Sony HT-K25 / SA-WMS25 Service Manual ▷ View online
General
Power requirements
Area code
Power requirements
CEL, CEK, SP
220–230 V AC, 50/60 Hz
MX
120 V AC, 60 Hz
Power consumption
68 W
Power consumption (during standby mode)
0.8 W
Dimensions (w/h/d)
224
× 318.5 × 344 mm
including front panel
Mass (Approx.)
7.1 kg
Design and specifications are subject to change
without notice.
without notice.
POWER OUTPUT
Rated Power Output at Stereo mode
Rated Power Output at Stereo mode
(6 ohms 1 kHz, THD 0.7 %)
40 W + 40 W
Reference Power Output
(THD 0.7 %)
Front*: 40 W/ch
Center*: 40 W
Surround*: 40 W/ch
(6 ohms)
Subwoofer: 70 W
(3 ohms)
Center*: 40 W
Surround*: 40 W/ch
(6 ohms)
Subwoofer: 70 W
(3 ohms)
* Depending on the sound field settings and the
source, there may be no sound output.
Frequency response
20 Hz – 20 kHz
Enclosure type
Advanced S.A.W.
magnetically shielded
magnetically shielded
Speaker unit
16 cm cone type
Rated frequency range
30 Hz – 200 Hz
High frequency cut-off frequency
150 Hz
· is the specifications when connecting TA-VE25.
· Abbreviation
CEK
· Abbreviation
CEK
: UK model
CEL
: AEP model
MX
: Mexican model
NOTE:
SA-WMS25
AEP Model
UK Model
E Model
SERVICE MANUAL
SUBWOOFER
Ver 1.0 2002. 09
SPECIFICATION
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-874-149-01
2002I1600-1
© 2002.09
• SA-WMS25 is the subwoofer section in
HT-K25.
2
SA-WMS25
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
TABLE OF CONTENTS
1. DISASSEMBLY
1-1. DSP Board ····································································· 3
1-2. PS Board ········································································ 4
1-3. DIGITAL AMP Board ··················································· 4
1-2. PS Board ········································································ 4
1-3. DIGITAL AMP Board ··················································· 4
2. DIAGRAMS
·································································
5
2-1. Block Diagrams — Power Section — ·························· 6
— DSP/AMP Section — ··················· 7
2-2. Printed Wiring Boards
— DIGITAL AMP Section (Side A) — ························ 8
2-3. Printed Wiring Boards
— DIGITAL AMP Section (Side B) — ························ 9
2-4. Schematic Diagram
— DIGITAL AMP Section (1/2) — ···························· 10
2-5. Schematic Diagram
— DIGITAL AMP Section (2/2) — ···························· 11
2-6. Printed Wiring Board — PS Board (Side A) — ········· 12
2-7. Printed Wiring Board — PS Board (Side B) — ········· 13
2-8. Schematic Diagram — PS Board — ·························· 14
2-9. Printed Wiring Board — DSP Board — ···················· 15
2-10. Schematic Diagram — DSP Board (1/2) — ·············· 16
2-11. Schematic Diagram — DSP Board (2/2) — ·············· 17
2-12. IC Block Diagrams ····················································· 18
2-13. IC Pin Function Description ······································· 20
2-7. Printed Wiring Board — PS Board (Side B) — ········· 13
2-8. Schematic Diagram — PS Board — ·························· 14
2-9. Printed Wiring Board — DSP Board — ···················· 15
2-10. Schematic Diagram — DSP Board (1/2) — ·············· 16
2-11. Schematic Diagram — DSP Board (2/2) — ·············· 17
2-12. IC Block Diagrams ····················································· 18
2-13. IC Pin Function Description ······································· 20
3. EXPLODED VIEWS
3-1. Cabinet Section ··························································· 24
3-2. AMP Section ······························································· 25
3-2. AMP Section ······························································· 25
4. ELECTRICAL PARTS LIST
······································· 26
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
3
SA-WMS25
SECTION 1
DISASSEMBLY
Note:
Follow the disassembly procedure in the numerical order given.
1-1. DSP Board
•
The equipment can be removed using the following procedure.
DSP BOARD
DIGITAL AMP BOARD
PS BOARD
SET
8
flexible flat cable
(21core)
9
connector
(CNP601)
6
shield plate
4
four screws
(+BVTP 3
×
8)
1
four screws
(+BTP 4
×
20)
3
back panel
2
four screws
(+BTP 4
×
20)
5
three screws
(+BVTP 3
×
8)
7
two screws
(+BVTP 3
×
8)
q;
DSP board
4
SA-WMS25
1-2. PS Board
1-3. DIGITAL AMP Board
2
connector
(CNP301)
3
PS board
1
four screws
(+BVTP 3
×
8)
4
connector
(CNP401)
5
connector
(CNP302)
7
DIGITAL AMP board
2
four screws
(+BVTP 3
×
8)
1
four screws
(+BVTP 3
×
8)
3
back panel
6
three screws
(+BVTP 3
×
8)
