DOWNLOAD Sony HT-ST3 Service Manual ↓ Size: 5.48 MB | Pages: 78 in PDF or view online for FREE

Model
HT-ST3
Pages
78
Size
5.48 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
ht-st3.pdf
Date

Sony HT-ST3 Service Manual ▷ View online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HT-ST3
SA-WST3
SPECIFICATIONS
HT-ST3
SOUND BAR
SA-WST3
ACTIVE SUBWOOFER
9-893-830-01
2013I33-1
© 
2013.09
AEP Model
UK Model
E Model
Australian Model
Ver. 1.0  2013.09
•  All of the units included in the HT-ST3 (SA-
WST3/SS-ST3) are required to confi rming 
operation of SA-WST3. Check in advance 
that you have all of the units.
COMPONENT  MODEL  NAME
HT-ST3
Bar Speaker (Speaker System)
SS-ST3
Subwoofer (Active Subwoofer)
SA-WST3
•  Please refer to service manual separately issued 
for Bar Speaker.
Amplifier section
POWER OUTPUT (rated)
Front L + Front R: 15 W + 15 W (at 3 ohms, 1 kHz, 1 % THD)
POWER OUTPUT (reference)
Front L / Front R speaker: 25 W × 2 (per channel at 3 ohms, 1 kHz)
Center speaker: 25 W × 2 (per channel at 3 ohm, 1 kHz)
Subwoofer: 75 W × 2 (per channel at 4 ohm, 100 Hz)
Inputs
HDMI IN 1/2/3*
DIGITAL IN TV/OPT
ANALOG IN
* These 3 jacks are identical. Using any of them makes no difference.
Output
HDMI OUT ARC(TV)
Speaker section
Speaker system
Subwoofer, Bass Reflex
Speaker 
100 mm × 150 mm cone type × 2
Rated impedance
4 ohms
BLUETOOTH section 
Communication system 
BLUETOOTH Specification version 3.0
Output 
BLUETOOTH Specification Power Class 2
Maximum communication range 
Line of sight approx. 10 m
1)
Maximum number of devices to be registered
9 devices
Frequency band 
2.4 GHz band (2.4000 GHz - 2.4835 GHz) 
Modulation method 
FHSS (Freq Hopping Spread Spectrum) 
Compatible BLUETOOTH profiles
2)
A2DP (Advanced Audio Distribution Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)
Supported Codecs
3)
SBC
4)
, AAC
5)
, aptX
1) The actual range will vary depending on factors such as obstacles 
between devices, magnetic fields around a microwave oven, static 
electricity, cordless phone, reception sensitivity, operating system, 
software application, etc.
2) BLUETOOTH standard profiles indicate the purpose of BLUETOOTH 
communication between devices.
3) Codec: Audio signal compression and conversion format
4) Subband Codec
5) Advanced Audio Coding
General
Power requirements
220 V - 240 V AC, 50 Hz/60 Hz
Power consumption
On: 40 W
At Standby mode “Control for HDMI” is off and BLUETOOTH Standby 
mode is off : 0.5 W or less
Dimensions (approx.)
430 mm × 135 mm × 370.5 mm (w/h/d)
Mass (approx.)
8.2 kg
Digital audio input formats supported by the system
* It is possible to input these formats only with HDMI connection.
Dolby Digital
DTS-HD High Resolution Audio*
Dolby TrueHD*
DTS-HD Low Bit Rate*
DTS
Linear PCM 2ch 48 kHz or less
DTS 96/24
Linear PCM Maximum 7.1ch 192 kHz or less*
DTS-HD Master Audio*
– Continued on next page –
HT-ST3
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
This system incorporates Dolby* Digital and the DTS** Digital Surround 
System.
* Manufactured under license from Dolby Laboratories.
Dolby, and the double-D symbol are trademarks of Dolby Laboratories.
** Manufactured under license under U.S. Patent Nos: 5,956,674; 
5,974,380; 6,226,616; 6,487,535; 7,212,872; 7,333,929; 7,392,195; 
7,272,567 & other U.S. and worldwide patents issued & pending. 
DTS-HD, the Symbol, & DTS-HD and the Symbol together are registered 
trademarks of DTS, Inc.
Product includes software. © DTS, Inc.
All Rights Reserved.
The BLUETOOTH
®
 word mark and logos are registered trademarks owned 
by Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is 
under license.
This system incorporates High-Definition Multimedia Interface (HDMI™) 
technology. 
The terms HDMI and HDMI High-Definition Multimedia Interface, and the 
HDMI Logo are trademarks or registered trademarks of HDMI Licensing LLC 
in the United States and other countries.
“BRAVIA” logo is a trademark of Sony Corporation.
“x.v.Colour” and “x.v.Colour” logo are trademarks of Sony Corporation.
The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the 
United States and in other countries.
Android is a trademark of Google Inc.
© 2012 CSR plc and its group companies.
The aptX® mark and the aptX logo are trade marks of CSR plc or one of its 
group companies and may be registered in one or more jurisdictions.
Other trademarks and trade names are those of their respective owners.
Copyrights
Accesseries
Remote control (1)
R03 (size AAA) batteries (2)
Stands (2)
Speaker pads (4)
Speaker cushions* (2)
Digital optical cable for a TV (1)
Operating Instructions (1)
Reference Guide (1)
* For installing the Bar Speaker on a wall
Video formats supported by the system
Input/Output (HDMI Repeater block) 
Design and specifications are subject change without notice. 
Information regarding environmen t-friendly products
File
2D
3D
Frame
packing
Side-by-
Side (Half)
Over-under
(Top-and-
Bottom)
4096 × 2160p @ 23.98/24 Hz
3840 × 2160p @ 29.97/30 Hz
3840 × 2160p @ 25 Hz
3840 × 2160p @ 23.98/24 Hz
1920 × 1080p @ 59.94/60 Hz
1920 × 1080p @ 50 Hz
1920 × 1080p @ 29.97/30 Hz
1920 × 1080p @ 25 Hz
1920 × 1080p @ 23.98/24 Hz
1920 × 1080i @ 59.94/60 Hz
1920 × 1080i @ 50 Hz
1280 × 720p @ 59.94/60 Hz
1280 × 720p @ 50 Hz
1280 × 720p @ 29.97/30 Hz
1280 × 720p @ 23.98/24 Hz
720 × 480p @ 59.94/60 Hz
720 × 576p @ 50 Hz
640 × 480p @ 59.94/60 Hz 
Standby power consumption: 0.5 W
or less
Over 85 % power efficiency of
amplifier block is achieved with the
full digital amplifier, S-Master.
HT-ST3
3
1. 
SERVICING  NOTES 
 .............................................  
4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   7
2-2. Rear 
Cover 
......................................................................   8
2-3.  Rear Panel Block ............................................................   8
2-4. AMP 
Board 
.....................................................................   9
2-5.  Power Bracket Block ......................................................   10
2-6. IO 
TERMINAL 
Board 
....................................................  10
2-7. SP 
TERMINAL 
Board 
....................................................  11
2-8.  Main Bracket Block, Fuse (F501) ...................................   11
2-9.  Power Cord (AC1) ..........................................................   12
2-10. POWER board ................................................................   12
2-11.  Side Cover Panel (L, R) Block .......................................   13
2-12.  Side Panel (L, R) Block ..................................................   13
2-13.  Loudspeaker (10 X 15) (SP1, SP2) .................................   14
2-14. Catcher ............................................................................   15
2-15.  Front Duct Block ............................................................   15
2-16.  Front Panel Block ...........................................................   16
2-17.  Bluetooth Module (BT1) ................................................   17
2-18.  NFC Module (NFC1) ......................................................   18
3. 
TEST  MODE 
 ............................................................   19
4. DIAGRAMS
4-1.  Block Diagram - HDMI Section - ...................................   23
4-2.  Block Diagram - MAIN Section - ...................................   24
4-3.  Block Diagram - AMP Section - .....................................   25
4-4. Block 
Diagram 
- PANEL/POWER SUPPLY Section - ............................   26
4-5.  Printed Wiring Board - AMP Board (Side A) - ...............   28
4-6.  Printed Wiring Board - AMP Board (Side B) - ...............   29
TABLE  OF  CONTENTS
4-7.  Schematic Diagram - AMP Board (1/6) - .......................   30
4-8.  Schematic Diagram - AMP Board (2/6) - .......................   31
4-9.  Schematic Diagram - AMP Board (3/6) - .......................   32
4-10.  Schematic Diagram - AMP Board (4/6) - .......................   33
4-11.  Schematic Diagram - AMP Board (5/6) - .......................   34
4-12.  Schematic Diagram - AMP Board (6/6) - .......................   35
4-13.  Printed Wiring Boards - IO/SP TERMINAL Section - ...   36
4-14.  Schematic Diagram - IO/SP TERMINAL Section - .......   37
4-15.  Printed Wiring Boards - KEY Section - ..........................   38
4-16.  Schematic Diagram - KEY Section - ..............................   39
4-17.  Printed Wiring Board - FL Board - .................................   40
4-18.  Schematic Diagram - FL Board - ....................................   41
4-19.  Printed Wiring Board - POWER Board - ........................   42
4-20.  Schematic Diagram - POWER Board - ..........................   43
5. 
EXPLODED  VIEWS
5-1.  Rear Panel Section ..........................................................   57
5-2.  Side Cover Panel Section ................................................   58
5-3.  AMP Board Section ........................................................   59
5-4.  POWER Board Section ...................................................   60
5-5.  Side Panel Section ..........................................................   61
5-6. Speaker 
Section 
...............................................................  62
5-7.  Front Duct Section ..........................................................   63
5-8.  Front Panel Section .........................................................   64
5-9.  SW Cabinet Section ........................................................   65
6. 
ELECTRICAL  PARTS  LIST 
 ..............................   66
Accessories are given in the last of the electrical parts list.
HT-ST3
4
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
ADVANCE  PREPARATION  WHEN  CONFIRMING  OP-
ERATION
All of the units included in the HT-ST3 (SA-WST3/SS-ST3) are 
required to confi rming operation of SA-WST3. Check in advance 
that you have all of the units.
NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But don’t perform the operation 
check in the long time, and perform the operation check in the 
volume state as low as possible.
NOTE  OF  REPLACING  THE  IC3506  ON  THE  AMP  BOARD
IC3506 on the AMP board cannot exchange with single. When this 
part is damaged, exchange the complete mounted board.
NOTE  OF  REPLACING  THE  IC3005  AND  IC3007  ON  
THE  AMP  BOARD  AND  THE  COMPLETE  AMP  BOARD
When IC3005 and IC3007 on the AMP board and the complete 
AMP board are replaced, it is necessary to spread the compound 
between the AMP board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below.
– AMP Board (Component Side) –
thermal compound (G747)
IC3007
IC3005
CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING 
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C519) to 
discharge the capacitor (C519).
C519
– POWER Board (Conductor Side) –
800 
:/2 W
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Sony HT-ST3 Service Manual ▷ Download

  • DOWNLOAD Sony HT-ST3 Service Manual ↓ Size: 5.48 MB | Pages: 78 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony HT-ST3 in PDF for free, which will help you to disassemble, recover, fix and repair Sony HT-ST3 Audio. Information contained in Sony HT-ST3 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.