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3-10. CDM Board, CD Mechanism Deck

6-2.

Block Diagrams ·························································· 21

6-3.

Printed Wiring Board  – MAIN Section – ·················· 23

6-4.

Schematic Diagram  – MAIN Section (1/4) – ············ 24

6-5.

Schematic Diagram  – MAIN Section (2/4) – ············ 25

6-6.

Schematic Diagram  – MAIN Section (3/4) – ············ 26

6-7.

Schematic Diagram  – MAIN Section (4/4) – ············ 27

6-8.

Schematic Diagram  – PANEL Section – ··················· 28

6-9.

Printed Wiring Board  – PANEL Section – ················ 29

6-10. Printed Wiring Board  –  LCD Section – ··················· 30
6-11. Schematic Diagram  – AMP/POWER Section – ········ 31
6-12. Printed Wiring Board  – AMP Section – ···················· 32
6-13. Printed Wiring Board  – POWER Section – ·············· 33
6-14. Schematic Diagram  – CD Section – ························· 34
6-15. Printed Wiring Board  – CD Section – ······················· 35
6-16. Printed Wiring Board  – MOTOR Section – ·············· 36
6-17. IC Pin Function Description ······································ 39

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COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

This caution
label is
located inside
the unit.

4

TC Deck section

MAIN board

Jig cord : J-2501-082-A

CN404

5

This section is extracted
from instruction manual.

MD 9 (24)
MUSIC MENU wd (19)
PHONES jack w;
PLAY MODE/TUNING MODE

qf (9, 11, 26)

REC PAUSE/START wk (16)
Remote sensor q;
REPEAT/FM MODE qh (9, 13,

26)

SURROUND wf (18)
Tape deck lid 4 (15)
TAPE nN qs (15, 16)

BASS wa (18)
CD disc tray qk (8)
CD SYNC wj (16)
CD NX wl (9)
DIMMER 2 (22)
DISPLAY 3 (14, 21)
Display window 5
EDIT wg (17)
ENTER qd (8, 10, 11, 17, 20, 27)
FUNCTION qg (9, 10, 15, 16,

24)

GROOVE ws (18)

TREBLE qj (19)
TUNER/BAND e; (11, 13)
TUNER MEMORY/DIRECTION

qa (11, 15)

VOL 8

?/1 1
+/M L 7
x wh
l –/m 6
Z ql (8)

@/1 4
N 9
x 9
X 9
m/M wa
./

 ws

CD ql (9)
CLEAR wd (10)
CLOCK/TIMER SELECT 2

(21, 25)

CLOCK/TIMER SET 7

(8, 17, 20)

DISPLAY qh (14, 21)
EFFECT ON/OFF qf (19)
ENTER 7 (8, 10, 11, 17, 20, 27)
GROOVE qd (18)

MD 0 (24)
MUSIC MENU +/–  qg (19)
PLAY MODE 5 (9, 26)
PRESET –/+ ws
REPEAT 6 (9)
SLEEP 1 (20)
SURROUND qs (18)
TAPE qa (15)
TONE qk (18)
TUNER/BAND w; (11, 13)
TUNER MEMORY 8 (11)
TUNING  –/+ wa (11)
VOL +/– qj