DOWNLOAD Sony HCD-XG55 Service Manual ↓ Size: 7.96 MB | Pages: 80 in PDF or view online for FREE

Model
HCD-XG55
Pages
80
Size
7.96 MB
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PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-xg55.pdf
Date

Sony HCD-XG55 Service Manual ▷ View online

HCD-XG55
Mexican Model
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-874-114-01
2002H1600-1
© 2002.08
Model Name Using Similar Mechanism
HCD-XG60/XG500
CD
CD Mechanism Type
CDM37M-5BD32L
Section
Base Unit Name
BU-5BD32L
Optical Pick-up Name
KSS-213DH
Tape
Model Name Using Similar Mechanism
HCD-XG60/XG500
Section
Tape Transport Mechanism Type
TCM-230PWR42
HCD-XG55 is the amplifier, CD player,
tape deck and tuner section in LBT-XG55.
SPECIFICATIONS
Ver 1.0  2002. 08
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol 
;
  are trade-
marks of Dolby Laboratories Licensing Corporation.
Amplifier section
Continuous RMS power output (reference)
160 + 160 watts (6 ohms at
1 kHz, 10% THD)
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 70 W)
Inputs
PHONO IN:
(phono jacks)
sensitivity 3 mV,
impedance 47 kilohms
MIX MIC:
(phone jack)
sensitivity 1 mV,
impedance 10 kilohms
VIDEO IN:
(phono jacks)
sensitivity 250 mV,
impedance 47 kilohms
GAME IN:
(phono jacks)
sensitivity 250 mV,
impedance 47 kilohms
MD IN:
(phono jack)
sensitivity 450 mV,
impedance 47 kilohms
Outputs
PHONES:
(stereo phone jack)
accepts headphones of 8
ohms or more
VIDEO OUT:
(phono jack)
voltage 250 mV
impedance 1 kilohm
MD OUT:
(phono jacks)
voltage 250 mV
impedance 1 kilohm
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(
λ=780nm), Emission
duration: continuous
Wavelength
780 – 790 nm
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±3 dB),
(DOLBY NR OFF)
using Sony TYPE I cassette
40 – 14,000 Hz (
±3 dB),
using Sony TYPE II cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
530 – 1,710 kHz
(with the interval set at 10
kHz)
531 – 1,710 kHz
(with the interval set at 9
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
120 V AC, 50/60 Hz
Power consumption
240 watts
Dimensions (w/h/d)
Approx. 355 x 425 x 450
mm
Mass :
Approx. 13.5 kg
Supplied accessories:
AM loop antenna (1)
FM lead antenna (1)
Speaker cords (2)
Speaker pads (8)
Remote commander (1)
Batteries (2)
Design and specifications are subject to change
without notice.
2
HCD-XG55
TABLE OF CONTENTS
1. SERVICING NOTES
······················································· 3
2. GENERAL
Location of Controls ······························································ 4
Setting the Time ····································································· 5
3. DISASSEMBLY
3-1. Case ················································································· 7
3-2. Front Panel Section ························································· 7
3-3. Tape Mechanism Deck (TCM-230PWR42),
       Cover (TC) ······································································ 8
3-4. Holder Deck B Assy, Holder Deck A Assy,
       Lid (TC) Assy ·································································· 8
3-5. LEAF SW Board, AUDIO Board ··································· 9
3-6. TC (B) Board, TC (A) Board, PANEL FL Board ········· 10
3-7. PANEL VR Board ························································· 10
3-8. HEADPHONE Board, FRONT INPUT Board ············· 11
3-9. CD-L Board, CD-R (1) Board, CD-R (2) Board ·········· 11
3-10. DC Fan (M901), MAIN Board, Tuner (FM/AM) ······· 12
3-11. PA Board ····································································· 12
3-12. SUB TRANS Board, TRANS Board ·························· 13
3-13. CD Mechanism Deck (CDM37M-5BD32L) ·············· 14
3-14. Base Unit (BU-5BD32L) ············································ 15
3-15. BD Board ···································································· 15
3-16. Optical Pick-up (KSS-213DH) ··································· 16
3-17. Disc Table ··································································· 16
3-18. LED Board, CD MOTOR Board,
         TABLE SENSOR Board ············································· 17
4. TEST MODE
···································································· 18
5. MECHANICAL ADJUSTMENTS
····························· 20
6. ELECTRICAL ADJUSTMENTS
Deck section ········································································· 20
CD Section ··········································································· 23
7. DIAGRAMS
······································································ 24
7-1. Block Diagram
       – CD SERVO Section – ················································· 26
       – TUNER/TAPE DECK Section – ································ 27
       – MAIN Section – ························································· 28
       – DISPLAY/KEY CONTROL/POWER SUPPLY Section – ····· 29
7-2. Printed Wiring Board – BD Board – ····························· 30
7-3. Schematic Diagram – BD Board – ······························· 31
7-4. Printed Wiring Boards – CD MOTOR Section – ·········· 32
7-5. Schematic Diagram – CD MOTOR Section – ·············· 33
7-6. Printed Wiring Board – AUDIO Board – ······················ 34
7-7. Schematic Diagram – AUDIO Board – ························· 35
7-8. Printed Wiring Board – LEAF SW Board – ················· 36
7-9. Schematic Diagram – LEAF SW Board – ···················· 36
7-10. Schematic Diagram – MAIN Board (1/3) – ················ 37
7-11. Schematic Diagram – MAIN Board (2/3) – ················ 38
7-12. Schematic Diagram – MAIN Board (3/3) – ················ 39
7-13. Printed Wiring Board – MAIN Board – ······················ 40
7-14. Printed Wiring Board – PA Board – ···························· 41
7-15. Schematic Diagram – PA Board – ······························ 42
7-16. Printed Wiring Boards
         – FRONT INPUT/HEADPHONES Boards – ············· 43
7-17. Schematic Diagram
         – FRONT INPUT/HEADPHONES Boards – ············· 44
7-18. Printed Wiring Board – PANEL FL Board – ·············· 45
7-19. Schematic Diagram – PANEL FL Board – ················· 46
7-20. Printed Wiring Board – PANEL VR Board – ············· 47
7-21. Schematic Diagram – PANEL VR Board – ················ 48
7-22. Printed Wiring Boards
         – TC (A)/TC (B)/CD-L/CD-R (1)/CD-R (2) Boards – 49
7-23. Schematic Diagram
         – TC (A)/TC (B)/CD-L/CD-R (1)/CD-R (2) Boards – 50
7-24. Printed Wiring Board
         – TRANSFORMER Section– ····································· 51
7-25. Schematic Diagram
         – TRANSFORMER Section– ····································· 51
7-26. IC Block Diagrams ····················································· 52
7-27. IC Pin Function Description ······································· 54
8. EXPLODED VIEWS
8-1. Case, Back Panel Section ·············································· 59
8-2. Front Panel Section-1 ···················································· 60
8-3. Front Panel Section-2 ···················································· 61
8-4. Chassis Section ····························································· 62
8-5. Tape Mechanism Deck Section-1 (TCM-230PWR42) · 63
8-6. Tape Mechanism Deck Section-2 (TCM-230PWR42) · 64
8-7. CD Mechanism Deck Section (CDM37M-5BD32L) ··· 65
8-8. Base Unit Section (BU-5BD32L) ································· 66
9. ELECTRICAL PARTS LIST
······································· 67
3
HCD-XG55
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
SECTION  1
SERVICING  NOTES
Notes on chip component replacement
• N ever reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• K eep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL
OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
4
HCD-XG55
SECTION  2
GENERAL
This section is extracted from
instruction manual.
LOCATION OF CONTROLS
– Front Panel –
wa
ws
wd
wf
wg
wj
wk
wl
e;
ea
ef
ed
eg
eh
es
wh
w; ql
qd
qs
qa
2 3 4 5 6 7 89
q;
qf
qg
qh
qj
qk
1
A EJECT Z/Z B EJECT wg (15)
AUDIO L w; (22)
AUDIO R ql (22)
CD SYNC qg (16,17)
Control VOLUME qs (9,13,24)
Jog dial (AMS./>)
qj (9,15)
DIRECT EQUALIZER 5 (18)
SALSA
REGGAE
SAMBA
TANGO
MOVIE
GUITAR
ROCK
JAZZ
DANCE
GAME
DIRECTION es (15,16,17)
DISC SKIP qk (9,10,17)
DISC 1~5 wj (9)
DISPLAY 3 (8,11,13)
DOLBY NR es (15,16,26)
EDIT wl (17)
ENTER wh (12,14)
ENTER/NEXT qd (8,17,19,21,25)
FLASH e; (11)
FLAT qd (18)
FUNCTION q; (7,9,10,16,17,22)
GAME qa (20,22)
GROOVE eg (18)
H SPEED DUB qg (16)
LOOP ea (7,11)
NON STOP wk (10)
P FILE qd (18,19)
PLAY MODE qk (9,10,17,25)
POWER SAVE/DEMO
(STANDBY) 2 (8)
PTY ws (14)
PUSH OPEN wf (9)
REPEAT qk (9)
SLEEP 7 (20)
SPECTRUM ANALYZER 4 (20)
STEREO/MONO ws (13,25)
SUPER WOOFER ef (18)
SUPER WOOFER MODE ed (18)
SURROUND eh (16,18)
TIMER SELECT 8 (17,21)
Toma PHONES qh
TUNER/BAND wd (12,13,16)
TUNER MEMORY wh (12)
TUNING MODE ws (12,13)
VIDEO wa (22)
BUTTON DESCRIPTION
@/1 1
c/CLOCK SET 6
v/V/b/B 9
z REC qf
X qf
m /M, AMS./> qfes
h,H qfes
x qfqkes
m /M qk
HX qk
+/– wd
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  • Here you can View online or download the Service Manual for the Sony HCD-XG55 in PDF for free, which will help you to disassemble, recover, fix and repair Sony HCD-XG55 Audio. Information contained in Sony HCD-XG55 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.