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•  HCD-SBT100 is the compact disc receiver in CMT-SBT100.
•  HCD-SBT100B is the compact disc receiver in CMT-SBT100B.
•  HCD-SBT300W is the compact disc receiver in CMT-SBT300W.
•  HCD-SBT300WB is the compact disc receiver in CMT-SBT300WB.

2014J33-1

© 

2014.10

Model Name Using Similar Mechanism

NEW

CD Mechanism Type

CDM90-DVBU202 or 
CDM90-DVBU204

Optical Pick-up Block Name

CMS-S76RFS7G, 
CMS-S76RFS7G1 or 
CMS-S76RFS7GP

20 watts + 20 watts (at 6 ohms, 1 kHz, 1% THD)
HCD-SBT300W/SBT300WB (AEP, UK and Australian models): 
25 watts + 25 watts (at 6 ohms, 1 kHz, 1% THD)
HCD-SBT300WB (Taiwan model): 
15 watts + 15 watts (at 6 ohms, 1 kHz, 1% THD)

50 watts + 50 watts (per channel at 6 ohms, 
1 kHz)

25 watts + 25 watts (per channel at 6 ohms, 
1 kHz)

AUDIO IN (external input) jack:
Stereo mini jack, sensitivity 700 mV, 
impedance 47 kilohms

 (headphone) jack: 

Stereo mini jack, 8 ohms or more

Supported bit rate:

MP3 (MPEG 1 Audio Layer-3): 32 kbps - 320 
kbps, VBR
WMA: 48 kbps - 192 kbps, VBR
AAC: 48 kbps -320 kbps

Sampling frequencies:

MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz

USB port: 

Type A, 5 V DC 2.1 A

Compact disc and digital audio system

Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measurement at a 

distance of 200mm from the objective lens 
surface on the Optical Pick-up Block with 7mm 
aperture.

50 Hz – 20 kHz

* Frequencies are displayed to two decimal 

places on this system.

BLUETOOTH Standard version 3.0

BLUETOOTH Standard Power Class 2

Line of sight approx. 10 m

*1

2.4 GHz band (2.4000 GHz - 2.4835 GHz)

FHSS

A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)

SCMS-T method

20 Hz – 20,000 Hz (with 44.1 kHz sampling)
*

1

such as obstacles between devices, magnetic 
fields around a microwave oven, static 
electricity, reception sensitivity, antenna’s 
performance, operating system, software 
application, etc.

*

2

BLUETOOTH standard profiles indicate the 
purpose of BLUETOOTH communication 
between devices.

RJ-45
10BASE-T/100BASE-TX
(The communication speed may vary 
depending on the communication 
environment. This system does not 

174.928 MHz

5A

176.640 MHz

5B

178.352 MHz

5C

180.064 MHz

5D

181.936 MHz

6A

183.648 MHz

6B

185.360 MHz

6C

187.072 MHz

6D

188.928 MHz

7A

190.640 MHz

7B

192.352 MHz

7C

194.064 MHz

7D

195.936 MHz

8A

197.648 MHz

8B

199.360 MHz

8C

201.072 MHz

8D

202.928 MHz

9A

204.640 MHz

9B

206.352 MHz

9C

208.064 MHz

9D

209.936 MHz

10A

211.648 MHz

10B

213.360 MHz

10C

215.072 MHz

10D

216.928 MHz

11A

218.640 MHz

11B

220.352 MHz

11C

222.064 MHz

11D

223.936 MHz

12A

225.648 MHz

12B

227.360 MHz

12C

229.072 MHz

12D

230.784 MHz

13A

232.496 MHz

13B

234.208 MHz

13C

235.776 MHz

13D

237.488 MHz

13E

239.200 MHz

13F

guarantee the communication speed and 
quality of 10BASE-T/100BASE-TX.)

Compatible standards:

IEEE 802.11 b/g 
Frequency band 2.4 GHz band (2.4000 GHz - 
2.4835 GHz) (AEP, UK and Australian models)
Frequency band 2.4 GHz band (2.412 GHz - 
2.462 GHz) (Taiwan model)
Available channels ch1 to ch13
(AEP, UK and Australian models)
Available channels ch1 to ch11
(Taiwan model)

WPA/WPA2-PSK (AES)
WPA/WPA2-PSK (TKIP)

AC 120 V, 60 Hz

35 watts (HCD-SBT100/SBT100B)
36 watts (HCD-SBT300W/SBT300WB (AEP, UK
and Australian models)
40 watts (HCD-SBT300WB (Taiwan model))

Approx. 290 mm × 106 mm × 221 mm

Approx. 2.7 kg

Design and specifications are subject to 
change without notice.

Amplifier section (North American model)
AUDIO POWER SPECIFICATIONS  
POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION:
(The United States model only)
With 6 ohm loads, both channels driven, from 
120 - 10,000 Hz; rated 20 watts per channel 
minimum RMS power, with no more than 0.7% 
total harmonic distortion from 250 milliwatts to 
rated output.
Power output (rated): 20 watts + 20 watts  
(at 6 ohms, 1 kHz, 1% THD)  

(per channel at 6 ohms, 1 kHz)  

RMS power output (reference): 25 watts + 25 watts

 

 

AC 120 V - 240 V, 50 Hz/60 Hz

AC 110 V, 50 Hz/60 Hz

AC 220 V - 240 V, 50 Hz/60 Hz

More than 90 dB

More than 90 dB

Tuning range:
European models:

531 kHz – 1,602 kHz (with 9 kHz tuning 
interval)

Other models:
530 kHz – 1,710 kHz (with 10 kHz tuning 
interval)
531 kHz – 1,710 kHz (with 9 kHz tuning 
interval)

Korean model:
530 kHz – 1,610 kHz (with 10 kHz tuning 
interval)
531 kHz – 1,602 kHz (with 9 kHz tuning 
interval)

Antenna: 
AM loop antenna

Intermediate frequency:
400 kHz

FM stereo, FM superheterodyne tuner

Tuning range:
87.5 MHz – 108.0 MHz (100 kHz step)
Other models:

Tuning range:
87.5 MHz – 108.0 MHz (50 kHz step)

Antenna: 
FM lead antenna

FM stereo, DAB/FM superheterodyne tuner

Frequency range:
Band-III: 
174.928 (5A) MHz – 239.200 (13F) MHz*

Antenna: 
DAB/FM lead antenna:

* For details, see “DAB/DAB+ frequency table” 
below.

The DAB/DAB+ services are available only in 
countries/regions that support DAB/DAB+ 
services.

The actual range will vary depending on factors 

WEP 64 bit, WEP 128 bit

Photo: HCD-SBT300WB

Note:
Be sure to keep your PC used for service and 
checking of this unit always updated with the 
latest version of your anti-virus software.
In case a virus affected unit was found during 
service, contact your Service Headquarters. 

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

0  SUR  

s

Windows, the Windows logo, and Windows 
Media are either registered trademarks or 
trademarks of Microsoft Corporation in the 
United States and/or other countries.

s

This product is protected by certain intellectual 
property rights of Microsoft Corporation. Use or 
distribution of such technology outside of this 
product is prohibited without a license from 
Microsoft or an authorized Microsoft subsidiary.

s

AirPlay, the AirPlay logo, iPad, iPhone, iPod, 
iPod classic, iPod nano, and iPod touch are 
trademarks of Apple Inc., registered in the U.S. 
and other countries.

s

“

” is a mark of the Wi-Fi Alliance.

s

Wi-Fi®, Wi-Fi Protected Access® and Wi-Fi 
Alliance® are registered marks of the Wi-Fi 
Alliance.

s

Wi-Fi CERTIFIED™, WPA™, WPA2™ and Wi-Fi 
Protected Setup™ are marks of the Wi-Fi 
Alliance.

s

DLNA™, the DLNA Logo and DLNA CERTIFIED™ 
are trademarks, service marks, or certification 
marks of the Digital Living Network Alliance.

s

MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and 
Thomson.

s

The BLUETOOTH® word mark and logos are 
registered trademarks owned by BLUETOOTH 
SIG, Inc. and any use of such marks by Sony 
Corporation is under license. Other trademarks 
and trade names are those of their respective 
owners.

s

The N Mark is a trademark or registered 
trademark of NFC Forum, Inc. in the United 
States and in other countries.

s

Android is a trademark of Google Inc.

s

“Xperia” and “Xperia Tablet” are trademarks of 
Sony Mobile Communications AB.

s

The system names and product names indicated 
in this manual are generally the trademarks or 
registered trademarks of the manufacturer.

™ and ® marks are omitted in this manual.

 .............................................  

3

2-1. Disassembly 

Flow 

...........................................................   9

2-2. Case 

Block 

......................................................................  10

2-3.  Plate (CD) Ornament Block ............................................   10
2-4.  Flexible Flat Cable (19P) (FFC6) 

(HCD-SBT300W/SBT300WB) ......................................   11

2-5.  Tape (Sub Material) ........................................................   12
2-6.  Panel (Front) Block-1 .....................................................   13
2-7.  Panel (Front) Block-2 .....................................................   14
2-8.  Panel (Back) Block .........................................................   14
2-9.  NET Board Block (HCD-SBT300W/SBT300WB) ........   15
2-10.  WiFi Module (WIFI1), NET Board 

(HCD-SBT300W/SBT300WB) ......................................   15

2-11.  2.4GHz Antenna (ANT1), Holder (Antenna) 

(HCD-SBT300W/SBT300WB) ......................................   16

2-12.  Chassis (Main) Block-1 ..................................................   17
2-13.  Chassis (Main) Block-2 ..................................................   18
2-14.  TUNER Board (HCD-SBT100/SBT300W) ...................   19
2-15.  Module (DAB Tuner) (DAB1), DAB Board 

(HCD-SBT100B/SBT300WB) .......................................   19

2-16. MAIN Board ...................................................................   20
2-17.  Power Cord (AC1) ..........................................................   20
2-18. POWER Board ................................................................   21
2-19.  CD Mechanism Deck Block ...........................................   22
2-20. FFC Holder .....................................................................   22
2-21. Optical Pick-up 

(CMS-S76RFS7G/S76RFS7G1/S76RFS7GP) (OP1) ....   23

 ............................................................   24

 ......................................   27

5-1.  Block Diagram - CD Section - ........................................   29
5-2.  Block Diagram - AUDIO Section - .................................   30

5-3. Block 

Diagram 

- PANEL/POWER SUPPLY Section - ............................   31

5-4.  Schematic Diagram - MAIN Section (1/7) - ...................   33
5-5.  Schematic Diagram - MAIN Section (2/7) - ...................   34
5-6.  Schematic Diagram - MAIN Section (3/7) - ...................   35
5-7.  Schematic Diagram - MAIN Section (4/7) - ...................   36
5-8.  Schematic Diagram - MAIN Section (5/7) - ...................   37
5-9.  Schematic Diagram - MAIN Section (6/7) - ...................   38
5-10.  Schematic Diagram - MAIN Section (7/7) - ...................   39
5-11.  Printed Wiring Boards - MAIN Section (1/2) - ..............   40
5-12.  Printed Wiring Board - MAIN Section (2/2) - ................   41
5-13.  Printed Wiring Boards - USB/HP/RELAY Boards - .......   42
5-14.  Schematic Diagram - USB/HP/RELAY Boards - ...........   43
5-15. Printed Wiring Board 

- NET Board (HCD-SBT300W/SBT300WB) - ..............   44

5-16. Schematic Diagram 

- NET Board (HCD-SBT300W/SBT300WB) - ..............   45

5-17.  Printed Wiring Board - FL Board - .................................   46
5-18.  Schematic Diagram - FL Board - ....................................   47
5-19.  Printed Wiring Boards - KEY/ILLUMI Boards - ...........   48
5-20.  Schematic Diagram - KEY/ILLUMI Boards - ...............   49
5-21.  Schematic Diagram - POWER Board - ..........................   50
5-22.  Printed Wiring Board - POWER Board - ........................   51

6-1. Case 

Section 

....................................................................  67

6-2.  Base (CD) Section ..........................................................   68
6-3.  FL Board Section ............................................................   69
6-4.  Panel (Front) Section ......................................................   70
6-5.  Panel (Back) Section .......................................................   71
6-6.  MAIN Board Section ......................................................   72
6-7. Chassis 

Section 

...............................................................  73

6-8.  CD Mechanism Deck Section 

(CDM90-DVBU202/DVBU204) ....................................   74

 ..............................   75

IDENTIFYING  THE  CD  MECHANISM  DECK  BLOCK
The CD mechanism deck block built into this unit changed from CDM90-DVBU202 to CDM90-DVBU204 during production.
If there is a need to identify the CD mechanism deck block, it is possible to do so by checking the label affi xed to the optical pick-up block.

CDM90-DVBU202

CDM90-DVBU204

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

NOTE  OF  REPLACING  THE  TUNER  BOARD
When the TUNER board is defective, replace the complete mount-
ed board.

NOTE  OF  REPLACING  THE  DAB  BOARD
When the DAB board is defective, replace the complete mounted 
board.

NOTE  OF  REPLACING  THE  MS-476  BOARD
When the MS-476 board is defective, replace the CDM90 ASSY 
(Ref. No. CDM1).

NOTE  OF  REPLACING  THE  IC502,  IC902,  IC903  AND  
IC904  ON  THE  MAIN  BOARD
IC502, IC902, IC903 and IC904 on the MAIN board cannot re-
place with single. When these parts are damaged, replace the com-
plete mounted board.

NOTE  OF  REPLACING  THE  CN5002  AND  IC5003  ON  
THE  NET  BOARD
CN5002 and IC5003 on the NET board cannot replace with single. 
When these parts are damaged, replace the complete mounted 
board.

NOTE  OF  REPLACING  THE  IC5008  ON  THE  USB  BOARD
IC5008 on the USB board cannot replace with single. When this 
part is damaged, replace the complete mounted board.

CHECKING  THE  OPERATION  AFTER  REPAIR
After repair completion, connect the “iPod” etc. corresponding to 
this unit, and check the operation of playback (HCD-SBT300W/
SBT300WB only), charge, etc.

NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But perform the operation check 
in the volume state as low as possible.

TEST  DISCS
Use following TEST DISC (for CD) when this unit confi rms the 
operation and checks it.

Part No.

   

Description

3-702-101-01 DISC 

(YEDS-18), 

TEST

4-225-203-01 DISC 

(PATD-012), 

TEST

J-2501-307-A DISC 

(HLX-A1), 

TEST

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of sample disc in the 
shop is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to turn the CD function.
3.  Press two buttons of the [x] and [Z] simultaneously for fi ve 

seconds.

4.  The message “UNLOCKED” is displayed on the fl uorescent 

indicator tube and the disc tray is unlocked.

Note: When “LOCKED” is displayed, the disc tray lock is not released by 

turning power on/off with the [?/1] button.

MODEL  IDENTIFICATION
Distinguish by Part No. on the rear side of a main unit.

HCD-SBT100: AEP model

4-462-108-0[]

HCD-SBT100: US model

4-462-108-1[]

HCD-SBT100: Canadian model

4-462-108-2[]

HCD-SBT100: Australian model

4-462-108-3[]

HCD-SBT100: Korean model

4-462-108-4[]

HCD-SBT100: Russian model

4-462-108-5[]

HCD-SBT100: 
110 – 240V AC area in E model

4-462-108-6[]

HCD-SBT100B: AEP and UK models

4-462-108-7[]

HCD-SBT300W: AEP model

4-463-724-0[]

HCD-SBT300W: Australian model

4-463-724-1[]

HCD-SBT300WB: AEP and UK models

4-463-724-2[]

HCD-SBT300WB: Taiwan model

4-463-724-3[]

HCD-SBT300WB: Australian model

4-463-724-4[]