Sony HCD-WZ8D / MHC-WZ8D Service Manual ▷ View online
29
29
HCD-WZ8D
4–2. Printed Wiring Board – RF Board –
• See page 23 for Circuit Boards Location.
•
: Uses unleaded solder.
(SIDE A)
RF BOARD
(SIDE B)
RF BOARD
IC001
DMB03 BOARD
CN501
A
E
E
OPTICAL PICK-UP
BLOCK
(DBU-1)
1-684-822-
11
(11)
1-684-822-
11
(11)
1
16
17
32
48
33
64
49
1
2
3
4
5
6
7
8
9
10
11
12
13
A
B
C
D
E
F
(Page 31)
• Semiconductor
Location
Ref. No.
Location
D001
C-11
D002
B-11
IC001
D-11
Q001
C-3
Q002
B-3
Ver 1.2
30
30
HCD-WZ8D
4–3. Schematic Diagram – RF Board –
• See page 24 for Waveforms. • See page 55 for IC Block Diagrams.
A
(2/9)
CN501
JL005
C011
R033
C036
R034
C039
C038
C037
C040
R021
JL007
C003
R010
R008
R007
IOP1
L002
47uH
47uH
C004
D002
R006
C001
C010
R004
R003
IOP2
L001
C002
D001
R022
R025
R023
C016
C015
C014
R014
R013
R012
R011
R018
R017
R016
R015
C042
C020
C021
C022
C023
R024
R026
C027
C028
C029
C018
C017
C019
C024
C031
C033
C012
C005
R032
JL003
JL006
R029
R028
R027
JL002
JL001
C032
C034
C049
C009
C035
IC001
CN003
CN001
CN002
C025
C006
C013
R005
R009
R035
R019
R020
C041
R001
Q001
Q002
C008
R041
JL004
C030
C026
1000p
0
0.47
10M
0.033
0.033
330p
0.1
0
100
6.3V
470
33
33
10
16V
1SS355TE
-17
470
100
6.3V
1000p
33
33
10
16V
1SS355TE
-17
220
100
820
2200p
2200p
2200p
0
0
0
0
0
0
0
0
180p
22p
22p
22p
22p
0
12k
0.1
0.1
0.01
5600p
2200p
5600p
0.01
1000p
0.1
0.1
22
10V
100
0
0
0
0.047
0.1
0.1
0.1
0.1
CXD1881AR
9P
24P
29P
0.1
22
10V
0.1
47k
47k
0
0
0
0.1
100
2SB1132-T100-QR
2SB1132-T100-QR
0.1
1k
0.01
0.1
34
(DBU-1)
Ver 1.2
31
31
HCD-WZ8D
4–4. Printed Wiring Board – DMB03 Board (Side A) –
• See page 23 for Circuit Boards Location.
•
: Uses unleaded solder.
IC701
IC207
IC509
IC901
IC302
IC601
IC906
IC904
IC902
IC211
IC503
IC258
IC256
IC259
IC255
IC216
IC393
TO
MAIN BOARD
CN101
(Page 42)
B
1
1
1
36
37
72
73
108
109
144
7
11
17
2
2
6
NOT USED
TO
MAIN BOARD
CN102
(Page 42)
D
TO
VIDEO BOARD
CN801
(Page 53)
E
TO
4CH-VOL BOARD
CN303
(Page 43)
F
TO
REGULATOR BOARD
CN506
(Page 49)
C
TO
RF BOARD
CN002
(Page 29)
A
FOR CHECK
3
1
R626
(EXCEPT AEP,UK,
RU,E2)
RU,E2)
(AEP,UK,RU,AUS)
25P(AEP,UK,RU,AUS)
21P(EXCEPT AEP,UK,RU,AUS)
21P(EXCEPT AEP,UK,RU,AUS)
C650
C612
C613
C696
C397
C395
R618
R607
R619
R612
R198
R285
R613
FL601
C651
CN107
FL602
X601
3
1
R574
(AEP,UK,RU,AUS)
• Semiconductor
Location
Ref. No.
Location
D202
C-4
D901
D-2
D1301
A-2
D1302
A-2
D1303
B-1
D1304
B-1
D1801
D-5
D1802
D-5
IC207
B-6
IC211
C-4
IC216
D-7
IC255
B-5
IC256
B-5
IC258
B-5
IC259
A-5
IC302
B-1
IC393
D-1
IC503
C-4
IC509
C-4
IC601
B-2
IC701
D-6
IC901
C-2
IC902
C-6
IC904
C-6
IC906
C-5
Q903
A-2
Q904
A-2
32
32
HCD-WZ8D
4–5. Printed Wiring Board – DMB03 Board (Side B) –
• See page 23 for Circuit Boards Location.
•
: Uses unleaded solder.
IC392
IC907
IC903
IC602
IC352
IC204
IC501
IC703
IC706
IC206
IC203
IC252
44
23
22
1
1
3
1
3
D
R301
R239
R727
R288
C289
R1001
C617
C607
C615
C609
C610
(EXCEPT AEP,UK,RU,E2)
R616
C616
C614
R620
C619
R617
E
(AEP,UK,RU,AUS)
(AEP,UK,RU,AUS)
E
• Semiconductor
Location
Ref. No.
Location
D392
D-6
D393
D-7
D394
D-7
D1101
D-6
D1102
D-6
D1201
A-1
D1202
A-1
D1203
A-1
D1204
A-1
IC203
B-1
IC204
B-2
IC206
C-1
IC252
B-4
IC352
A-7
IC392
D-7
IC501
D-4
IC602
B-6
IC703
D-3
IC706
D-2
IC903
C-5
IC907
D-7
Q202
B-2
Q901
D-6
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