Sony HCD-SB500W Service Manual ▷ View online
HCD-SB500W
29
29
HCD-SB500W
•
Note for Printed Wiring Boards and Schematic Diagrams
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
B
: B– Line.
•
C
: adjustment for repair.
•
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : DVD PLAY
(
under no-signal conditions.
no mark : DVD PLAY
(
) : SACD PLAY
∗
: Impossible to measure
•
Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
•
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Circled numbers refer to waveforms.
•
Signal path.
F
: AUDIO
L
: VIDEO
E
: Y
a
: CHROMA
q
: R, G, B
r
: COMPONENT VIDEO
d
: TUNER
J
: CD PLAY
c
: DVD PLAY
I
: SACD PLAY
f
: AUX IN
•
Abbreviation
AUS
AUS
: Australian model
HK
: Hong Kong model
KR
: Korean model
RU
: Russian model
SP
: Singapore model
•
Circuit Boards Location
•
Indication of transistor
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
IO board
MAIN board
DIAT SPK board
AMP board
SWITCHING REGULATOR
HP board
PANEL board
REGULATOR board
FL board
MS-128 board
POWER SW board
RF board
LF board
DIAT TRASMIT board
DMB07 board
B
These are omitted.
C
E
Q
DMB07 and AMP boards are multi-layer printed board.
However, the patterns of intermediate layers have not been
included in diagrams.
However, the patterns of intermediate layers have not been
included in diagrams.
HCD-SB500W
30
30
HCD-SB500W
6-6. PRINTED WIRING BOARD – RF Board –
•
See page 29 for Circuit Boards Location.
:Uses unleaded solder.
C023
C028
C040
C037
R004
R005
C038
C022
C020
R016
R003
R018
R014
R012
C027
C041
C010
Q002
Q001
R007
C039
R001
C021
C013
R009
R008
R008
C008
C017
C015
C011
C009
R021
CN003
CN001
CN002
C049
IC003
R033
R034
R047
R046
C050
C052
R091
R024
R025
R023
C029
C026
R026
C024
R027
R017
R015
C042
R013
R019
L002
L001
C003
D002
D001
R022
R020
C031
R011
C006
C005
C034
R006
R028
R029
C036
C032
C035
C033
C004
C012
C025
R010
C002
C030
C018
C016
C014
C019
R035
C001
R041
R031
C051
IC001
1
3
5
4
(COMPONENT SIDE)
RF BOARD
1-684-822-
12
(12)
1-684-822-
12
(12)
(CONDUCTOR SIDE)
RF BOARD
B
E
C
B
E
C
A
DMB07 BOARD
CN501
OPTICAL
TRAVERSE
UNIT
(DBU-1)
1
2
3
4
5
6
7
8
9
10
11
12
13
A
B
C
D
E
F
(Page 32)
HCD-SB500W
31
31
HCD-SB500W
6-7. SCHEMATIC DIAGRAM – RF Board –
•
See page 66 for IC Block Diagram.
•
See page 43 for Waveforms.
9
62
63
64
61
JL005
C011
C039
C038
C040
JL007
C003
R010
R008
R007
IOP1
L002
C004
D002
R006
C001
C010
R004
R003
IOP2
L001
C002
D001
R022
R025
R023
C016
C015
C014
R014
R013
R012
R011
R018
R017
R016
R015
C042
C020
C021
C022
C023
R024
R026
C027
C028
C029
C018
C024
C033
C012
C005
R029
R028
R027
JL002
JL001
C032
C034
C049
C009
C035
CN003
CN001
CN002
C025
C006
C013
R005
R009
R035
R019
R020
C041
R001
Q001
Q002
C008
R041
JL004
C030
C026
C019
C017
IC001
JL003
JL006
R031
C037
R021
C052
C051
C050
R034
C036
R033
R047
R046
IC003
R091
C031
1000p
0.033
0.033
0.1
100
6.3V
470
33
33
10
16V
1SS355TE
-17
470
100
6.3V
1000p
33
33
10
16V
1SS355TE
-17
220
100
820
2200p
2200p
2200p
0
0
0
0
0
0
0
0
180p
22p
22p
22p
22p
0
12k
0.1
0.1
0.01
5600p
0.01
0.1
0.1
22
10V
0
0
0
0.047
0.1
0.1
0.1
0.1
9P
24P
29P
0.1
22
10V
0.1
47k
47k
0
0
0
0.1
100
2SB1132-T100-QR
2SB1132-T100-QR
0.1
1k
0.01
0.1
5600p
2200p
SP3723CAF0PM
100
680p
0
0.1
0.47
3300p
470
0.47
100k
33k
10k
TL343IDBVR
560k
1000p
MIRR
RFP
CD_LD
DVD_LD
SDEN
DATA_RF
CLK_RF
SDEN
DATA_RF
CLK_RF
LDON
A
B
C
D
E
F
TE
FE
TE
FE
PD
RFMON
RFMON
B
A
F
D
C
RFP
E
CD_LD
DVD_LD
PD
FD-
FD+
TD-
TD+
FD+
FD-
TD+
TD-
SLB-
SLB+
SLA-
SLA+
PI/CE
PI/CE
L
D
O
N
M
IR
R
SLA+
SLB+
SLB-
SLA-
B
A
F
RF
GND
VC
VCC
C
D
E
PD
VR
SW
LD GND
DVD LD
CD LD
N.C
FCS+
FCS-
TRK+
TRK-
AGND
RFAC
AGND
AVC
AVC
MIRR
TE
FE
A5V
A5V
SDEN
DATA_RF
CLK_RF
LDON
A3V
RFMON
INLIM
LDSEL
VCC
SPDL+
SPDL-
SLEDA+
SLEDA-
SLEDB+
SLEDB-
TD+
TD-
FD+
FD-
SLEDA+
SLEDB+
SLEDA-
SLEDB-
LED
GND
INLIM
SPDL-
SPDL+
INLIM
INLIM_3V
{LIMIT-SW(A)}
{LIMIT-SW(B)}
{LIMIT-SW(B)}
PI
FOCUS/TRACKING ERROR AMP
CD/DVD/SACD RF AMP,
AUTOMATIC POWER
CONTROL
(FOR DVD)
AUTOMATIC POWER
CONTROL
(FOR CD)
VCC
VEE
AMP
47
µH
47
µH
(Page 34)
The components identified by mark
0
or dotted
line with mark
0
are critical for safety.
Replace only with part number specified.
HCD-SB500W
32
32
HCD-SB500W
6-8. PRINTED WIRING BOARD – DMB07 Board (Component Side) –
•
See page 29 for Circuit Boards Location.
: Uses unleaded solder.
FL703
CN101
R718
R769
C717
R767
C777
C778 C779
C780
R975
CN901
FL702
R908
C733
R765
R764
R763
R762
C702
R250
R215
C705
IC906
IC904
IC902
C706
C708
C711
FL204
C712
R927
R931
C917
C916
C915
C914
C907
C715
C716
C533
C556
C561
R751
C588
X902
C771
C773
C774
C701
FL701
IC701
C259
C258
R601
R788
R707
R708
R217
R916
R709
R710
R984
IC232
IC231
R284
R283
R277
R276
R275
R274
R273
R269
R917
R15
R505
R267
R266
R265
R264
R14
R988
R254
R13
R994
R995
R997
R998
R571
R711
R234
R712
R231
R230
C781
R552
R548
C213
C215
R714
R978
R716
IC207
FL205
D202
CN105
R717
R719
FL206
C502
R907
R906
R905
C552
C201
C517
C518
R921
R922
R923
C522
L501
R928
R929
C526
C528
C101
C151
C531
C534
C535
C543
C544
C545
C548
C551
IC211
C558
C559
C560
C563
C565
C567
C568
C569
C573
C590
FL101
C901
C902
C924
C903
C904
C905
C926
C927
R962
C592
R747
FB105
C202
R748
CN501
D901
FL501
FL502
FL901
IC503
IC509
IC901
R758
L103
R760
R504
C266
C265
C263
R506
R510
R511
R523
C261
R599
R593
C253
C252
R588
R586
R584
C925
C392
C248
R940
R942
R572
R943
R568
R567
C246
R566
R565
R564
R563
R562
CN102
R561
R560
R559
R558
C245
C242
C241
C239
R970
C227
R551
R550
C214
R545
R536
C547
R213
C283
C279
C278
C277
C291
X901
R299
R263
CN107
FL352
C366
C352
C355
C356
C357
C364
CN106
R936
R939
C532
C530
R958
C860
C896
C822
C855
C823
C825
C845
C846
C847
C850
FL814
FL816
C824
R823
C897
C820
FL811
C895
C858
IC803
R803
FL810
IC801
C866
C843
C840
R870
C854
C837
C819
R871
C804
R830
C842
C849
R16
C867
R296
IC259
IC258
IC256
C287
C286
C284
R327
R197
R198
Q201
R202
R268
R226
R225
R903
R963
R9985
R9984
R9983
R9982
1
10
20
11
1
10
20
11
1
44
132
133
176
88
45
89
1
1
1
8
16
9
4
8
5
3
5
4
1
52
156
105
104
157
53
208
1
(FOR CHECK)
7
1
1
3
2
1
3
2
20
21
40
80
61
60
41
1
2
15
14
1
25
76
76
100
50
26
51
1
4
8
5
(COMPONENT SIDE)
DMB07 BOARD
1-861-848-
12
9
8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
A
B
C
D
E
F
G
H
I
J
D
IO
BOARD
CN203
C
MAIN
BOARD
CN507
E
MAIN BOARD
CN506
A
RF BOARD
CN002
G
IO BOARD
CN202
F
MAIN BOARD
CN505
1
2
1
2
5
4
1
9
2
8
132
133
89
1
176
88
45
44
E
1
1
10
20
1
10
20
11
11
10
20
11
(Page 56)
(Page 44)
(Page 56)
(Page 44)
(Page 30)
(Page 57)
Ref. No. Location
Ref. No. Location
D202
F-9
D901
H-4
IC207
D-13
IC211
F-9
•
Semiconductor Location
Ref. No. Location
Ref. No. Location
Ref. No. Location
IC231
I-14
IC232
I-14
IC256
D-11
IC258
D-11
IC259
C-11
IC503
G-8
IC509
G-9
IC701
H-12
IC801
D-9
IC803
E-6
IC901
G-5
IC902
F-12
IC904
F-12
IC906
F-11
Q201
B-11
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