Sony HSA-IF1 / IFR-C1 Service Manual ▷ View online
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SERVICE MANUAL
HSA-IF1/IFR-C1
AEP Model
UK Model
E Model
IFR-C1
(INFRARED RECEIVER)
HSA-IF1
(INFRARED TRANSMITTER)
SPECIFICATIONS
MICROFILM
CORDLESS HANDYCAM
STATION SYSTEM
STATION SYSTEM
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1. GENERAL
• Features ....................................................................................... 5
• Preparation .................................................................................. 5
• Using the Handycam Station ....................................................... 5
• Alternative Power Source for the Transmitter ............................. 5
• Using the Video Equipment without a Special Connection ........ 5
• To Charge the Battery Pack ......................................................... 5
• Preparation .................................................................................. 5
• Using the Handycam Station ....................................................... 5
• Alternative Power Source for the Transmitter ............................. 5
• Using the Video Equipment without a Special Connection ........ 5
• To Charge the Battery Pack ......................................................... 5
2. DISASSEMBLY
2-1. Removal of Transmitter Lower Case Assembly ..................... 6
2-2. Removal of MM-33 Board ..................................................... 6
2-3. Removal of Luminous Assembly ........................................... 6
2-4. Removal of Luminous Window .............................................. 6
2-5. Removal of ML-14 Board ...................................................... 7
2-6. Removal of Ray Catcher Window .......................................... 7
2-7. Removal of DP-54 Board ....................................................... 7
2-8. Removal of Ray Catcher Hinge (Lower) ............................... 8
2-9. Removal of DM-55 Board ...................................................... 8
2-2. Removal of MM-33 Board ..................................................... 6
2-3. Removal of Luminous Assembly ........................................... 6
2-4. Removal of Luminous Window .............................................. 6
2-5. Removal of ML-14 Board ...................................................... 7
2-6. Removal of Ray Catcher Window .......................................... 7
2-7. Removal of DP-54 Board ....................................................... 7
2-8. Removal of Ray Catcher Hinge (Lower) ............................... 8
2-9. Removal of DM-55 Board ...................................................... 8
3. BLOCK DIAGRAMS
3-1. HSA-IF1 (Transmitter) Section Block Diagram .................... 9
3-2. IFR-C1 (Receiver) Section Block Diagram ......................... 11
3-2. IFR-C1 (Receiver) Section Block Diagram ......................... 11
4. PRINTED WIRING BOARDS AND SCHEMATIC
DIAGRAMS
4-1. Printed Wiring Boards and Schematic Diagrams ................. 13
• This Note is Common for Printed Wiring
Boards and Schematic Diagrams ........................................... 13
• ML-14 and MM-33 Boards .................................................... 13
• DP-54 and DM-55 Boards ..................................................... 20
• DP-54 and DM-55 Boards ..................................................... 20
TABLE OF CONTENTS
5. REPAIR PARTS LIST
5-1. EXPLODED VIEWS ........................................................... 26
5-1-1. HSA-IF1 (Transmitter) Assembly .................................. 26
5-1-2. IFR-C1 (Receiver) Assembly ........................................ 27
5-1-2. IFR-C1 (Receiver) Assembly ........................................ 27
5-2. ELECTRICAL PARTS LIST ............................................... 28
• DM-55 Board ........................................................................ 28
• DP-54 Board .......................................................................... 31
• ML-14 Board ......................................................................... 31
• MM-33 Board ........................................................................ 32
• DP-54 Board .......................................................................... 31
• ML-14 Board ......................................................................... 31
• MM-33 Board ........................................................................ 32
6. ADJUSTMENTS
6-1. ELECTRICAL ADJUSTMENTS ........................................ 36
1-1. Preparation Before Adjustment ........................................ 36
1-1-1. Equipment Required ..................................................... 36
1-1-2. Equipment Connection .................................................. 36
1-1-3. Check of Input Signal ................................................... 36
1-1-4. Specified Input-Output Level and the Impedance ......... 37
1-2. HSA-IF1 Section Adjustments ......................................... 37
1-2-1. Voltage Check ............................................................... 37
1-2-2. Video Carrier Frequency Adjustment ............................ 37
1-2-3. Daviation Adjustment ................................................... 37
1-2-4. V-RF Level, Bias Current Adjustment .......................... 37
1-2-5. Audio Carrier Frequency Adjustment ........................... 38
1-2-6. Audio RF Modulation Level ......................................... 38
1-2-7. Audio Bias Current Adjustment .................................... 38
1-3. IFR-C1 Section Adjustments ............................................ 38
1-3-1. Video Output Level Adjustment .................................... 38
1-3-2. Audio Distortion Rate Adjustment ................................ 39
1-3-3. Audio Output Level Adjustment ................................... 39
1-4. Adjustment Parts Location Diagram ................................ 40
1-1-1. Equipment Required ..................................................... 36
1-1-2. Equipment Connection .................................................. 36
1-1-3. Check of Input Signal ................................................... 36
1-1-4. Specified Input-Output Level and the Impedance ......... 37
1-2. HSA-IF1 Section Adjustments ......................................... 37
1-2-1. Voltage Check ............................................................... 37
1-2-2. Video Carrier Frequency Adjustment ............................ 37
1-2-3. Daviation Adjustment ................................................... 37
1-2-4. V-RF Level, Bias Current Adjustment .......................... 37
1-2-5. Audio Carrier Frequency Adjustment ........................... 38
1-2-6. Audio RF Modulation Level ......................................... 38
1-2-7. Audio Bias Current Adjustment .................................... 38
1-3. IFR-C1 Section Adjustments ............................................ 38
1-3-1. Video Output Level Adjustment .................................... 38
1-3-2. Audio Distortion Rate Adjustment ................................ 39
1-3-3. Audio Output Level Adjustment ................................... 39
1-4. Adjustment Parts Location Diagram ................................ 40
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer :
safety checks before releasing the set to the customer :
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the cir
cuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
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SECTION 1
GENERAL
This section is e
xtracted from
instr
uction man
ual.
HSA-IF1/IFR-C1
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