Sony HCD-XG100AV / HCD-XG900AV Service Manual ▷ View online
2
HCD-XG100AV/XG900AV
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
The following caution label is located inside the unit.
MD OUT:
(phono jacks)
(phono jacks)
voltage 250 mV
impedance 1 kilohm
impedance 1 kilohm
WOOFER OUT (phono jack):
voltage 1 V, impedance
1 kilohm
1 kilohm
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
16 ohms
CENTER SPEAKER:
accepts impedance of 8 to
16 ohms
16 ohms
REAR SPEAKER:
accepts impedance of 8 to
16 ohms
16 ohms
* AEP, UK and Mexican models only
Video section
Inputs
VIDEO IN (phono jack):
VIDEO IN (phono jack):
1 V p-p, 75 ohms
GAME IN (phono jack):
1 V p-p, 75 ohms
Output
VIDEO OUT (phono jack):1 V p-p, 75 ohms
VIDEO OUT (phono jack):1 V p-p, 75 ohms
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ
=780nm), Emission
duration: continuous
Wavelength
780 – 790 nm
Frequency response
2 Hz – 20 kHz (
±
0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength:
(Square optical connector jack, rear panel)
Wavelength:
660 nm
Output level
–18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±
3 dB),
(DOLBY NR OFF)
using Sony TYPE I cassette
40 – 14,000 Hz (
40 – 14,000 Hz (
±
3 dB),
using Sony TYPE II cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
European, Middle Eastern, and Philippine models:
European, Middle Eastern, and Philippine models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
(with the interval set at 9
kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
AEP, UK models:
AEP, UK models:
230 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Australian model:
230 – 240 V AC, 50/60
Hz
Hz
Other models:
120 V, 220 V or 230 – 240
V AC, 50/60 Hz
Adjustable with voltage
selector
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
HCD-XG900AV
HCD-XG900AV
200 watts
0.6 watts (at the power
saving mode)
0.6 watts (at the power
saving mode)
HCD-XG100AV
230 watts
Dimensions (w/h/d)
Approx. 355
×
425
×
450
mm
Mass :
HCD-XG900AV
HCD-XG900AV
Approx. 14.5 kg
HCD-XG100AV
Approx. 16.0 kg
Design and specifications are subject to change
without notice.
without notice.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
3
HCD-XG100AV/XG900AV
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
5
Setting the Time ..............................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
7
3-2. Case .................................................................................
7
3-3. Front Panel Section .........................................................
8
3-4. Cover (TC), Tape Mechanism Deck
(TCM-230PWR42) .........................................................
8
3-5. MAIN Board, “Fan, D.C. (M901) (XG100AV)” ...........
9
3-6. MAIN Board (XG900AV) ..............................................
9
3-7. CD Mechanism Deck (CDM37M-5BD32L) .................. 10
3-8. Base Unit (BU-5BD32L) ................................................ 11
3-9. Disc Table ........................................................................ 11
3-8. Base Unit (BU-5BD32L) ................................................ 11
3-9. Disc Table ........................................................................ 11
4.
TEST MODE
.............................................................. 12
5.
MECHANICAL ADJUSTMENTS
....................... 14
6.
ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 14
CD Section ...................................................................... 17
CD Section ...................................................................... 17
7.
DIAGRAMS
7-1. Block Diagram – CD SERVO Section – ....................... 18
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 19
7-3. Block Diagram – MAIN Section (1/2) – ....................... 20
7-4. Block Diagram – MAIN Section (2/2) – ....................... 21
7-5. Block Diagram – DISPLAY/KEY CONTROL/
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 19
7-3. Block Diagram – MAIN Section (1/2) – ....................... 20
7-4. Block Diagram – MAIN Section (2/2) – ....................... 21
7-5. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 22
7-6. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
7-7. Printed Wiring Board – BD Board – ............................. 24
7-8. Schematic Diagram – BD Board – ................................ 25
7-9. Printed Wiring Boards – CD MOTOR Section – .......... 26
7-10. Schematic Diagram – CD MOTOR Section – .............. 27
7-11. Printed Wiring Board – AUDIO Board – ...................... 28
7-12. Schematic Diagram – AUDIO Board – ......................... 29
7-13. Printed Wiring Board – LEAF SW Board – .................. 30
7-14. Schematic Diagram – LEAF SW Board – ..................... 30
7-15. Schematic Diagram – MAIN Board (1/3) – .................. 31
7-16. Schematic Diagram – MAIN Board (2/3) – .................. 32
7-17. Schematic Diagram – MAIN Board (3/3) – .................. 33
7-18. Printed Wiring Board – MAIN Board – ........................ 34
7-19. Printed Wiring Board – PA Board – .............................. 36
7-20. Schematic Diagram – PA Board – ................................. 37
7-21. Printed Wiring Board – SURROUND Board – ............. 38
7-22. Schematic Diagram – SURROUND Board – ................ 39
7-23. Printed Wiring Boards – MIC/FRONT INPUT/
7-8. Schematic Diagram – BD Board – ................................ 25
7-9. Printed Wiring Boards – CD MOTOR Section – .......... 26
7-10. Schematic Diagram – CD MOTOR Section – .............. 27
7-11. Printed Wiring Board – AUDIO Board – ...................... 28
7-12. Schematic Diagram – AUDIO Board – ......................... 29
7-13. Printed Wiring Board – LEAF SW Board – .................. 30
7-14. Schematic Diagram – LEAF SW Board – ..................... 30
7-15. Schematic Diagram – MAIN Board (1/3) – .................. 31
7-16. Schematic Diagram – MAIN Board (2/3) – .................. 32
7-17. Schematic Diagram – MAIN Board (3/3) – .................. 33
7-18. Printed Wiring Board – MAIN Board – ........................ 34
7-19. Printed Wiring Board – PA Board – .............................. 36
7-20. Schematic Diagram – PA Board – ................................. 37
7-21. Printed Wiring Board – SURROUND Board – ............. 38
7-22. Schematic Diagram – SURROUND Board – ................ 39
7-23. Printed Wiring Boards – MIC/FRONT INPUT/
HEADPHONES Boards – ............................................... 40
7-24. Schematic Diagram – MIC/FRONT INPUT/
HEADPHONES Boards – ............................................. 41
7-25. Printed Wiring Board – PANEL FL Board – ................. 42
7-26. Schematic Diagram – PANEL FL Board – ................... 43
7-27. Printed Wiring Boards
7-26. Schematic Diagram – PANEL FL Board – ................... 43
7-27. Printed Wiring Boards
– PANEL VR/ILLUMINATION Boards – ..................... 44
7-28. Schematic Diagram
– PANEL VR/ILLUMINATION Boards – ..................... 45
7-29. Printed Wiring Boards – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 46
7-30. Schematic Diagram – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 47
7-31. Printed Wiring Board – TRANSFORMER Section– .... 48
7-32. Schematic Diagram – TRANSFORMER Section– ....... 48
7-33. IC Pin Function Description ........................................... 54
7-32. Schematic Diagram – TRANSFORMER Section– ....... 48
7-33. IC Pin Function Description ........................................... 54
8.
EXPLODED VIEWS
8-1. Case, Back Panel Section ................................................ 59
8-2. Front Panel Section-1 ...................................................... 60
8-3. Front Panel Section-2 ...................................................... 61
8-4. Chassis Section ............................................................... 62
8-5. CD Mechanism Deck Section (CDM37M-5BD32L) .... 63
8-6. Base Unit Section (BU-5BD32L) ................................... 64
8-7. Tape Mechanism Deck Section-1
8-2. Front Panel Section-1 ...................................................... 60
8-3. Front Panel Section-2 ...................................................... 61
8-4. Chassis Section ............................................................... 62
8-5. CD Mechanism Deck Section (CDM37M-5BD32L) .... 63
8-6. Base Unit Section (BU-5BD32L) ................................... 64
8-7. Tape Mechanism Deck Section-1
(TCM-230PWR42) ......................................................... 65
8-8. Tape Mechanism Deck Section-2
(TCM230PWR42) ........................................................... 66
9.
ELECTRICAL PARTS LIST
............................... 67
4
HCD-XG100AV/XG900AV
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
SECTION 1
SERVICING NOTES
• MODEL IDENTIFICATION
– Rear Panel –
– Rear Panel –
PART No.
MODEL
PART No.
AEP and UK models
4-232-089-1
[]
120 V AC area in E model
4-232-089-2
[]
Singapore model
4-232-089-3
[]
Mexican model
4-232-089-4
[]
Australian model
4-232-089-5
[]
Saudi Arabia model
4-232-089-6
[]
Argentina model
4-232-089-7
[]
5
HCD-XG100AV/XG900AV
SECTION 2
GENERAL
This section is extracted from
instruction manual.
instruction manual.
A EJECT Z/Z B EJECT wj (17)
AUDIO L jack ws (26)
AUDIO R jack wa (26)
CD SYNC qj (18,19)
DIRECT EQUALIZER 6 (21)
AUDIO L jack ws (26)
AUDIO R jack wa (26)
CD SYNC qj (18,19)
DIRECT EQUALIZER 6 (21)
SALSA REGGAE
SAMBA TANGO
MOVIE GUITAR
ROCK
SAMBA TANGO
MOVIE GUITAR
ROCK
JAZZ
DANCE GAME
DIRECTION ek (17~19,23)
DISC SKIP w; (11,12,19)
DISC 1~5 wl (11)
DISPLAY 4 (10,13,15)
DOLBY NR ek (17,18)
DSP rd (21)
DVD 5.1 CH qf (28)
EDIT ea (19)
ENTER wk (14,16)
ENTER/NEXT qg
DISC SKIP w; (11,12,19)
DISC 1~5 wl (11)
DISPLAY 4 (10,13,15)
DOLBY NR ek (17,18)
DSP rd (21)
DVD 5.1 CH qf (28)
EDIT ea (19)
ENTER wk (14,16)
ENTER/NEXT qg
(10,19,20,22,25,32)
FLASH es (13)
FLAT qg (21)
FUNCTION qa
FLAT qg (21)
FUNCTION qa
(8,11,12,18,19,23,26,27)
GAME qs (24,26)
GROOVE rs (21)
GUITAR DISTORTION wk (24)
GUITAR jack ef (24)
GUITAR LEVEL ej (24)
H SPEED DUB qj (18)
IR receptor 2
Jog dial (AMS./>) ql
GROOVE rs (21)
GUITAR DISTORTION wk (24)
GUITAR jack ef (24)
GUITAR LEVEL ej (24)
H SPEED DUB qj (18)
IR receptor 2
Jog dial (AMS./>) ql
(11~13,19)
LOOP ed (8,13)
MIC LEVEL eh (23)
MIX GUITAR/KARAOKE el (23,24)
MIX MIC jack eg (23)
NON STOP e; (12)
P.FILE qg (21,22)
PHONES jack qk
PLAY MODE w; (11,12,19)
POWER SAVE/DEMO
MIC LEVEL eh (23)
MIX GUITAR/KARAOKE el (23,24)
MIX MIC jack eg (23)
NON STOP e; (12)
P.FILE qg (21,22)
PHONES jack qk
PLAY MODE w; (11,12,19)
POWER SAVE/DEMO
(STANDBY) 3 (10)
PRO LOGIC qf (10,22)
PTY wf (16) *AEP, UK model only
PUSH OPEN wh (11)
REPEAT w; (11)
SLEEP 8 (24)
SPECTRUM ANALYZER 5 (23)
PTY wf (16) *AEP, UK model only
PUSH OPEN wh (11)
REPEAT w; (11)
SLEEP 8 (24)
SPECTRUM ANALYZER 5 (23)
STEREO/MONO wf (15)
SUPER WOOFER ra (21,27)
SUPER WOOFER MODE r; (21)
TIMER SELECT 9 (20,25)
TUNER/BAND wg(14,15,18)
TUNER MEMORY wk (14)
TUNING MODE wf (14,15)
VIDEO jack wd (26)
VOLUME control qd (15)
SUPER WOOFER ra (21,27)
SUPER WOOFER MODE r; (21)
TIMER SELECT 9 (20,25)
TUNER/BAND wg(14,15,18)
TUNER MEMORY wk (14)
TUNING MODE wf (14,15)
VIDEO jack wd (26)
VOLUME control qd (15)
BUTTON DESCRIPTIONS
@/1 1
c
c
/CLOCK SET 7
v/V/b/B q;
z REC qh
X qh
m /M, AMS./>
z REC qh
X qh
m /M, AMS./>
(TAPE A/B) qhek
h/H qhek
x qhw;ek
m /M (CD) w;
HX w;
+/– wg
x qhw;ek
m /M (CD) w;
HX w;
+/– wg
wa
ws
wd
wf
wg
wj
wk
wl
e;
ea
es
ed
ef
eg
ej
el
ek
r;
ra
rs
rd
eh
wh
w;
ql
qd
qs
qa
2 3456789 q;
qf
qg
qh
qj
qk
1
LOCATION OF CONTROLS
– Front Panel –
– Front Panel –