DOWNLOAD Sony HCD-SHAKE7 Service Manual ↓ Size: 6.03 MB | Pages: 92 in PDF or view online for FREE

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HCD-SHAKE7
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92
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Service Manual
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Audio
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hcd-shake7.pdf
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Sony HCD-SHAKE7 Service Manual ▷ View online

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-SHAKE7
MINI HI-FI COMPONENT SYSTEM
9-890-619-03
2013K80-1
© 
2013.11
E Model
Ver. 1.2  2013.11
•  HCD-SHAKE7 is the tuner, USB, CD player, Bluetooth, NFC
 and 
amplifi er section in SHAKE-7.
SPECIFICATIONS
CD Section
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM90-DVBU202//M
Optical Pick-up Name
CMS-S76RFS7G
Amplifi er section
The following are measured at
Mexican model:
 
AC 120 V – 240 V, 60 Hz
Other models:
 
AC 120 V – 240 V, 50/60 Hz
Tweeters/woofers
 
Power Output (rated):
 
320 W + 320 W (at 4 ohms, 1 kHz,
 1% 
THD)
 
RMS output power (reference):
 
520 W + 520 W (per channel at 
 
4 ohms, 1 kHz)
Mid speakers
 
Power Output (rated):
 
240 W + 240 W (at 5 ohms, 1 kHz,
 1% 
THD)
 
RMS output power (reference):
 
385 W + 385 W (per channel at 
 
5 ohms, 1 kHz)
Subwoofers
 
Power Output (rated):
 
320 W + 320 W (at 4 ohms, 100 Hz,
 1% 
THD)
 
RMS output power (reference):
 
520 W + 520 W (per channel at
 
4 ohms, 100 Hz)
Inputs
TV/DVD/SAT (AUDIO IN) L/R
 
Voltage 2 V, impedance 47 kilohms
PC/GAME (AUDIO IN) L/R
 
Voltage 2 V, impedance 47 kilohms
MIC
 
Sensitivity 1 mV, impedance 10 kilohms
 
 A (USB), 
 B (USB) port: Type A
USB section
Supported bit rate
 WMA:
 
48 kbps – 192 kbps, VBR, CBR
 AAC:
 
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
 
WMA: 44.1 kHz
 
AAC: 44.1 kHz
Supported USB device
 
Mass Storage Class
Maximum current
 500 
mA
Disc/USB section
Supported bit rate
 MPEG1 
Layer-3:
 
32 kbps – 320 kbps, VBR
 
MPEG2 Layer-3:
 
8 kbps – 160 kbps, VBR
 MPEG1 
Layer-2:
 
32 kbps – 384 kbps, VBR
Sampling frequencies
 MPEG1 
Layer-3:
 
32 kHz/44.1 kHz/48 kHz
 MPEG2 
Layer-3:
 
16 kHz/22.05 kHz/24 kHz
 MPEG1 
Layer-2:
 
32 kHz/44.1 kHz/48 kHz
Disc player section
System
 
Compact disc and digital audio system
Laser Diode Properties
 
Emission Duration: Continuous
 
Laser Output*: Less than 44.6 µW
 
* This output is the value 
measurement at a distance of 
200 mm from the objective lens 
surface on the Optical Pick-up 
Block with 7 mm aperture.
Frequency response
 
20 Hz – 20 kHz
Signal-to-noise ratio
 
More than 90 dB
Dynamic range
 
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
 
FM lead antenna
 
AM loop antenna
FM tuner section
Tuning range
 
87.5 MHz – 108.0 MHz 
 
(50 kHz step)
AM tuner section
Tuning range
 
Pan American  models:
 
531 kHz – 1,710 kHz (9 kHz step)
 
530 kHz – 1,710 kHz (10 kHz step)
 
Saudi Arabian  model:
 
531 kHz – 1,602 kHz (9 kHz step)
 Other 
models:
 
531 kHz – 1,602 kHz (9 kHz step)
 
530 kHz – 1,610 kHz (10 kHz step)
Bluetooth section
Communication system
 
Bluetooth Standard version 3.0 + 
 
EDR (Enhanced Date Rate)
Output
 
Bluetooth Standard Power Class 2
Maximum communication range
 
Line of sight approx. 10m
1)
Frequency band
 
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
 
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
 
A2DP (Advanced Audio Distribution 
 Profile)
 
AVRCP 1.3 (Audio Video Remote 
 Control 
Profile)
Supported codecs
 
SBC (Sub Band Codec)
 
AAC (Advanced Audio Coding)
1)
 The actual range will vary depending on 
factors such as obstacles between devices, 
magnetic fields around a microwave oven, 
static electricity, reception sensitivity, 
antenna’s performance, operating system, 
software application, etc.
2)
  Bluetooth standard profiles indicate the 
purpose of Bluetooth  communication 
between devices.
General
Power requirements
 Mexican 
model:
 
AC 120 V – 240 V, 60 Hz
 Other 
models:
 
AC 120 V – 240 V, 50/60 Hz
Power consumption
 
420 W
Dimensions (w/h/d) (excl. speakers)
(Approx.) (Except AR)
 
500 mm × 220 mm × 380 mm
Dimensions (w/h/d) (excl. speakers) (AR)
 
500 mm × 220 mm × 380 mm
Mass (excl. speakers) (Approx.) (Except AR)
 8.4 
kg
Mass (excl. speakers) (AR)
 8.4 
kg
Supplied accessories
 
Remote control (1)
 
R6 (Size AA) batteries (2)
 
FM lead/AM loop antenna (1)
Design and specifications are subject to 
change without notice.
License and Trademark Notice
• “WALKMAN” and “WALKMAN” logo 
are registered trademarks of Sony Corpo-
ration.
•  MPEG Layer-3 audio coding technology 
and patents licensed from Fraunhofer IIS 
and Thomson.
• Windows Media is either a registered 
trademark or trademark of Microsoft 
Corporation in the United States and/or 
other countries.
• This product is protected by certain 
intellectual property rights of Microsoft 
Corporation. Use or distribution of 
such technology outside of this product 
is prohibited without a license from 
Microsoft or an authorized Microsoft 
subsidiary.
• The Bluetooth® word mark and logos are 
registered trademarks owned by Bluetooth 
SIG, Inc. and any use of such marks by 
Sony Corporation is under license. Other 
trademarks and trade names are those of 
their respective owners.
•  The N Mark is a trademark or registered 
trademark of NFC Forum, Inc. in the 
United States and in other countries.
•  Android is a trademark of Google Inc.
• All other trademarks and registered 
trademarks are of their respective holders. 
In this manual, ™ and ® marks are not 
specified.
HCD-SHAKE7
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS  IDENTIFIED  BY  MARK 
0 OR  DOTTED  LINE  
WITH  MARK 
0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the following 
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage. Check 
leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA
 
WT-540A. Follow the manufacturers’ instructions to use these
 instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245
 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a
 
VOM or battery-operated AC voltmeter. The “limit” indication
 
is 0.75 V, so analog meters must have an accurate low-voltage
 
scale. The Simpson 250 and Sanwa SH-63Trd are examples
 
of a passive VOM that is suitable. Nearly all battery operated
 
digital multimeters that have a 2V AC range are suitable. (See
 Fig. 
A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
HCD-SHAKE7
3
1. 
SERVICING  NOTES
  .............................................   4
2. DISASSEMBLY
2-1.   Side-L Panel Assy, Side-R Panel Assy, Top Panel ..........   7
2-2.   Back Panel Section .........................................................   8
2-3.   Loading Panel Assy ........................................................   8
2-4.   CDM90-DVBU202//M ...................................................   9
2-5.   Front Panel Section .........................................................   9
2-6.   MOTHERBOARD Board ...............................................   10
2-7.   SWITCHING REGULATOR (SMG-1800) ....................   11
2-8.   Service Optical Device, Wire (Flat Type) .......................   12
3. 
STORM  TEST  MODE 
 ..........................................   13
4. 
ELECTRICAL  CHECK 
 .........................................   16
5. TROUBLESHOOTING 
 ..........................................   17
6. DIAGRAMS
6-1.  Block Diagram - RS SERVO, USB Section - .................   23
6-2.  Block Diagram - MAIN Section - ...................................   24
6-3.  Block Diagram - AMP Section - .....................................   25
6-4. Block 
Diagram 
- PANEL, POWER SUPPLY Section - ...........................   26
6-5. Printed 
Wiring 
Board 
 
- MOTHERBOARD Board (Component Side) - ............   28
6-6. Printed 
Wiring 
Board
 
- MOTHERBOARD Board (Conductor Side) - .............   29
6-7. Schematic 
Diagram 
 
- MOTHERBOARD Board (1/10) - ...............................   30
6-8. Schematic 
Diagram 
 
- MOTHERBOARD Board (2/10) - ...............................   31
6-9. Schematic 
Diagram 
 
- MOTHERBOARD Board (3/10) - ...............................   32
6-10. Schematic Diagram 
 
- MOTHERBOARD Board (4/10) - ...............................   33
6-11. Schematic Diagram 
 
- MOTHERBOARD Board (5/10) - ...............................   34
6-12. Schematic Diagram 
 
- MOTHERBOARD Board (6/10) - ...............................   35
6-13. Schematic Diagram 
 
- MOTHERBOARD Board (7/10) - ...............................   36
6-14. Schematic Diagram 
 
- MOTHERBOARD Board (8/10) - ...............................   37
6-15. Schematic Diagram 
 
- MOTHERBOARD Board (9/10) - ...............................   38
6-16. Schematic Diagram 
 
- MOTHERBOARD Board (10/10) - .............................   39
TABLE  OF  CONTENTS
6-17.  Printed Wiring Board - DISPLAY Board - .....................   40
6-18.  Schematic Diagram - DISPLAY Board - ........................   41
6-19. Printed Wiring Board 
 
- VOLUME Board (Component Side) - ..........................   42
6-20. Printed Wiring Board 
 
- VOLUME Board (Conductor Side) - ...........................   43
6-21.  Schematic Diagram - VOLUME Board - .......................   44
6-22.  Printed Wiring Board -
 
BUTTON_L Board - .................   45
6-23.  Schematic Diagram -
 
BUTTON_L Board - ....................   46
6-24.  Printed Wiring Board -
 
BUTTON_R Board - .................   47
6-25.  Schematic Diagram -
 
BUTTON_R Board - ...................   48
6-26.  Printed Wiring Board -
 
MIC Board - ..............................   48
6-27.  Schematic Diagram -
 
MIC Board - .................................   49
6-28.  Printed Wiring Board -
 
USB Board - ..............................   49
6-29.  Schematic Diagram -
 
USB Board - ................................   50
6-30.  Printed Wiring Boards -
 
RGB BAR Boards - .................   51
6-31.  Schematic Diagram -
 
RGB BAR Boards - .....................   52
7. 
EXPLODED  VIEWS
7-1.  Side Panel Section ..........................................................   67
7-2.  Back Panel Section .........................................................   68
7-3.  Front Panel Section .........................................................   69
7-4. Chassis 
Section 
...............................................................  70
7-5.  CD Mechanism Section (CDM90-DVBU202//M) .........   71
8. 
ELECTRICAL  PARTS  LIST
  ..............................   72
HCD-SHAKE7
4
SECTION  1
SERVICING  NOTES
Notes on chip component replacement
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be
 
damaged by heat.
Flexible Circuit Board Repairing
• 
Keep the temperature of the soldering iron around 270 °C
 during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the
 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering
 or 
unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the 
leadfree mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with
 
the lead free mark due to their particular size)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• 
Unleaded solder melts at a temperature about 40 °C higher
 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be
 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to
 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow)
 
than ordinary solder so use caution not to let solder bridges
 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may
 
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK 
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
- BACK PANEL -
This appliance is
claassifi ed as a CLASS 1
LASER product. This
label is located on the
rear exterior.
Model
Part No.
E2, E4, E51, EA, MY, SAF, AR
4-449-865-0[]
MX
4-449-865-1[]
• Abbreviation
 AR  : 
Argentina 
model
  E2 
: 120 V AC area in E model
 E4  : 
African 
model
  E51 
: Chilean and Peruvian models
  EA 
: Saudi Arabian model
  MX 
: Mexican model
  MY 
: Malaysia model
  SAF  : South African model
PLAYABLE  DISCS
• AUDIO 
CD
• CD-R/CD-RW
 – 
audio 
data
 – 
MP3 
fi les that conforms to ISO9660 Level 1/Level 2, or 
Joliet (expansion format).
Notes
•  MP3 (MPEG 1 Audio Layer-3) is a standard format defi ned 
by ISO (International Organization for Standardization) which 
compresses audio data. MP3 fi les must be in MPEG 1 Audio 
Layer-3 format.
•  The system can only play back MP3 fi les that have a fi le 
extension of “.mp3”.
NOTE  OF  REPLACING  THE  IC304,  IC305,  IC306  AND  
IC902  ON  THE  MOTHERBOARD  BOARD
IC304, IC305 IC306 and IC902 on the MOTHERBOARD 
board cannot exchange with single. When these parts on the 
MOTHERBOARD board are damaged, exchange the entire 
mounted board.
NOTE  OF  REPLACEMENT  OF  THE  MS-476  BOARD
When the MS-476 board is defective, exchange the entire 
LOADING ASSY (T).
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1. Press 
[
\
/1
] button to turn the power on.
2.  Press the [CD] button to select CD function.
3.  While pressing the [
x
] button, press the [OPTIONS] button 
for more 5 seconds).
4.  The message “UNLOCKED” is displayed and the disc tray is 
unlocked.
Note: When 
LOCKED
 is displayed, the slot lock is not released by 
turning power on/off with the
 [
\
/1
]
 button.
PART No.
Ver. 1.2
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  • DOWNLOAD Sony HCD-SHAKE7 Service Manual ↓ Size: 6.03 MB | Pages: 92 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony HCD-SHAKE7 in PDF for free, which will help you to disassemble, recover, fix and repair Sony HCD-SHAKE7 Audio. Information contained in Sony HCD-SHAKE7 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.