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2012K08-1

© 

2012.11

•  TA-KMSW540 is the amplifi er section in HT-DDW5400

• Abbreviation
  SAF 

: South African model

RMS output (6 ohms, 80 Hz, THD 10%)
   

 

200 W per channel

1)

Input 

 

LINE IN (input pin jacks)

1) 

Measured under the following conditions:

 SAF 

240 V AC, 50 Hz

2) 

Reference power output for front, center, 

  surround and surround back speakers. 
  Depending on the sound fi eld settings and 
  the source, there may be no sound output.

Inputs
  Analog 

Sensitivity: 800 mV/

  

50 

kohms

Reproduction frequency range:
   

28 – 20,000 Hz

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Notes on chip component replacement
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be da-

 

maged by heat.

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

 ......................................................... 2

2-1. Case 

..................................................................................... 3

2-2.  Back Panel Section ............................................................. 4
2-3.  Front Panel Section ............................................................. 4
2-4.  Main Board Section ............................................................ 5

3-1. Block 

Diagram 

 

................................................................... 6

3-2.  Printed Wiring Boards – MAIN Board – ...........................  8
3-3.  Schematic Diagram – MAIN Board – ................................ 9
3-4.  Printed Wiring Boards – LED RIGHT,
 

LED LEFT, VOL CONTROL Section – ........................... 10

3-5.  Schematic Diagram – LED RIGHT,
 

LED LEFT, VOL CONTROL Section – ............................11

4-1. Case 

................................................................................... 13

4-2.  Front Panel Section ........................................................... 14
4-3.  Back Panel Section ........................................................... 15
4-4. Chassis 

Section 

................................................................. 16

 ......................................... 17

Note:  This set can be disassemble according to the following sequence.

Note:  Follow the disassembly procedure in the numerical order given.

1 two screws

u8)

2 two screws

u8)

3 three screws

u8)

4 case

2 five screws

1 CNP651 (7P)

3 front panel section

1 CNP901 (2P)

2 CNP650 (3P)

3 five screws

u 8)

4 two screws

u 8)

6 two screws

u 10)

5 one screw

u 8)

7 back panel section