks of DTS, Inc.
Product includes software. © DTS, Inc.
All Rights Reserved.
The BLUETOOTH
®
word mark and logos are registered trademarks owned
by Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is
under license.
under license.
This system incorporates High-Definition Multimedia Interface (HDMI™)
technology.
The terms HDMI and HDMI High-Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered trademarks of HDMI Licensing LLC
in the United States and other countries.
technology.
The terms HDMI and HDMI High-Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered trademarks of HDMI Licensing LLC
in the United States and other countries.
“BRAVIA” logo is a trademark of Sony Corporation.
“x.v.Colour” and “x.v.Colour” logo are trademarks of Sony Corporation.
The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the
United States and in other countries.
United States and in other countries.
Android is a trademark of Google Inc.
© 2012 CSR plc and its group companies.
The aptX® mark and the aptX logo are trade marks of CSR plc or one of its
group companies and may be registered in one or more jurisdictions.
The aptX® mark and the aptX logo are trade marks of CSR plc or one of its
group companies and may be registered in one or more jurisdictions.
Other trademarks and trade names are those of their respective owners.
Copyrights
Accesseries
Remote control (1)
R03 (size AAA) batteries (2)
Stands (2)
Speaker pads (4)
Speaker cushions* (2)
Digital optical cable for a TV (1)
Operating Instructions (1)
Reference Guide (1)
* For installing the Bar Speaker on a wall
R03 (size AAA) batteries (2)
Stands (2)
Speaker pads (4)
Speaker cushions* (2)
Digital optical cable for a TV (1)
Operating Instructions (1)
Reference Guide (1)
* For installing the Bar Speaker on a wall
Video formats supported by the system
Input/Output (HDMI Repeater block)
Design and specifications are subject change without notice.
Information regarding environmen t-friendly products
File
2D
3D
Frame
packing
Side-by-
Side (Half)
Over-under
(Top-and-
Bottom)
4096 × 2160p @ 23.98/24 Hz
3840 × 2160p @ 29.97/30 Hz
3840 × 2160p @ 25 Hz
3840 × 2160p @ 23.98/24 Hz
1920 × 1080p @ 59.94/60 Hz
1920 × 1080p @ 50 Hz
1920 × 1080p @ 29.97/30 Hz
1920 × 1080p @ 25 Hz
1920 × 1080p @ 23.98/24 Hz
1920 × 1080i @ 59.94/60 Hz
1920 × 1080i @ 50 Hz
1280 × 720p @ 59.94/60 Hz
1280 × 720p @ 50 Hz
1280 × 720p @ 29.97/30 Hz
1280 × 720p @ 23.98/24 Hz
720 × 480p @ 59.94/60 Hz
720 × 576p @ 50 Hz
640 × 480p @ 59.94/60 Hz
Standby power consumption: 0.5 W
or less
Over 85 % power efficiency of
amplifier block is achieved with the
full digital amplifier, S-Master.
or less
Over 85 % power efficiency of
amplifier block is achieved with the
full digital amplifier, S-Master.
HT-ST3
3
1.
SERVICING NOTES
.............................................
4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 7
2-2. Rear
Cover
...................................................................... 8
2-3. Rear Panel Block ............................................................ 8
2-4. AMP
2-4. AMP
Board
..................................................................... 9
2-5. Power Bracket Block ...................................................... 10
2-6. IO
2-6. IO
TERMINAL
Board
.................................................... 10
2-7. SP
TERMINAL
Board
.................................................... 11
2-8. Main Bracket Block, Fuse (F501) ................................... 11
2-9. Power Cord (AC1) .......................................................... 12
2-10. POWER board ................................................................ 12
2-11. Side Cover Panel (L, R) Block ....................................... 13
2-12. Side Panel (L, R) Block .................................................. 13
2-13. Loudspeaker (10 X 15) (SP1, SP2) ................................. 14
2-14. Catcher ............................................................................ 15
2-15. Front Duct Block ............................................................ 15
2-16. Front Panel Block ........................................................... 16
2-17. Bluetooth Module (BT1) ................................................ 17
2-18. NFC Module (NFC1) ...................................................... 18
2-9. Power Cord (AC1) .......................................................... 12
2-10. POWER board ................................................................ 12
2-11. Side Cover Panel (L, R) Block ....................................... 13
2-12. Side Panel (L, R) Block .................................................. 13
2-13. Loudspeaker (10 X 15) (SP1, SP2) ................................. 14
2-14. Catcher ............................................................................ 15
2-15. Front Duct Block ............................................................ 15
2-16. Front Panel Block ........................................................... 16
2-17. Bluetooth Module (BT1) ................................................ 17
2-18. NFC Module (NFC1) ...................................................... 18
3.
TEST MODE
............................................................ 19
4. DIAGRAMS
4-1. Block Diagram - HDMI Section - ................................... 23
4-2. Block Diagram - MAIN Section - ................................... 24
4-3. Block Diagram - AMP Section - ..................................... 25
4-4. Block
4-2. Block Diagram - MAIN Section - ................................... 24
4-3. Block Diagram - AMP Section - ..................................... 25
4-4. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 26
4-5. Printed Wiring Board - AMP Board (Side A) - ............... 28
4-6. Printed Wiring Board - AMP Board (Side B) - ............... 29
4-6. Printed Wiring Board - AMP Board (Side B) - ............... 29
TABLE OF CONTENTS
4-7. Schematic Diagram - AMP Board (1/6) - ....................... 30
4-8. Schematic Diagram - AMP Board (2/6) - ....................... 31
4-9. Schematic Diagram - AMP Board (3/6) - ....................... 32
4-10. Schematic Diagram - AMP Board (4/6) - ....................... 33
4-11. Schematic Diagram - AMP Board (5/6) - ....................... 34
4-12. Schematic Diagram - AMP Board (6/6) - ....................... 35
4-13. Printed Wiring Boards - IO/SP TERMINAL Section - ... 36
4-14. Schematic Diagram - IO/SP TERMINAL Section - ....... 37
4-15. Printed Wiring Boards - KEY Section - .......................... 38
4-16. Schematic Diagram - KEY Section - .............................. 39
4-17. Printed Wiring Board - FL Board - ................................. 40
4-18. Schematic Diagram - FL Board - .................................... 41
4-19. Printed Wiring Board - POWER Board - ........................ 42
4-20. Schematic Diagram - POWER Board - .......................... 43
4-8. Schematic Diagram - AMP Board (2/6) - ....................... 31
4-9. Schematic Diagram - AMP Board (3/6) - ....................... 32
4-10. Schematic Diagram - AMP Board (4/6) - ....................... 33
4-11. Schematic Diagram - AMP Board (5/6) - ....................... 34
4-12. Schematic Diagram - AMP Board (6/6) - ....................... 35
4-13. Printed Wiring Boards - IO/SP TERMINAL Section - ... 36
4-14. Schematic Diagram - IO/SP TERMINAL Section - ....... 37
4-15. Printed Wiring Boards - KEY Section - .......................... 38
4-16. Schematic Diagram - KEY Section - .............................. 39
4-17. Printed Wiring Board - FL Board - ................................. 40
4-18. Schematic Diagram - FL Board - .................................... 41
4-19. Printed Wiring Board - POWER Board - ........................ 42
4-20. Schematic Diagram - POWER Board - .......................... 43
5.
EXPLODED VIEWS
5-1. Rear Panel Section .......................................................... 57
5-2. Side Cover Panel Section ................................................ 58
5-3. AMP Board Section ........................................................ 59
5-4. POWER Board Section ................................................... 60
5-5. Side Panel Section .......................................................... 61
5-6. Speaker
5-2. Side Cover Panel Section ................................................ 58
5-3. AMP Board Section ........................................................ 59
5-4. POWER Board Section ................................................... 60
5-5. Side Panel Section .......................................................... 61
5-6. Speaker
Section
............................................................... 62
5-7. Front Duct Section .......................................................... 63
5-8. Front Panel Section ......................................................... 64
5-9. SW Cabinet Section ........................................................ 65
5-8. Front Panel Section ......................................................... 64
5-9. SW Cabinet Section ........................................................ 65
6.
ELECTRICAL PARTS LIST
.............................. 66
Accessories are given in the last of the electrical parts list.
HT-ST3
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
All of the units included in the HT-ST3 (SA-WST3/SS-ST3) are
required to confi rming operation of SA-WST3. Check in advance
that you have all of the units.
ERATION
All of the units included in the HT-ST3 (SA-WST3/SS-ST3) are
required to confi rming operation of SA-WST3. Check in advance
that you have all of the units.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
NOTE OF REPLACING THE IC3506 ON THE AMP BOARD
IC3506 on the AMP board cannot exchange with single. When this
part is damaged, exchange the complete mounted board.
IC3506 on the AMP board cannot exchange with single. When this
part is damaged, exchange the complete mounted board.
NOTE OF REPLACING THE IC3005 AND IC3007 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC3005 and IC3007 on the AMP board and the complete
AMP board are replaced, it is necessary to spread the compound
between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below.
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC3005 and IC3007 on the AMP board and the complete
AMP board are replaced, it is necessary to spread the compound
between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below.
– AMP Board (Component Side) –
thermal compound (G747)
IC3007
IC3005
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C519) to
discharge the capacitor (C519).
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C519) to
discharge the capacitor (C519).
C519
– POWER Board (Conductor Side) –
800
:/2 W