Sony HCD-SHAKE7 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-SHAKE7
MINI HI-FI COMPONENT SYSTEM
9-890-619-03
2013K80-1
©
2013.11
E Model
Ver. 1.2 2013.11
• HCD-SHAKE7 is the tuner, USB, CD player, Bluetooth, NFC
and
and
amplifi er section in SHAKE-7.
SPECIFICATIONS
CD Section
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM90-DVBU202//M
Optical Pick-up Name
CMS-S76RFS7G
Amplifi er section
The following are measured at
Mexican model:
The following are measured at
Mexican model:
AC 120 V – 240 V, 60 Hz
Other models:
AC 120 V – 240 V, 50/60 Hz
Tweeters/woofers
Power Output (rated):
320 W + 320 W (at 4 ohms, 1 kHz,
1%
THD)
RMS output power (reference):
520 W + 520 W (per channel at
4 ohms, 1 kHz)
Mid speakers
Power Output (rated):
240 W + 240 W (at 5 ohms, 1 kHz,
1%
THD)
RMS output power (reference):
385 W + 385 W (per channel at
5 ohms, 1 kHz)
Subwoofers
Power Output (rated):
320 W + 320 W (at 4 ohms, 100 Hz,
1%
THD)
RMS output power (reference):
520 W + 520 W (per channel at
4 ohms, 100 Hz)
Inputs
TV/DVD/SAT (AUDIO IN) L/R
TV/DVD/SAT (AUDIO IN) L/R
Voltage 2 V, impedance 47 kilohms
PC/GAME (AUDIO IN) L/R
Voltage 2 V, impedance 47 kilohms
MIC
Sensitivity 1 mV, impedance 10 kilohms
A (USB),
B (USB) port: Type A
USB section
Supported bit rate
WMA:
Supported bit rate
WMA:
48 kbps – 192 kbps, VBR, CBR
AAC:
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
WMA: 44.1 kHz
AAC: 44.1 kHz
Supported USB device
Mass Storage Class
Maximum current
500
500
mA
Disc/USB section
Supported bit rate
MPEG1
Supported bit rate
MPEG1
Layer-3:
32 kbps – 320 kbps, VBR
MPEG2 Layer-3:
8 kbps – 160 kbps, VBR
MPEG1
Layer-2:
32 kbps – 384 kbps, VBR
Sampling frequencies
MPEG1
MPEG1
Layer-3:
32 kHz/44.1 kHz/48 kHz
MPEG2
Layer-3:
16 kHz/22.05 kHz/24 kHz
MPEG1
Layer-2:
32 kHz/44.1 kHz/48 kHz
Disc player section
System
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 µW
* This output is the value
measurement at a distance of
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
FM tuner section
Tuning range
Tuning range
87.5 MHz – 108.0 MHz
(50 kHz step)
AM tuner section
Tuning range
Tuning range
Pan American models:
531 kHz – 1,710 kHz (9 kHz step)
530 kHz – 1,710 kHz (10 kHz step)
Saudi Arabian model:
531 kHz – 1,602 kHz (9 kHz step)
Other
models:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)
Bluetooth section
Communication system
Communication system
Bluetooth Standard version 3.0 +
EDR (Enhanced Date Rate)
Output
Bluetooth Standard Power Class 2
Maximum communication range
Line of sight approx. 10m
1)
Frequency band
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
A2DP (Advanced Audio Distribution
Profile)
AVRCP 1.3 (Audio Video Remote
Control
Profile)
Supported codecs
SBC (Sub Band Codec)
AAC (Advanced Audio Coding)
1)
The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2)
Bluetooth standard profiles indicate the
purpose of Bluetooth communication
between devices.
between devices.
General
Power requirements
Mexican
Power requirements
Mexican
model:
AC 120 V – 240 V, 60 Hz
Other
models:
AC 120 V – 240 V, 50/60 Hz
Power consumption
420 W
Dimensions (w/h/d) (excl. speakers)
(Approx.) (Except AR)
(Approx.) (Except AR)
500 mm × 220 mm × 380 mm
Dimensions (w/h/d) (excl. speakers) (AR)
500 mm × 220 mm × 380 mm
Mass (excl. speakers) (Approx.) (Except AR)
8.4
8.4
kg
Mass (excl. speakers) (AR)
8.4
8.4
kg
Supplied accessories
Remote control (1)
R6 (Size AA) batteries (2)
FM lead/AM loop antenna (1)
Design and specifications are subject to
change without notice.
change without notice.
License and Trademark Notice
• “WALKMAN” and “WALKMAN” logo
• “WALKMAN” and “WALKMAN” logo
are registered trademarks of Sony Corpo-
ration.
ration.
• MPEG Layer-3 audio coding technology
and patents licensed from Fraunhofer IIS
and Thomson.
and Thomson.
• Windows Media is either a registered
trademark or trademark of Microsoft
Corporation in the United States and/or
other countries.
Corporation in the United States and/or
other countries.
• This product is protected by certain
intellectual property rights of Microsoft
Corporation. Use or distribution of
such technology outside of this product
is prohibited without a license from
Microsoft or an authorized Microsoft
subsidiary.
Corporation. Use or distribution of
such technology outside of this product
is prohibited without a license from
Microsoft or an authorized Microsoft
subsidiary.
• The Bluetooth® word mark and logos are
registered trademarks owned by Bluetooth
SIG, Inc. and any use of such marks by
Sony Corporation is under license. Other
trademarks and trade names are those of
their respective owners.
SIG, Inc. and any use of such marks by
Sony Corporation is under license. Other
trademarks and trade names are those of
their respective owners.
• The N Mark is a trademark or registered
trademark of NFC Forum, Inc. in the
United States and in other countries.
United States and in other countries.
• Android is a trademark of Google Inc.
• All other trademarks and registered
• All other trademarks and registered
trademarks are of their respective holders.
In this manual, ™ and ® marks are not
specified.
In this manual, ™ and ® marks are not
specified.
HCD-SHAKE7
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig.
A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
HCD-SHAKE7
3
1.
SERVICING NOTES
............................................. 4
2. DISASSEMBLY
2-1. Side-L Panel Assy, Side-R Panel Assy, Top Panel .......... 7
2-2. Back Panel Section ......................................................... 8
2-3. Loading Panel Assy ........................................................ 8
2-4. CDM90-DVBU202//M ................................................... 9
2-5. Front Panel Section ......................................................... 9
2-6. MOTHERBOARD Board ............................................... 10
2-7. SWITCHING REGULATOR (SMG-1800) .................... 11
2-8. Service Optical Device, Wire (Flat Type) ....................... 12
2-2. Back Panel Section ......................................................... 8
2-3. Loading Panel Assy ........................................................ 8
2-4. CDM90-DVBU202//M ................................................... 9
2-5. Front Panel Section ......................................................... 9
2-6. MOTHERBOARD Board ............................................... 10
2-7. SWITCHING REGULATOR (SMG-1800) .................... 11
2-8. Service Optical Device, Wire (Flat Type) ....................... 12
3.
STORM TEST MODE
.......................................... 13
4.
ELECTRICAL CHECK
......................................... 16
5. TROUBLESHOOTING
.......................................... 17
6. DIAGRAMS
6-1. Block Diagram - RS SERVO, USB Section - ................. 23
6-2. Block Diagram - MAIN Section - ................................... 24
6-3. Block Diagram - AMP Section - ..................................... 25
6-4. Block
6-2. Block Diagram - MAIN Section - ................................... 24
6-3. Block Diagram - AMP Section - ..................................... 25
6-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 26
6-5. Printed
Wiring
Board
- MOTHERBOARD Board (Component Side) - ............ 28
6-6. Printed
Wiring
Board
- MOTHERBOARD Board (Conductor Side) - ............. 29
6-7. Schematic
Diagram
- MOTHERBOARD Board (1/10) - ............................... 30
6-8. Schematic
Diagram
- MOTHERBOARD Board (2/10) - ............................... 31
6-9. Schematic
Diagram
- MOTHERBOARD Board (3/10) - ............................... 32
6-10. Schematic Diagram
- MOTHERBOARD Board (4/10) - ............................... 33
6-11. Schematic Diagram
- MOTHERBOARD Board (5/10) - ............................... 34
6-12. Schematic Diagram
- MOTHERBOARD Board (6/10) - ............................... 35
6-13. Schematic Diagram
- MOTHERBOARD Board (7/10) - ............................... 36
6-14. Schematic Diagram
- MOTHERBOARD Board (8/10) - ............................... 37
6-15. Schematic Diagram
- MOTHERBOARD Board (9/10) - ............................... 38
6-16. Schematic Diagram
- MOTHERBOARD Board (10/10) - ............................. 39
TABLE OF CONTENTS
6-17. Printed Wiring Board - DISPLAY Board - ..................... 40
6-18. Schematic Diagram - DISPLAY Board - ........................ 41
6-19. Printed Wiring Board
6-18. Schematic Diagram - DISPLAY Board - ........................ 41
6-19. Printed Wiring Board
- VOLUME Board (Component Side) - .......................... 42
6-20. Printed Wiring Board
- VOLUME Board (Conductor Side) - ........................... 43
6-21. Schematic Diagram - VOLUME Board - ....................... 44
6-22. Printed Wiring Board -
6-22. Printed Wiring Board -
BUTTON_L Board - ................. 45
6-23. Schematic Diagram -
BUTTON_L Board - .................... 46
6-24. Printed Wiring Board -
BUTTON_R Board - ................. 47
6-25. Schematic Diagram -
BUTTON_R Board - ................... 48
6-26. Printed Wiring Board -
MIC Board - .............................. 48
6-27. Schematic Diagram -
MIC Board - ................................. 49
6-28. Printed Wiring Board -
USB Board - .............................. 49
6-29. Schematic Diagram -
USB Board - ................................ 50
6-30. Printed Wiring Boards -
RGB BAR Boards - ................. 51
6-31. Schematic Diagram -
RGB BAR Boards - ..................... 52
7.
EXPLODED VIEWS
7-1. Side Panel Section .......................................................... 67
7-2. Back Panel Section ......................................................... 68
7-3. Front Panel Section ......................................................... 69
7-4. Chassis
7-2. Back Panel Section ......................................................... 68
7-3. Front Panel Section ......................................................... 69
7-4. Chassis
Section
............................................................... 70
7-5. CD Mechanism Section (CDM90-DVBU202//M) ......... 71
8.
ELECTRICAL PARTS LIST
.............................. 72
HCD-SHAKE7
4
SECTION 1
SERVICING NOTES
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of the soldering iron around 270 °C
during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or
unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
•
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
- BACK PANEL -
This appliance is
claassifi ed as a CLASS 1
LASER product. This
label is located on the
rear exterior.
claassifi ed as a CLASS 1
LASER product. This
label is located on the
rear exterior.
Model
Part No.
E2, E4, E51, EA, MY, SAF, AR
4-449-865-0[]
MX
4-449-865-1[]
• Abbreviation
AR :
AR :
Argentina
model
E2
: 120 V AC area in E model
E4 :
African
model
E51
: Chilean and Peruvian models
EA
: Saudi Arabian model
MX
: Mexican model
MY
: Malaysia model
SAF : South African model
PLAYABLE DISCS
• AUDIO
• AUDIO
CD
• CD-R/CD-RW
–
–
audio
data
–
MP3
fi les that conforms to ISO9660 Level 1/Level 2, or
Joliet (expansion format).
Notes
• MP3 (MPEG 1 Audio Layer-3) is a standard format defi ned
• MP3 (MPEG 1 Audio Layer-3) is a standard format defi ned
by ISO (International Organization for Standardization) which
compresses audio data. MP3 fi les must be in MPEG 1 Audio
Layer-3 format.
compresses audio data. MP3 fi les must be in MPEG 1 Audio
Layer-3 format.
• The system can only play back MP3 fi les that have a fi le
extension of “.mp3”.
NOTE OF REPLACING THE IC304, IC305, IC306 AND
IC902 ON THE MOTHERBOARD BOARD
IC304, IC305 IC306 and IC902 on the MOTHERBOARD
board cannot exchange with single. When these parts on the
MOTHERBOARD board are damaged, exchange the entire
mounted board.
IC902 ON THE MOTHERBOARD BOARD
IC304, IC305 IC306 and IC902 on the MOTHERBOARD
board cannot exchange with single. When these parts on the
MOTHERBOARD board are damaged, exchange the entire
mounted board.
NOTE OF REPLACEMENT OF THE MS-476 BOARD
When the MS-476 board is defective, exchange the entire
LOADING ASSY (T).
When the MS-476 board is defective, exchange the entire
LOADING ASSY (T).
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[
\
/1
] button to turn the power on.
2. Press the [CD] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [OPTIONS] button
for more 5 seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[
\
/1
]
button.
PART No.
Ver. 1.2