Sony HMZ-T3 / HMZ-T3W (serv.man2) Service Manual ▷ View online
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HMZ-T3W
HMZ-T3/T3W
SPECIFICATIONS
9-930-403-35
2015C3100-1
© 2013.10
Published by Sony EMCS Corporation
HEAD MOUNTED DISPLAY
SERVICE MANUAL
Sony Corporation
Video & Sound Business Group
Power requirements
Processor unit:
DC IN jack 8.4 V
Head mounted unit and battery unit:
Micro USB jack (for charging)
5 V DC
Power consumption
Processor unit:
8.0 W (in wireless operation)
4.0 W (in wired operation)
0.4 W (in standby mode)
5.0 W (in wireless standbymode)
2.0 W (in HDMI pass-throughmode)
Head mounted unit and battery unit:
11 W (during charging)
Battery charging time
Head mounted unit and battery unit:
Approx. 4.5 hours (in standby
mode at 23 °C (74 °F))
Approx. 5.5 hours (in wired
operation at 23 °C (74 °F))
Battery operating time
Head mounted unit and battery unit:
Approx. 3 hours (in wireless
connection at 23 °C (74 °F))
Approx. 7 hours (in HDMI
connection at 23 °C (74 °F))
Approx. 3 hours (in MHL
connection at 23 °C (74 °F))
Operating temperature
5 °C to 35 °C (41 °F to 95 °F)
Operating humidity
25 % to 80 %
Dimensions (W×H×D, including largest
protrusions)
Processor unit:
Approx. 150 mm × 31 mm ×107 mm
(6 in. × 1 1/4 in. × 4 1/4 in.)
Head mounted unit:
Approx. 189 mm × 148 mm ×270 mm
(7 1/2 in. × 5 7/8 in. × 10 3/4 in.)
(excluding top headband, and
bottom headband length
adjusted in the center)
Battery unit:
Approx. 80 mm × 26 mm ×119 mm
(3 1/4 in. × 1 1/16 in. × 4 3/4 in.)
Mass
HMZ-T3
Processor unit:
Approx. 220 g (7.8 oz)
(excluding connecting cables)
Head mounted unit:
Approx. 320 g (12 oz)
(including top light blockers,
and excluding connectingcords)
Battery unit:
Approx. 160 g (5.7 oz)
(excluding connecting cord)
Approx. 220 g (7.8 oz)
(excluding connecting cables)
Head mounted unit:
Approx. 320 g (12 oz)
(including top light blockers,
and excluding connectingcords)
Battery unit:
Approx. 160 g (5.7 oz)
(excluding connecting cord)
HMZ-T3W
Processor unit:
Approx. 250 g (8.9 oz)
(excluding connecting cables)
Head mounted unit:
Approx. 320 g (12 oz)
(including top light blockers,
and excluding connecting cords)
Battery unit:
Approx. 210 g (7.5 oz)
(excluding connecting cord)
Image:HMZ-T3-H
Image:HMZ-T3W-P
– Specifications follows after this page –
Ver. 1.4 2015.03
- 2 -
HMZ-T3/T3W
Display resolution
1,280 dots (horizontal) × 720 dots
(vertical)
Interpupillary distance
53.0 mm – 76.7 mm
(2 1/8 in. – 3 1/8 in.)
Input and output connectors
Processor unit:
HDMI IN 1:19-pin standard connector
HDMI IN 2:19-pin standard connector
HDMI IN 3:19-pin standard connector
HDMI OUT (TV)*:19-pin standard connector
HDMI OUT (HMD):19-pin standard connector
(onfront
HDMI IN 1:19-pin standard connector
HDMI IN 2:19-pin standard connector
HDMI IN 3:19-pin standard connector
HDMI OUT (TV)*:19-pin standard connector
HDMI OUT (HMD):19-pin standard connector
(onfront
panel)
Headphone jack:Stereo phone jack
Head mounted unit:
Headphone jack:Stereo minijack
Battery unit:
HDMI IN/MHL:19-pin standard connector
Head mounted unit:
Headphone jack:Stereo minijack
Battery unit:
HDMI IN/MHL:19-pin standard connector
MHL version: MHL 1
MHL: 5 V, 500 mA power
supply capacity
* When HDMI pass-through is activated,
signals supplied to the processor unit are
passed through the processor unit to the
HDMI output. However, the following
signals are not compatible with pass-through.
– Video signals at 4k resolution (at a high
resolution exceeding 3,840 (horizontal)
× 2,160 (vertical) pixels)
signals supplied to the processor unit are
passed through the processor unit to the
HDMI output. However, the following
signals are not compatible with pass-through.
– Video signals at 4k resolution (at a high
resolution exceeding 3,840 (horizontal)
× 2,160 (vertical) pixels)
Video input
Video input (2D formats):
480/60p, 576/50p, 720/24p, 720/50p,
720/60p, 1080/50i, 1080/60i,1080/24p,
1080/50p
1)
, 1080/60p
1)
Video input (3D formats: FramePacking,
Side-by-Side and Top-and-Bottom formats):
720/50p
Side-by-Side and Top-and-Bottom formats):
720/50p
1)
, 720/60p
1)
, 1080/50i
2)
,
1080/60i
2)
, 1080/24p
1)
, 1080/50p
3)
,
1080/60p
3)
Audio input
Battery unit:
Linear PCM (2-channel):
32/44.1/48 kHz
Processor Unit:
Linear PCM (2-channel):
32kHz - 192 kHz
Linear PCM (multi-channel)
32kHz - 192 kHz
MPEG-2 AAC
Dolby Digital
Dolby Digital EX
Dolby Digital Plus
Dolby TrueHD
DTS
DTS-ES
DTS-ES
DTS 96/24
DTS-HD Master Audio
DTS-HD High Resolution Audio
DTS-HD LBR
1) not available for MHL input
2) not available for MHL input, and Frame
Packing and Top-and-Bottom formats
3) not available for MHL input and Frame
Packing format
2) not available for MHL input, and Frame
Packing and Top-and-Bottom formats
3) not available for MHL input and Frame
Packing format
Wireless section
Compatible standards
WirelessHD 1.1
Modulation method
OFDM
Usable frequency
OFDM
Usable frequency
59.40 GHz - 63.72 GHz (ch2 toch3)
Communication distance
Approx. 7 m (23 feet)**
** The communication distance varies depending
on the conditions of use.
on the conditions of use.
Headphones
Frequency response:
5 Hz - 24,000 Hz (HMZ-T3)
4 Hz - 27,000 Hz (HMZ-T3W)
Impedance:
16 Ω (1 kHz)
AC adaptor AC-UD10 (for the head
mounted unit and battery unit)
Rated input
100 V – 240 V AC, 50 Hz/60 Hz,0.2 A
Rated output
5 V DC, 1.5 A
Operating temperature
0 °C to 40 °C (32 °F to 104 °F)
Storage temperature
–20 °C to +60 °C (–4 °F to 140 °F)
Dimensions (W × H × D)
Approx. 78 mm × 22 mm ×36 mm
(3 1/8 in. × 7/8 in. × 1 7/16 in.)
Mass
Approx. 45 g (1.6 oz)
AC adaptor AC-L200D (for the processor
unit)
Rated input
100 V – 240 V AC, 50 Hz/60 Hz,
0.35 A – 0.18 A
Rated output
8.4 V DC, 1.7 A
Operating temperature
0 °C to 40 °C (32 °F to 104 °F)
Storage temperature
–20 °C to +60 °C (–4 °F to 140 °F)
Dimensions (W × H × D)
Approx. 48 mm × 29 mm ×81 mm
(1 15/16 in. × 1 3/16 in. × 3 1/4 in.)
Mass
Approx. 170 g (6 oz)
Supplied accessories
• AC power cord (mains lead) (2)
Use the supplied AC power cord(mains lead)
only with this system,
not with other electronics.
• AC adaptor (large) (AC-L200D) (1)
• AC adaptor (small) (AC-UD10) (1)
• Micro USB cable (for AC-UD10) (1)
• HDMI cable (1.5 m) (1)
• HDMI cable (3 m) (1) (HMZ-T3 only)
• Light blocker (Bottom) (1)
• Connecting cord holder (1)
• Headphones (1)
• Earbuds (1 set)
Medium-sized earbuds are initially
attached, at the time of purchase.
• Carrying case (1)
• Stand (1) (HMZ-T3W only)
• Reference Guide
• Startup Guide
Use the supplied AC power cord(mains lead)
only with this system,
not with other electronics.
• AC adaptor (large) (AC-L200D) (1)
• AC adaptor (small) (AC-UD10) (1)
• Micro USB cable (for AC-UD10) (1)
• HDMI cable (1.5 m) (1)
• HDMI cable (3 m) (1) (HMZ-T3 only)
• Light blocker (Bottom) (1)
• Connecting cord holder (1)
• Headphones (1)
• Earbuds (1 set)
Medium-sized earbuds are initially
attached, at the time of purchase.
• Carrying case (1)
• Stand (1) (HMZ-T3W only)
• Reference Guide
• Startup Guide
System specifications and appearance are subject
to change for improvement without notice.
to change for improvement without notice.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recommend
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
1.5 k
0.15 µF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE-
PLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉ-
MENTS PUBLIÉS PAR SONY.
- 3 -
HMZ-T3/T3W
【 About carry-on repair service 】
When it is repaired this product, have me bring in
all bundling thing including a Processor Unit and
the Power Battery Unit with a Head Mount Unit.
all bundling thing including a Processor Unit and
the Power Battery Unit with a Head Mount Unit.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
TABLE OF CONTENTS
Section
Title
Page
1.
SERVICE NOTE
1-1. Procedure to enter Service mode................................. 1-1
1-2. Instruction of HMZ Service Tool ................................... 1-2
1-3. Device driver installation .............................................. 1-3
1-4. Button Layout on Jig window ....................................... 1-8
1-5. Work after having changed
WIRELESS HD MODULE (HMZ-T3W only) ........... 1-9
1-6. Factory Reset & Shutdown........................................... 1-10
1-7. Check Firmware Version .............................................. 1-11
1-8. Update Firmware .......................................................... 1-12
1-8. Update Firmware .......................................................... 1-12
2. DISASSEMBLY
2-1. Processor Unit (HMZ-T3-P/T3W-P) ............................. 2-1
2-1-1. DISASSEMBLY FLOW ........................................... 2-1
2-1-2. CASE, SU / HOLDER LED ASSY, SU
/ FL-2005 MOUNT, ................................................. 2-2
2-1-3. FAN HOLDER, SU / WIRELESS HD MODULE
(HMZ-T3W only) ..................................................... 2-3
2-1-4. SU-1001 MOUNT / BASE, SU ............................... 2-3
2-1-5. BLOWER FAN (UB5U3-509) (HMZ-T3W oly) ........ 2-4
2-2. Head Mounted Unit (HMZ-T3-H/T3W-H) ...................... 2-3
2-2-1. DISASSEMBLY FLOW (Head Mounted Unit) ........ 2-5
2-2-2. DISASSEMBLY FLOW (Power Battrey Unit) ......... 2-6
2-2-3. ROOF ..................................................................... 2-7
2-2-4. COVER, FRONT .................................................... 2-7
2-2-5. COVER,BOTTOM .................................................. 2-8
2-2-6. DISPLAY UNIT ....................................................... 2-10
2-2-7. ADJUSTER ASSY, BAND(UP) ............................... 2-11
2-2-8. FH SLIDE BLOCK ASSY ....................................... 2-11
2-2-9. ADJUSTER ASSY, BAND(LW) ............................... 2-12
2-2-10. CASE LOWER ASSY,PBU
2-2-1. DISASSEMBLY FLOW (Head Mounted Unit) ........ 2-5
2-2-2. DISASSEMBLY FLOW (Power Battrey Unit) ......... 2-6
2-2-3. ROOF ..................................................................... 2-7
2-2-4. COVER, FRONT .................................................... 2-7
2-2-5. COVER,BOTTOM .................................................. 2-8
2-2-6. DISPLAY UNIT ....................................................... 2-10
2-2-7. ADJUSTER ASSY, BAND(UP) ............................... 2-11
2-2-8. FH SLIDE BLOCK ASSY ....................................... 2-11
2-2-9. ADJUSTER ASSY, BAND(LW) ............................... 2-12
2-2-10. CASE LOWER ASSY,PBU
/ CASE INNER ASSY, PBU .................................... 2-13
2-2-11. HEATSINK LOWER, PBU (HMZ-T3W only) .......... 2-13
2-2-12. COVER FRONT, PBU ............................................ 2-14
2-2-13. PBU-1001 MOUNT................................................. 2-14
2-2-14. WIRELESS HD MODULE (HMZ-T3W only) .......... 2-15
2-2-15. BLOWER FAN (UB5U3-509) (HMZ-T3W only) ...... 2-15
2-2-12. COVER FRONT, PBU ............................................ 2-14
2-2-13. PBU-1001 MOUNT................................................. 2-14
2-2-14. WIRELESS HD MODULE (HMZ-T3W only) .......... 2-15
2-2-15. BLOWER FAN (UB5U3-509) (HMZ-T3W only) ...... 2-15
3.
BLOCK DIAGRAM
.................................................... 3-1
- 4 -
Section
Title
Page
4.
SCHEMATIC DIAGRAM
4-1. INDEX .......................................................................... 4-1
4-2. DAC-1001 BOARD(1/1) .............................................. 4-2
4-3. FL-2005 BOARD(1/1) ................................................... 4-3
4-4. FR-1007 BOARD(1/1) .................................................. 4-4
4-5. PBU-1001 BOARD(1/4)................................................ 4-5
4-6. PBU-1001 BOARD(2/4)................................................ 4-6
4-7. PBU-1001 BOARD(3/4)................................................ 4-7
4-8. PBU-1001 BOARD(4/4)................................................ 4-8
4-9. SEN-1001 BOARD(1/1)................................................ 4-9
4-10. SU-1001 BOARD(1/8) .................................................. 4-10
4-11. SU-1001 BOARD(2/8) .................................................. 4-11
4-12. SU-1001 BOARD(3/8) .................................................. 4-12
4-13. SU-1001 BOARD(4/8) .................................................. 4-13
4-14. SU-1001 BOARD(5/8) .................................................. 4-14
4-15. SU-1001 BOARD(6/8) .................................................. 4-15
4-16. SU-1001 BOARD(7/8) .................................................. 4-16
4-17. SU-1001 BOARD(8/8) .................................................. 4-17
4-18. Printed Wiring Board (1/6) ............................................ 4-18
4-19. Printed Wiring Board (2/6) ............................................ 4-19
4-20. Printed Wiring Board (3/6) ............................................ 4-20
4-21. Printed Wiring Board (4/6) ............................................ 4-21
4-22. Printed Wiring Board (5/6) ............................................ 4-22
4-23. Printed Wiring Board (6/6) ............................................ 4-23
5. TROUBLESHOOTING
5-1. Processor Unit (HMZ-T3-P/T3W-P) ............................. 5-1
5-2. Head Mounted Unit (HMZ-T3-H/T3W-H) ...................... 5-2
5-3. Analysis FAQ ................................................................ 5-3
5-4. Equipment you need .................................................... 5-4
6.
REPAIR PARTS LIST
6-1. EXPLODED VIEWS ..................................................... 6-1
6-1-1. Processor Unit (HMZ-T3-P/T3W-P) ........................ 6-1
6-1-2. Head Mounted Unit (HMZ-T3-H/T3W-H)................. 6-2
6-1-3. Power Battrey Unit (HMZ-T3-H/T3W-H).................. 6-6
6-2. ACCESSORIES and CONSUMABLES ........................ 6-8
HMZ-T3/T3W