Sony HCD-ZT4 / LBT-ZT4 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-ZT4
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
9-889-196-02
2010G05-1
©
2010.07
US Model
Ver. 1.1 2010.07
• HCD-ZT4 is the amplifi er, USB, CD player, tape
deck and tuner section in LBT-ZT4.
CD
Section
Section
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM88A-K6BD93-WOD
Optical Pick-up Block Name
KSM-213DCP
Tape deck
Section
Section
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
TCM-J1 or CS-21SC-900TP
AUDIO POWER SPECIFICATION
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
HARMONIC DISTORTION:
With 6 ohm loads, both channels driven,
from 120 Hz – 10 kHz; rated 110 watts per
channel minimum RMS power, with no
more than 0.7% total harmonic distortion
from 250 miliwatts to rated output.
from 120 Hz – 10 kHz; rated 110 watts per
channel minimum RMS power, with no
more than 0.7% total harmonic distortion
from 250 miliwatts to rated output.
Amplifier section
The following are measured at AC 120 V
60 Hz
Front speaker
60 Hz
Front speaker
RMS output power (reference):
180 W + 180 W (per channel at 6
180 W + 180 W (per channel at 6
7,
1 kHz, 10% THD)
Subwoofer
RMS output power (reference): 180 W
(at 6
(at 6
7, 100 Hz, 10% THD)
Inputs
AUDIO INPUT: sensitivity
800 mV, impedance 47 kilohms
AUDIO INPUT: sensitivity
800 mV, impedance 47 kilohms
MIC: sensitivity 1 mV, impedance
10 kilohms
10 kilohms
(USB) port: Type A
DMPORT
Outputs
PHONES: accepts headphones of 8
PHONES: accepts headphones of 8
7 or
more
FRONT SPEAKER: accepts impedance of
6
FRONT SPEAKER: accepts impedance of
6
7
SUBWOOFER: accepts impedance of 6
7
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps
32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
Transfer speed
Full-Speed
Supported USB device
Mass Storage Class
Maximum current
500 mA
CD player section
System: Compact disc and digital audio
system
Laser Diode Properties
system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
Laser Output*: Less than 44.6
MW
* This output is the value measurement
at a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Tape deck section
Recording system: 4-track 2-channel, stereo
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range:
Tuning range:
87.5 – 108.0 MHz (100 kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section
Tuning range
Tuning range
530 – 1,710 kHz (with 10 kHz tuning
interval)
531 – 1,710 kHz (with 9 kHz tuning
interval)
interval)
531 – 1,710 kHz (with 9 kHz tuning
interval)
Antenna: AM loop antenna, external antenna
terminal
Intermediate frequency: 450 kHz
terminal
Intermediate frequency: 450 kHz
General
Power requirements
AC 120 V,60 Hz
Power consumption
225 W
Dimensions (w/h/d) (excl. speakers)
Approx. 231 × 361 × 437.5 mm
(9 1/8 × 14 1/4 × 17 1/4 inch)
(9 1/8 × 14 1/4 × 17 1/4 inch)
Mass (excl. speakers)
10.0 kg (22 lb 1 oz)
Design and specifications are subject to
change without notice.
change without notice.
HCD-ZT4
2
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HCD-ZT4
3
1.
SERVICING NOTES
............................................. 4
2. GENERAL
.................................................................. 8
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 10
3-2. Side-L/R
Case
................................................................. 11
3-3. Top Panel Block .............................................................. 11
3-4. Tape Mechanism Deck .................................................... 12
3-5. Front Panel Block ........................................................... 12
3-6. DC FAN (M102), Back Panel ......................................... 13
3-7. MAIN
3-4. Tape Mechanism Deck .................................................... 12
3-5. Front Panel Block ........................................................... 12
3-6. DC FAN (M102), Back Panel ......................................... 13
3-7. MAIN
Board
................................................................... 13
3-8. CD Mechanism Block ..................................................... 14
3-9. DC Fan (M101), POWERAMP Board ........................... 14
3-10. Base Unit ......................................................................... 15
3-11. OP Base Assy (KSM-213D) ........................................... 15
3-12. Belt (DLM3A) ................................................................ 16
3-9. DC Fan (M101), POWERAMP Board ........................... 14
3-10. Base Unit ......................................................................... 15
3-11. OP Base Assy (KSM-213D) ........................................... 15
3-12. Belt (DLM3A) ................................................................ 16
4.
TEST MODE
............................................................ 17
5. MECHANICAL
ADJUSTMENTS
...................... 20
6. ELECTRICAL
ADJUSTMENTS
........................ 21
7. DIAGRAMS
7-1. Block Diagram - CD SERVO, USB Section - ................ 23
7-2. Block Diagram - MAIN Section - ................................... 24
7-3. Block Diagram - AMP Section - ..................................... 25
7-4. Block
7-2. Block Diagram - MAIN Section - ................................... 24
7-3. Block Diagram - AMP Section - ..................................... 25
7-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 26
7-5. Schematic Diagram - CD Board (1/2) - .......................... 28
7-6. Schematic Diagram - CD Board (2/2) - .......................... 29
7-7. Printed Wiring Board - CD Board - ................................ 30
7-8. Printed Wiring Board - TC Board - ................................. 31
7-9. Schematic Diagram - TC Board - ................................... 31
7-6. Schematic Diagram - CD Board (2/2) - .......................... 29
7-7. Printed Wiring Board - CD Board - ................................ 30
7-8. Printed Wiring Board - TC Board - ................................. 31
7-9. Schematic Diagram - TC Board - ................................... 31
TABLE OF CONTENTS
7-10. Printed Wiring Board - USB Board - .............................. 32
7-11. Schematic Diagram - USB Board - ................................. 33
7-12. Printed Wiring Board - DMPORT Board - ..................... 34
7-13. Schematic Diagram - DMPORT Board - ........................ 34
7-14. Printed Wiring Board - MAIN Board - ........................... 35
7-15. Schematic Diagram - MAIN Board (1/4) - ..................... 36
7-16. Schematic Diagram - MAIN Board (2/4) - ..................... 37
7-17. Schematic Diagram - MAIN Board (3/4) - ..................... 38
7-18. Schematic Diagram - MAIN Board (4/4) - ..................... 39
7-19. Printed Wiring Board - POWERAMP Board - ............... 40
7-20. Schematic Diagram - POWERAMP Board - .................. 41
7-21. Printed Wiring Boards - JACK Section - ........................ 42
7-22. Schematic Diagram - JACK Section - ............................ 42
7-23. Printed Wiring Boards - REG Section - .......................... 43
7-24. Schematic Diagram - REG Section - .............................. 43
7-25. Printed Wiring Boards - DISPLAY Board - .................... 44
7-26. Schematic Diagram - DISPLAY Board - ........................ 45
7-27. Printed Wiring Boards - PANEL Section - ..................... 46
7-28. Schematic Diagram - PANEL Section - .......................... 47
7-29. Printed Wiring Board - TRANS2 Board - ....................... 48
7-30. Schematic Diagram - TRANS2 Board - ......................... 49
7-11. Schematic Diagram - USB Board - ................................. 33
7-12. Printed Wiring Board - DMPORT Board - ..................... 34
7-13. Schematic Diagram - DMPORT Board - ........................ 34
7-14. Printed Wiring Board - MAIN Board - ........................... 35
7-15. Schematic Diagram - MAIN Board (1/4) - ..................... 36
7-16. Schematic Diagram - MAIN Board (2/4) - ..................... 37
7-17. Schematic Diagram - MAIN Board (3/4) - ..................... 38
7-18. Schematic Diagram - MAIN Board (4/4) - ..................... 39
7-19. Printed Wiring Board - POWERAMP Board - ............... 40
7-20. Schematic Diagram - POWERAMP Board - .................. 41
7-21. Printed Wiring Boards - JACK Section - ........................ 42
7-22. Schematic Diagram - JACK Section - ............................ 42
7-23. Printed Wiring Boards - REG Section - .......................... 43
7-24. Schematic Diagram - REG Section - .............................. 43
7-25. Printed Wiring Boards - DISPLAY Board - .................... 44
7-26. Schematic Diagram - DISPLAY Board - ........................ 45
7-27. Printed Wiring Boards - PANEL Section - ..................... 46
7-28. Schematic Diagram - PANEL Section - .......................... 47
7-29. Printed Wiring Board - TRANS2 Board - ....................... 48
7-30. Schematic Diagram - TRANS2 Board - ......................... 49
8.
EXPLODED VIEWS
8-1. Case
Section
.................................................................... 58
8-2. Loading Panel Section .................................................... 59
8-3. DISPLAY Board Section ................................................ 60
8-4. Front Panel Section ......................................................... 61
8-5. Meter
8-3. DISPLAY Board Section ................................................ 60
8-4. Front Panel Section ......................................................... 61
8-5. Meter
Display
Assy
......................................................... 62
8-6. Top Panel Section ........................................................... 63
8-7. Back Panel Section ......................................................... 64
8-8. MAIN Board Section ...................................................... 65
8-9. Chassis
8-7. Back Panel Section ......................................................... 64
8-8. MAIN Board Section ...................................................... 65
8-9. Chassis
Section
............................................................... 66
8-10. CD Mechanism Section (CDM88A-K6BD93-WOD) .... 67
9.
ELECTRICAL PARTS LIST
.............................. 68
HCD-ZT4
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[I/
1
] button to turn the power on.
2. Press the [CD] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [
Z
] button for more 5
seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[I/1]
button.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.