Sony HCD-RV555 / MHC-RV555 Service Manual ▷ View online
29
HCD-R555
6-5. CIRCUIT BOARDS LOCATION
MOTOR (LD) board
SW board
SENSOR board
BD board
MOTOR (TB) board
DRIVER board
VCD CONNECT board
SUB TRANSFORMER board
AMP board
VIDEO OUT board
MICROPHONE JACK board
PANEL board
6 STREAM LED board
H/P JACK board
MAIN board
TRANSFORMER board
REM board
VMP board
30
HCD-R555
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
2
: nonflammable resistor.
•
C
: panel designation.
Note on Printed Wiring Board:
•
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– BD Board –
– BD Board –
no mark : CD PLAY
– VMP Board –
no mark : VIDEO CD PLAY
∗
: Impossible to measure
– Other Sections –
no mark : TUNER
(
) : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER
J
: CD PLAY (AUDIO)
E
: TAPE PLAY (DECK-A)
d
: TAPE PLAY (DECK-B)
G
: REC
f
: AUX
L
: CD PLAY (VIDEO)
N
: MIC
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
31
31
HCD-RV555
HCD-RV555
• Waveforms
— BD Board —
800 mVp-p
200 mV/DIV, 500 ns/DIV
1
IC103
qg
(RFAC)
(CD Play Mode)
100 mV/DIV, 1
µ
s/DIV
2
IC103
qh
(FE)
(CD Play Mode)
200 mV/DIV, 500 ns/DIV
3
IC103
qk
(TE)
(CD Play Mode)
Approx.
280 mVp-p
280 mVp-p
Approx.
740 mVp-p
740 mVp-p
— VMP Board —
1 V/DIV, 200 ns/DIV
1
IC504
1
(BCK)
1 V/DIV, 10
µ
s/DIV
2
IC504
3
(LRCK)
1 V/DIV, 20 ns/DIV
3
IC504
qh
(MCLK)
(CD Play Mode)
500 mV/DIV, 20
µ
s/DIV
4
IC307
6
(BUFOUT)
(VCD Play Mode) (Color Bar)
1 V/DIV, 10
µ
s/DIV
5
IC505
ij
(L CDLRCK),
ik
(LRCK)
1 V/DIV, 200 ns/DIV
6
IC505
os
(L CDBCK),
od
(BCK)
500 mV/DIV, 5
µ
s/DIV
7
IC505
<zcc
(MDP)
(CD Play Mode)
1 V/DIV, 20 ns/DIV
8
IC505
<zb/
(XTAO)
200 mV/DIV, 500 ns/DIV
9
IC505
<zn/
(RFDC)
(CD Play Mode)
200 mV/DIV, 500 ns/DIV
0
IC505
<znx
(TE)
(CD Play Mode)
100 mV/DIV, 1
µ
s/DIV
qa
IC505
<znv
(FE)
(CD Play Mode)
500 mV/DIV, 500 ns/DIV
qs
IC505
<zmc
(RFAC)
(CD Play Mode)
1 V/DIV, 200 ns/DIV
qd
IC505
<x/c
(AUDBCK)
1 V/DIV, 10
µ
s/DIV
qf
IC505
<x/v
(AUDLRCK)
1 V/DIV, 20 ns/DIV
qg
IC505
<x/b
(AUDXCLKO)
1 V/DIV, 20 ns/DIV
qh
IC505
<x/m
(CLKB)
200 mV/DIV, 20
µ
s/DIV
qj
IC505
6
(CPSIG)
(VCD Play Mode) (Color Bar)
474 ns
3.3 Vp-p
22.7
µ
s
2.7 Vp-p
59.5 ns
3.4 Vp-p
474 ns
3.3 Vp-p
22.7
µ
s
2.7 Vp-p
59.5 ns
3.4 Vp-p
H
580 mVp-p
H
2.1 Vp-p
22.7
µ
s
2.7 Vp-p
474 ns
3.3 Vp-p
7.6
µ
s
Approx.
1.5 Vp-p
1.5 Vp-p
29.5 ns
3.3 Vp-p
Approx.
350 mVp-p
350 mVp-p
Approx.
250 mVp-p
250 mVp-p
0.75
±
0.1 Vp-p
1.05
±
0.3 Vp-p
37 ns
2.9 Vp-p
1 V/DIV, 10
µ
s/DIV
1
IC601
qd
(I-XT2)
1 V/DIV, 0.1
µ
s/DIV
2
IC601
qh
(CF2)
30.5
µ
s
3.2 Vp-p
1
µ
s
3.2 Vp-p
— PANEL Board —
32
32
HCD-RV555
HCD-RV555
6-6. PRINTED WIRING BOARD — CD MECHANISM SECTION (1/2) —
• Refer to page 29 for Circuit Boards Location.
: Uses unleaded solder.
1
A
B
C
D
E
F
G
H
I
2
3
4
5
6
7
8
9
10
11
12
13
14
C117
C109
C114
Q101
C108
R131
C119
R123
C113
R124
R122
R132
R133
C150
R234
C118
C121
C111
C112
C120
C115
C151
FB111
IC150
R104
C102
R101
R120
C104
Q102
R126
R156
R153
R152
R113
R109
R103
R105
R105
R111
C101
D101
CN101
R118
C103
C110
R125
R151
R155
C158
R114
C152
R102
JW102
R220
R115
CN102
C107
IC103
R119
C213
M101
M102
S101
A
(Page 37)
D101
H-12
IC103
G-10
IC150
D-9
Q101
F-5
Q102
F-11
• Semiconductor
Location
Ref. No.
Location
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