DOWNLOAD Sony HCD-XB8K / LBT-XB8AVK / LBT-XB8AVKS Service Manual ↓ Size: 1002.21 KB | Pages: 98 in PDF or view online for FREE

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MICROFILM

HCD-XB8K is the tuner, deck, CD and
amplifier section in LBT-XB8AVK/XB8AVKS.

Model Name Using Similar Mechanism

HCD-N555AVK

CD Mechanism Type

CDM37L-5BD29AL

Base Unit Type

BU-5BD29AL

Optical Pick-up Type

KSS-213D/Q-NP

Model Name Using Similar Mechanism

HCD-N555AVK

Tape Transport Mechanism Type

TCM-220WR2

CD

SECTION

TAPE

DECK

SECTION

E Model

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Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

 damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

 circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

 or unsoldering.

Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.

This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.

This caution
label is located
inside the unit.

• Abbreviation

EA : Saudi Arabia model
SP : Singapore model
MY : Malaysia model
IA : Indonesian model
TH : Thailand model

E, IA model

EA model

SP model

MY, TH model

MODEL

PARTS No.

Parts No.

4-988-222-4 

4-988-222-5 

4-988-222-6 

4-988-222-7 

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.......................................................................... 4

2-1. Front Panel ........................................................................... 5
2-2. Main Board ........................................................................... 6
2-3. Tape Mechanism Deck .......................................................... 6
2-4. Cassette Lid Assembly .......................................................... 7
2-5. CD Lid Assembly .................................................................. 7
2-6. CD Mechanism Deck ............................................................ 8
2-7. Base Unit ............................................................................. 8
2-8. Disc Table ............................................................................. 8

........................................................

9

..........................

11

............................... 11

6-1. Circuit Boards Location ...................................................... 15
6-2. Block Diagrams

• KEY CON Section ........................................................... 16
• CD Section ....................................................................... 17
• Deck Section .................................................................... 19
• Main Section .................................................................... 21
• Power Section .................................................................. 23

6-3. Printed Wiring Board — CD Section — ............................. 25
6-4. Schematic Diagram — CD Section — ............................... 27
6-5. Printed Wiring Board — Main Section — .......................... 30
6-6. Schematic Diagram — Main Section — ............................ 33
6-7. Schematic Diagram — Deck Section — ............................ 37
6-8. Printed Wiring Board — Deck Section — .......................... 41
6-9. Schematic Diagram — Panel Section — ............................ 44
6-10. Printed Wiring Board — Panel Section — ....................... 47
6-11. Schematic Diagram — Power Section — ........................ 51
6-12. Printed Wiring Board — Power Section — ..................... 55
6-13. Schematic Diagram — CD Motor Section — .................. 58
6-14. Printed Wiring Board — CD Motor Section — ............... 59
6-15. Schematic Diagram — KEY CON Section — ................. 61
6-16. Printed Wiring Board — KEY CON Section — .............. 62
6-17. IC Block Diagrams ........................................................... 63
6-18. IC Pin Functions ............................................................... 69

7-1. Case and Back Panel Section .............................................. 78
7-2. Front Panel Section 1 .......................................................... 79
7-3. Front Panel Section 2 .......................................................... 80
7-4. Chassis Section ................................................................... 81
7-5. TC Mechanism Section 1 (TCM-220WR2) ........................ 82
7-6. TC Mechanism Section 2 (TCM-220WR2) ........................ 83
7-7. TC Mechanism Section 3 (TCM-220WR2) ........................ 84
7-8. CD Mechanism Section (CDM37L-5BD29AL) ................. 85
7-9. Base Unit Section (BU-5BD29AL) .................................... 86

........................................ 87

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.

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